1. Product Specifications
Core Features of XC3SD3400A-4FGG676I
Logic and Memory Specifications:
- System Gates: 3.4 Million gates
- Logic Cells: 53,712 cells
- Block RAM: Enhanced block RAM with output registers
- Operating Frequency: Up to 667MHz maximum clock speed
- Technology Node: Advanced 90nm CMOS process technology
- Supply Voltage: 1.2V core voltage
Package and I/O Details:
- Package Type: 676-pin Fine-Pitch Ball Grid Array (FBGA)
- Package Code: FGG676
- I/O Pins: 469 user I/O pins
- Speed Grade: -4 (standard speed grade)
- Operating Temperature: Industrial temperature range
Enhanced DSP Features:
- XtremeDSP DSP48A Slices: Integrated high-performance DSP blocks
- Memory per Logic Ratio: Optimized for DSP applications
- DSP Performance: 250MHz operation in -4 speed grade
- Arithmetic Functions: Hardware multipliers and accumulators
The XC3SD3400A-4FGG676I incorporates Xilinx’s proven 90nm manufacturing technology, ensuring reliable performance while maintaining cost-effectiveness for volume production applications.
2. Price Information
Current Market Pricing for XC3SD3400A-4FGG676I
Pricing Structure:
- Unit Price: Request for Quote (RFQ) – varies by quantity and supplier
- Volume Pricing: Quantity breaks available: 40+ units at $358.81, 80+ units at $332.81, 160+ units at $280.81
- Minimum Order: Typically 1 piece for small quantities
- Lead Time: 3-5 business days for standard orders
Cost Considerations: The XC3SD3400A-4FGG676I offers superior price-performance ratio compared to traditional ASICs, eliminating high initial costs and lengthy development cycles. Volume discounts are available for production quantities, making it economical for both prototyping and mass production.
Availability Status:
- Multiple distributors maintain stock levels
- Global shipping available through authorized channels
- Express delivery options (DHL, FedEx, UPS) for urgent requirements
3. Documents & Media
Technical Documentation for XC3SD3400A-4FGG676I
Primary Documentation:
- Datasheet: Complete electrical specifications and timing parameters
- User Guide: Implementation guidelines and design recommendations
- Package Information: Detailed pinout diagrams and mechanical drawings
- Application Notes: DSP implementation examples and best practices
Design Resources:
- Development Tools: Vivado Design Suite compatibility
- Reference Designs: Pre-verified IP cores and example projects
- Simulation Models: SPICE and IBIS models for signal integrity analysis
- Programming Files: Configuration bitstream examples
Software Support:
- Vivado Design Suite: Primary development environment
- ISE Design Tools: Legacy tool support for existing designs
- IP Catalog: Extensive library of verified IP blocks
- Documentation Portal: Online access to latest technical updates
Multimedia Resources
Visual Documentation:
- High-resolution package photographs
- Pin assignment diagrams
- Block diagram illustrations
- Application circuit examples
4. Related Resources
Development Ecosystem for XC3SD3400A-4FGG676I
Compatible Development Boards:
- Spartan-3A DSP Starter Kit
- Third-party evaluation platforms
- Custom development boards from certified partners
Related FPGA Products:
- XC3SD1800A: Lower-density option in same family
- XC3S400A-4FG676I: Alternative Spartan-3A variant
- Spartan-6 LX45: Next-generation upgrade path
Design Services:
- Xilinx Alliance Program partners
- Certified design consultants
- Training and certification programs
- Technical support channels
Application Markets: The XC3SD3400A-4FGG676I excels in diverse applications including:
- Consumer Electronics: Digital TV, home networking, display systems
- Communications: Broadband access equipment, wireless infrastructure
- Industrial Automation: Motor control, process monitoring
- Medical Devices: Signal processing, imaging systems
- Automotive: Advanced driver assistance systems (ADAS)
Technical Support Resources
Online Communities:
- Xilinx Developer Forums
- Design methodology documentation
- Video tutorials and webinars
- Customer application notes
Professional Support:
- Field Application Engineers (FAEs)
- Technical hotline support
- Design review services
- Migration assistance programs
5. Environmental & Export Classifications
Environmental Compliance for XC3SD3400A-4FGG676I
RoHS Compliance:
- RoHS Status: Fully compliant with RoHS directive
- Lead-Free Manufacturing: Uses lead-free solder and materials
- Environmental Certification: Meets international environmental standards
- Packaging: Anti-static, environmentally responsible packaging
Operating Conditions:
- Operating Temperature Range: -40ยฐC to +85ยฐC (industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity Tolerance: Up to 85% relative humidity
- Altitude Operation: Up to 3000 meters above sea level
Export and Trade Classifications
Export Control Information:
- ECCN Classification: Check current export control listings
- Country of Origin: Manufactured in certified facilities
- Trade Compliance: Adheres to international trade regulations
- Documentation: Certificate of origin available upon request
Quality Certifications:
- ISO 9001: Manufacturing quality management
- AS9100: Aerospace quality standards (where applicable)
- Automotive Standards: AEC-Q100 qualified variants available
- Medical Compliance: IEC 60601 compatibility for medical applications
Reliability and Lifecycle
Product Lifecycle:
- Availability: Long-term supply commitment
- Obsolescence: Minimum 7-year availability from introduction
- Migration Path: Clear upgrade options within Xilinx families
- Support Duration: Extended support throughout product lifecycle
Reliability Specifications:
- MTBF: Mean Time Between Failures exceeds industry standards
- Quality Level: Automotive and industrial quality grades available
- Testing Standards: Comprehensive ATE testing before shipment
- Traceability: Full lot traceability and quality records
Ready to implement your next DSP design with the XC3SD3400A-4FGG676I? Contact authorized distributors for current pricing, technical support, and development resources. Experience the proven performance and reliability that has made Xilinx Spartan FPGAs the industry standard for cost-effective programmable logic solutions.
Keywords: XC3SD3400A-4FGG676I, Xilinx FPGA, Spartan-3A DSP, field programmable gate array, DSP processing, 676-pin FBGA, 3.4M gates, programmable logic
