The XC3S1400AN-FG676 represents a cutting-edge field-programmable gate array (FPGA) from Xilinx’s acclaimed Spartan-3AN family, delivering exceptional performance and versatility for demanding embedded applications. This advanced FPGA combines robust processing capabilities with integrated non-volatile memory, making it an ideal choice for industrial, automotive, and consumer electronics applications.
Product Specifications
The XC3S1400AN-FG676 features comprehensive specifications designed to meet rigorous performance requirements:
Core Architecture:
- Device Family: Spartan-3AN
- Logic Cells: 1,400,000 system gates
- Configurable Logic Blocks (CLBs): 1,728
- Total Block RAM: 576 Kbits
- Dedicated Multipliers: 32 x 18-bit multipliers
- Package Type: FG676 (Fine-pitch Ball Grid Array)
- Pin Count: 676 pins
- Operating Voltage: 1.2V core, 3.3V I/O
Performance Characteristics:
- Maximum Operating Frequency: Up to 300 MHz
- I/O Standards: Supports multiple standards including LVTTL, LVCMOS, SSTL, HSTL
- Temperature Range: Industrial grade (-40ยฐC to +85ยฐC)
- Power Consumption: Optimized for low-power applications
Memory and Storage:
- Integrated Flash Memory: Non-volatile configuration storage
- Distributed RAM: 32 Kbits
- Block SelectRAM: Dual-port capabilities
Pricing Information
The XC3S1400AN-FG676 pricing varies based on quantity, lead time, and supplier. Current market pricing typically ranges from $45 to $85 per unit for standard quantities, with volume discounts available for orders exceeding 1,000 units. For the most current pricing and availability, contact authorized Xilinx distributors or check major electronic component suppliers.
Pricing Considerations:
- Unit price decreases significantly with higher volume orders
- Lead times may vary from 2-16 weeks depending on market conditions
- OEM pricing available for qualified customers
- Extended temperature range versions may carry premium pricing
Documents & Media
Comprehensive technical documentation supports the XC3S1400AN-FG676 implementation and development:
Technical Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Detailed implementation guidelines and best practices
- Package Information: Mechanical drawings and pinout diagrams
- Errata: Known issues and recommended workarounds
- Application Notes: Design examples and optimization techniques
Development Resources:
- ISE Design Suite: Complete development environment
- IP Core Libraries: Pre-verified intellectual property blocks
- Reference Designs: Proven implementation examples
- Simulation Models: VHDL and Verilog behavioral models
Related Resources
The XC3S1400AN-FG676 ecosystem includes extensive development tools and support resources:
Development Boards:
- Spartan-3AN Starter Kit for rapid prototyping
- Custom evaluation boards from third-party vendors
- Academic program boards for educational institutions
Software Tools:
- Xilinx ISE WebPACK: Free development software
- ChipScope Pro: Advanced debugging and analysis
- EDK (Embedded Development Kit): System-level design tools
- System Generator: MATLAB/Simulink integration
Technical Support:
- Online knowledge base and community forums
- Application engineer support for complex designs
- Training courses and webinars
- Third-party design service partnerships
Environmental & Export Classifications
The XC3S1400AN-FG676 meets stringent environmental standards and regulatory requirements:
Environmental Compliance:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with EU chemical safety requirements
- Conflict Minerals: Responsibly sourced materials
- Green Package: Halogen-free package options available
Export Classifications:
- ECCN (Export Control Classification Number): 3A001.a.7
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Various (check specific part marking)
- Export License: May require license for certain destinations
Quality Standards:
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Temperature: Extended operating range options
- Quality Management: ISO 9001 certified manufacturing
- Reliability Testing: Extensive qualification and stress testing
The XC3S1400AN-FG676 delivers exceptional value for applications requiring high-performance FPGA capabilities with integrated non-volatile memory. Its comprehensive feature set, robust development ecosystem, and proven reliability make it an excellent choice for next-generation embedded system designs.
