The XC3S250E-5FTG256C is a versatile and cost-effective FPGA (Field-Programmable Gate Array) from Xilinx’s renowned Spartan-3E family. This programmable logic device delivers exceptional performance for embedded applications, digital signal processing, and system integration projects requiring reliable, high-speed processing capabilities.
Product Specifications
The XC3S250E-5FTG256C features robust technical specifications designed for demanding applications:
Core Architecture:
- Logic Cells: 250,000 system gates
- Configurable Logic Blocks (CLBs): 1,164 slices
- Block RAM: 216 Kbits total embedded memory
- Distributed RAM: 73 Kbits
- Digital Clock Manager (DCM): 4 units for precise clock management
I/O and Package Details:
- Package Type: FTG256 (Fine-Pitch Ball Grid Array)
- Total I/O Pins: 172 user I/O pins
- Speed Grade: -5 (high-performance grade)
- Operating Voltage: 1.2V core, 3.3V I/O
- Package Size: 17mm x 17mm
Performance Characteristics:
- Maximum System Clock: Up to 326 MHz
- Low power consumption with multiple power management modes
- Support for LVDS, SSTL, and HSTL I/O standards
- Built-in configuration memory interface
Price Information
The XC3S250E-5FTG256C offers competitive pricing in the mid-range FPGA market segment. Pricing varies based on quantity, distribution channel, and current market conditions. For accurate pricing information on the XC3S250E-5FTG256C, contact authorized Xilinx distributors or electronic component suppliers. Volume discounts are typically available for production quantities.
Documents & Media
Essential documentation for the XC3S250E-5FTG256C includes:
Technical Documentation:
- Official datasheet with complete electrical specifications
- Spartan-3E FPGA Family User Guide
- Package and pinout diagrams for FTG256 configuration
- DC and switching characteristics specifications
- Design guidelines and application notes
Development Resources:
- ISE Design Suite compatibility information
- Reference designs and example projects
- Programming and configuration guides
- Timing analysis documentation
Support Materials:
- PCB layout guidelines for XC3S250E-5FTG256C integration
- Thermal management recommendations
- Power supply design considerations
Related Resources
The XC3S250E-5FTG256C ecosystem includes comprehensive development and support resources:
Development Tools:
- Xilinx ISE Design Suite for FPGA programming
- ChipScope Pro for debugging and analysis
- EDK (Embedded Development Kit) compatibility
- Third-party synthesis and simulation tools
Compatible Products:
- Other Spartan-3E family variants for scalable solutions
- Xilinx development boards featuring XC3S250E-5FTG256C
- Programming cables and configuration devices
- Evaluation and starter kits
Application Areas:
- Industrial automation and control systems
- Communications infrastructure equipment
- Medical device implementations
- Automotive electronics applications
- Consumer electronics with custom logic requirements
Environmental & Export Classifications
The XC3S250E-5FTG256C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS (Restriction of Hazardous Substances) compliant
- Operating temperature range: -40ยฐC to +85ยฐC (commercial grade)
- Storage temperature: -65ยฐC to +125ยฐC
- Humidity tolerance: 5% to 95% non-condensing
Quality Standards:
- Manufactured in ISO 9001 certified facilities
- Automotive qualification available (contact manufacturer)
- JEDEC standard compliance for reliability testing
- Moisture sensitivity level classification
Export and Trade Information:
- Export Control Classification Number (ECCN) as per US regulations
- Country of origin marking compliance
- Trade compliance documentation available
- Conflict minerals reporting compliance
The XC3S250E-5FTG256C represents an ideal balance of performance, cost-effectiveness, and design flexibility for engineers developing next-generation electronic systems. Its proven Spartan-3E architecture, combined with comprehensive development tool support, makes the XC3S250E-5FTG256C an excellent choice for both prototype development and volume production applications.
