The XC3S1600E-4FG484I is a powerful Spartan-3E series field-programmable gate array (FPGA) from Xilinx, designed to deliver exceptional performance for demanding digital applications. This advanced FPGA combines high logic density with cost-effective implementation, making it an ideal choice for engineers developing complex digital systems across telecommunications, automotive, industrial, and consumer electronics sectors.
Product Specifications
The XC3S1600E-4FG484I features impressive technical specifications that set it apart in the FPGA marketplace. This device incorporates 1,600,000 system gates with 33,192 logic cells, providing substantial processing capability for complex digital designs. The FPGA includes 648 Kbits of distributed RAM and 648 Kbits of block RAM, offering flexible memory options for various application requirements.
Key specifications of the XC3S1600E-4FG484I include a 484-pin Fine-Pitch Ball Grid Array (FBGA) package configuration, operating across a commercial temperature range of 0ยฐC to +85ยฐC. The device supports multiple I/O standards including LVTTL, LVCMOS, SSTL, and HSTL, ensuring compatibility with diverse system architectures. With a maximum operating frequency exceeding 200 MHz, the XC3S1600E-4FG484I delivers high-speed performance for time-critical applications.
The integrated Digital Clock Manager (DCM) provides advanced clock management capabilities, supporting clock synthesis, phase shifting, and frequency multiplication. This FPGA also features dedicated multipliers and built-in memory controllers, enhancing its suitability for digital signal processing and data-intensive applications.
Price
Pricing for the XC3S1600E-4FG484I varies based on quantity, supplier, and market conditions. Typical pricing ranges from $150 to $300 per unit for standard commercial quantities, with volume discounts available for larger orders. Educational institutions and qualified development programs may access special pricing tiers.
Factors affecting XC3S1600E-4FG484I pricing include current market demand, inventory levels, and regional distribution costs. For the most current pricing information, engineers should consult authorized Xilinx distributors or electronic component suppliers who can provide real-time quotes based on specific quantity requirements and delivery schedules.
Documents & Media
Comprehensive documentation supports the XC3S1600E-4FG484I implementation process. The primary datasheet provides detailed electrical characteristics, timing specifications, and package information essential for design integration. This document includes AC and DC parameters, power consumption data, and recommended operating conditions.
The Spartan-3E User Guide offers extensive implementation guidance, covering configuration options, I/O planning, and design optimization techniques. Additional resources include application notes addressing specific use cases such as high-speed digital signal processing, memory interfacing, and power management strategies.
Development software documentation includes ISE Design Suite tutorials and reference materials, enabling engineers to efficiently implement designs using the XC3S1600E-4FG484I. PCB layout guidelines and thermal management recommendations ensure optimal performance in production environments.
Related Resources
The XC3S1600E-4FG484I integrates seamlessly with Xilinx’s comprehensive development ecosystem. The ISE Design Suite provides complete design entry, synthesis, and implementation tools specifically optimized for Spartan-3E devices. This software environment includes ModelSim simulation capabilities and ChipScope Pro for in-system debugging.
Development boards featuring the XC3S1600E-4FG484I enable rapid prototyping and evaluation. These platforms typically include essential peripherals, memory interfaces, and expansion connectors for comprehensive system development. Reference designs demonstrate best practices for common applications including communications protocols, motor control, and image processing.
Third-party IP cores extend the XC3S1600E-4FG484I functionality across specialized applications. Available cores include USB controllers, Ethernet MAC implementations, and advanced DSP functions, accelerating time-to-market for complex designs.
Environmental & Export Classifications
The XC3S1600E-4FG484I meets stringent environmental standards required for commercial and industrial applications. RoHS compliance ensures lead-free manufacturing processes, supporting environmentally responsible product development. The device qualifies for commercial temperature grade operation, suitable for most standard operating environments.
Export classification for the XC3S1600E-4FG484I follows standard semiconductor regulations, with specific classifications varying by destination country and end-use application. Standard commercial applications typically require no special export licensing, while certain military or aerospace applications may require additional documentation.
Environmental stress testing validates the XC3S1600E-4FG484I reliability across temperature cycling, humidity exposure, and mechanical shock conditions. These qualifications ensure consistent performance throughout the product lifecycle in demanding operational environments.
The device packaging utilizes halogen-free materials where applicable, supporting green manufacturing initiatives and reducing environmental impact during production and disposal phases.
