Product Specifications
The XC3SD1800A-4FG676I features comprehensive specifications that meet rigorous performance requirements:
Core Architecture:
- Device Family: Spartan-3A DSP
- Logic Cells: 1,800,000 system gates
- CLB Array: 84 x 94 configurable logic blocks
- Total Block RAM: 1,728 Kbits
- Distributed RAM: 259 Kbits
DSP Resources:
- DSP48A Slices: 84 dedicated multipliers
- Maximum DSP Performance: Up to 250 MHz
- Multiply-Accumulate Operations: High-speed MAC units
- Digital Signal Processing: Optimized for filtering, FFT, and arithmetic functions
Package Details:
- Package Type: Fine-pitch Ball Grid Array (FBGA)
- Pin Count: 676 pins
- Package Size: 27mm x 27mm
- Ball Pitch: 1.0mm
- Speed Grade: -4 (high performance)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
I/O Specifications:
- User I/O Pins: 519 maximum
- I/O Standards: Support for LVCMOS, LVTTL, SSTL, HSTL
- Differential I/O Pairs: High-speed serial interfaces
- Clock Management: Up to 8 Digital Clock Managers (DCMs)
Price Information
The XC3SD1800A-4FG676I pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities. The XC3SD1800A-4FG676I offers excellent value for applications requiring high DSP performance and substantial logic resources.
Documents & Media
Technical Documentation:
- Product Data Sheet: Complete electrical and timing specifications
- User Guide: Detailed implementation guidelines and best practices
- Application Notes: Design examples and optimization techniques
- Package Information: Mechanical drawings and land patterns
- Migration Guide: Upgrade paths from previous generations
Development Resources:
- Reference Designs: Pre-verified IP cores and design examples
- Evaluation Boards: Development platforms for rapid prototyping
- Software Tools: ISE Design Suite and Vivado compatibility
- Simulation Models: VHDL and Verilog behavioral models
Quality Documentation:
- Reliability Reports: MTBF and qualification data
- Quality Certifications: ISO compliance and manufacturing standards
- Test Reports: Production test coverage and yield information
Related Resources
Compatible Development Tools:
- Xilinx ISE Design Suite: Complete design environment
- Vivado Design Suite: Next-generation development platform
- ChipScope Pro: Real-time debugging and analysis
- System Generator: MATLAB/Simulink integration
IP Core Library:
- DSP IP Cores: FIR filters, FFT processors, and arithmetic functions
- Interface IP: PCIe, Ethernet, and memory controllers
- Video Processing: Image enhancement and compression algorithms
- Communication IP: Modulation, demodulation, and protocol stacks
Hardware Ecosystem:
- Evaluation Boards: Spartan-3A DSP development platforms
- Reference Designs: Proven implementations for common applications
- Third-Party Solutions: Compatible modules and expansion boards
- Design Services: Professional implementation and optimization support
Application Areas:
- Digital Signal Processing: Real-time filtering and transformation
- Telecommunications: Base station and network infrastructure
- Industrial Control: Motor control and process automation
- Medical Equipment: Imaging and diagnostic systems
- Aerospace & Defense: Radar and communication systems
Environmental & Export Classifications
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Responsible sourcing certification
- Green Package: Environmentally friendly materials and processes
Operating Conditions:
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
Export Classifications:
- ECCN Classification: Controlled under Export Administration Regulations
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufactured in certified facilities
- Export License: May require authorization for certain destinations
Quality Standards:
- Automotive Qualified: AEC-Q100 compliant versions available
- Military Temperature: Extended temperature range options
- Quality Management: ISO 9001 certified manufacturing
- Reliability Testing: Comprehensive qualification and monitoring
The XC3SD1800A-4FG676I represents Xilinx’s commitment to delivering high-performance FPGA solutions that enable innovative designs across multiple industries. Its combination of substantial logic resources, dedicated DSP capabilities, and comprehensive development ecosystem makes it an excellent choice for demanding signal processing applications requiring both performance and flexibility.
