Product Overview
The XC3S1200E-4FTG256CS1 is a high-performance Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx) Spartan-3E family, designed for cost-sensitive consumer electronics applications. This FPGA delivers exceptional value by combining advanced 90nm CMOS process technology with robust functionality, making it ideal for high-volume applications requiring programmable logic solutions.
1. Product Specifications
Core Architecture
- Family: Spartan-3E FPGA
- Logic Gates: 1.2 million system gates
- Logic Cells: 19,512 cells
- Maximum Frequency: 572 MHz
- Process Technology: 90nm CMOS
- Supply Voltage: 1.2V core voltage
Memory Specifications
- Block RAM: 2,168 blocks (136 Kbits total)
- Distributed RAM: 8,672 bits
- Total RAM: 504 Kbits
I/O Capabilities
- Total I/O Pins: 190 user I/O pins
- Input-Only Pins: 40 dedicated input pins
- Differential Pairs: 77 differential pairs
- Supported Standards:
- 18 single-ended signal standards
- 8 differential signal standards (including LVDS, RSDS)
- DDR (Double Data Rate) support
Package Details
- Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA)
- Package Code: FTG256
- Speed Grade: -4 (commercial temperature range)
- Lead-Free: RoHS compliant
- Part Marking: CS1 suffix indicates specific lot/date code
Clock Management
- Digital Clock Managers (DCMs): 4 DCMs per device
- Global Clock Networks: 8 global clocks per half-device
- Additional Clocks: 8 additional clocks per half-device
- Features: Clock skew elimination, frequency synthesis, high-resolution phase shifting
Dedicated Multipliers
- 18×18 Multipliers: 28 dedicated multipliers
- DSP Performance: Optimized for digital signal processing applications
2. Pricing Information
Current Market Pricing
The XC3S1200E-4FTG256CS1 is available through authorized distributors with competitive pricing based on quantity:
- Small Quantities (1-99 units): $69-$240 per unit
- Volume Pricing (100+ units): Contact distributors for volume discounts
- Long-term Supply: Available through AMD’s authorized distribution network
Price Factors
- Market demand and silicon availability
- Package type and speed grade
- Order quantity and delivery requirements
- Regional pricing variations
Note: Prices fluctuate based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Primary Datasheet: Spartan-3E FPGA Family Data Sheet (DS312)
- User Guides: Spartan-3E FPGA User Guide
- Package Information: 256-pin FTBGA package specifications
- Pin Assignment: Complete pinout and signal descriptions
Design Resources
- Development Tools: AMD Vivado Design Suite (recommended)
- Legacy Support: ISE Design Suite compatibility
- IP Cores: Extensive library of verified IP cores
- Reference Designs: Application-specific reference implementations
Application Notes
- Power Management: Power consumption optimization guidelines
- PCB Design: Layout recommendations for FTBGA packages
- Signal Integrity: High-speed design considerations
- Thermal Management: Package thermal characteristics and cooling guidelines
4. Related Resources
Development Platforms
- Evaluation Boards: Spartan-3E Starter Kits
- Third-party Boards: Compatible with various FPGA development platforms
- Educational Resources: University program support materials
Software Tools
- Vivado Design Suite: Current AMD development environment
- Programming Tools: iMPACT, Vivado Hardware Manager
- Simulation: ModelSim, Vivado Simulator support
- Debug Tools: ChipScope Pro, Vivado Logic Analyzer
Companion Devices
- Configuration Memory: Compatible PROM and Flash devices
- Power Solutions: Recommended voltage regulators and power management ICs
- Oscillators: Clock generation solutions
Technical Support
- Online Forums: AMD Developer Community
- Application Support: Technical assistance through authorized distributors
- Training: Webinars and technical workshops
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS compliant (lead-free)
- REACH Compliance: Meets EU REACH regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC
- Industrial Options: Extended temperature variants available
- Humidity: Non-condensing environments
- Altitude: Standard atmospheric pressure operation
Export Classifications
- ECCN Code: EAR99 (Export Administration Regulations)
- HTS Code: 8542.39.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufacturing location dependent
- Export Restrictions: Standard semiconductor export controls apply
Quality Standards
- ISO Certifications: Manufactured under ISO 9001 quality standards
- Reliability Testing: Automotive-grade reliability testing available
- Qualification: JEDEC standard qualification procedures
- Traceability: Full lot traceability and quality documentation
Packaging & Shipping
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Protection: Standard ESD precautions required
- Storage: Controlled temperature and humidity storage recommended
- Shipping: Anti-static packaging and handling procedures
Key Applications
The XC3S1200E-4FTG256CS1 is optimized for:
- Consumer Electronics: Set-top boxes, digital cameras, gaming devices
- Communications: Network infrastructure, protocol processing
- Industrial Control: Motor control, sensor interfacing, data acquisition
- Automotive: Infotainment systems, driver assistance applications
- Medical Devices: Portable medical equipment, diagnostic systems
This FPGA provides an excellent balance of performance, power efficiency, and cost-effectiveness for applications requiring programmable logic solutions with moderate complexity and high integration requirements.
