The XC3S1600E-4FGG484I is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-3E family, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This advanced FPGA combines high logic density with cost-effective implementation, making it an ideal choice for engineers developing complex digital designs.
Product Specifications
The XC3S1600E-4FGG484I features robust technical specifications that enable versatile application development:
Core Architecture:
- Logic Cells: 33,192 equivalent gates providing extensive design flexibility
- System Gates: 1.6 million gates for comprehensive digital processing capabilities
- Distributed RAM: 231 Kb for efficient data storage and buffering
- Block RAM: 648 Kb organized in 36 dedicated memory blocks
I/O and Package Details:
- Package Type: FGG484 Fine-pitch Ball Grid Array
- Total I/O Pins: 376 user-configurable input/output pins
- Speed Grade: -4 for high-performance applications
- Operating Temperature: Industrial grade (-40ยฐC to +100ยฐC)
Performance Characteristics:
- Maximum operating frequency up to 300 MHz
- Low power consumption with multiple power management modes
- Integrated clock management with up to 8 Digital Clock Managers (DCMs)
- Built-in multipliers for efficient DSP operations
Memory Architecture: The XC3S1600E-4FGG484I incorporates dual-port block RAM that can be configured as single-port RAM, dual-port RAM, or FIFO memory, providing designers with flexible memory implementation options.
Price Information
Pricing for the XC3S1600E-4FGG484I varies based on quantity, supplier, and current market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities, making this FPGA cost-effective for both prototyping and mass production applications.
Documents & Media
Technical Documentation:
- Complete datasheet with electrical characteristics and timing specifications
- User guide detailing implementation best practices
- Package and pinout information for PCB design
- Programming and configuration guidelines
Development Resources:
- ISE Design Suite compatibility for seamless development workflow
- Reference designs and application notes
- Timing and power analysis tools
- Simulation models for accurate pre-implementation verification
Application Notes:
- Digital signal processing implementation guides
- Interface design recommendations
- Clock domain crossing techniques
- Power optimization strategies
Related Resources
Development Tools:
- Xilinx ISE Design Suite for comprehensive FPGA development
- ChipScope Pro for real-time debugging and analysis
- ModelSim simulation software for thorough design verification
- Impact programming tool for device configuration
Complementary Products:
- XC3S1600E variants in different packages and speed grades
- Compatible Spartan-3E family devices for scalable designs
- Development boards featuring the XC3S1600E-4FGG484I
- Programming cables and configuration devices
Support Resources:
- Xilinx technical support and community forums
- Training materials and webinars
- Design methodology guides
- Third-party IP cores and reference designs
Environmental & Export Classifications
Environmental Compliance: The XC3S1600E-4FGG484I meets stringent environmental standards including RoHS compliance for lead-free manufacturing processes. The device operates reliably across industrial temperature ranges and maintains performance under various environmental conditions.
Export Classification:
- ECCN (Export Control Classification Number): 3A001.a.2
- HTS (Harmonized Tariff Schedule): 8542.39.0001
- Country of Origin: Various (consult specific part marking)
Quality Standards:
- ISO 9001 certified manufacturing processes
- Automotive-grade variants available for mission-critical applications
- Extended temperature range options for harsh environment deployment
- Long-term availability commitment for production designs
Environmental Operating Conditions:
- Operating temperature: -40ยฐC to +100ยฐC (industrial grade)
- Storage temperature: -65ยฐC to +150ยฐC
- Humidity tolerance: Up to 95% non-condensing
- Shock and vibration resistance per industry standards
The XC3S1600E-4FGG484I represents an excellent balance of performance, features, and cost-effectiveness for modern FPGA applications, making it a preferred choice for engineers developing sophisticated digital systems across telecommunications, industrial automation, medical devices, and consumer electronics markets.
