Product Specifications
Core Architecture Features
- FPGA Family: Spartan-3A DSP series
- System Gates: 3.4 million gates
- Logic Cells: 53,712 configurable cells
- Maximum Frequency: 770MHz operating frequency
- Process Technology: Advanced 90nm manufacturing process
- Operating Voltage: 1.2V core voltage for optimal power efficiency
Package and I/O Specifications
- Package Type: 484-pin LCSBGA (Low-profile Chip Scale Ball Grid Array)
- User I/O: 309 configurable input/output pins
- Speed Grade: -5 (High Performance grade)
- Temperature Range: Commercial grade operation
- Package Designation: CSG484C
Enhanced DSP Capabilities
The XC3SD3400A-5CSG484C features specialized XtremeDSP DSP48A slices that replace traditional 18×18 multipliers, providing superior performance for digital signal processing applications. Enhanced block RAM with output registers enables faster data processing at speeds up to 250MHz even in the standard speed grade.
Key Performance Metrics
- Block RAM: Enhanced with output registers for improved performance
- DSP Slices: XtremeDSP DSP48A architecture
- Configuration Options: Multiple configuration modes supported
- Power Efficiency: Optimized 90nm process for reduced power consumption
Pricing Information
Current market pricing for the XC3SD3400A-5CSG484C varies based on quantity and supplier:
- Small Quantity (1+ units): Starting from $11.90 per unit
- Volume Pricing: Contact authorized distributors for bulk pricing
- Market Considerations: Prices fluctuate based on market demand and availability
Important Note: The XC3SD3400A-5CSG484C is currently in Last Time Buy (LTB) phase, indicating end-of-life status. Customers should secure inventory needs and consider migration to newer alternatives.
Documents & Media
Technical Documentation
- Official Datasheet: AMD/Xilinx DS610 specification document
- User Guide: Extended Spartan-3A Family User Guide
- Programming Guide: Configuration and programming specifications
- Package Information: Detailed pin-out and mechanical drawings
- Migration Guide: Replacement and upgrade path documentation
Design Resources
- Reference Designs: Application-specific implementation examples
- IP Cores: Compatible intellectual property cores catalog
- Board Layout Guidelines: PCB design recommendations for CSG484 package
- Thermal Management: Junction temperature and cooling considerations
Software Tools
- Vivado Design Suite: Primary development environment (for newer designs)
- ISE Design Suite: Legacy tool support for Spartan-3A family
- IP Integrator: System-level design and integration tools
- Simulation Tools: ModelSim and other supported simulators
Related Resources
Development Platforms
- Evaluation Boards: Spartan-3A DSP development kits
- Reference Designs: Telecommunications, automotive, and industrial applications
- Third-party Boards: Compatible development platforms from ecosystem partners
Compatible Components
- Configuration Devices: SPI Flash and Platform Flash options
- Power Management: Dedicated power supply solutions
- Clocking Resources: Crystal oscillators and clock management units
- Interface Components: High-speed transceivers and communication interfaces
Alternative and Replacement Options
Given the LTB status, consider these migration paths:
- XC7S75-1CSGA484C: Direct pin-compatible upgrade from 7-Series
- Kintex-7 Family: Higher performance alternatives
- Zynq SoCs: ARM processor integration for system-level solutions
Application Examples
The XC3SD3400A-5CSG484C excels in applications including:
- Broadband Access Equipment: DSL and cable modem applications
- Home Networking: Router and gateway implementations
- Display Systems: Video processing and projection systems
- Digital Television: Broadcasting and set-top box designs
- Industrial Control: Motor control and automation systems
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Lead-free (Pb-free) package construction
- REACH Regulation: Compliant with European chemical safety standards
- Conflict Minerals: Sourced according to industry responsible sourcing guidelines
- ISO 14001: Manufactured under environmental management systems
Operating Conditions
- Commercial Temperature Range: 0ยฐC to +85ยฐC junction temperature
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Non-condensing environments
- Shock and Vibration: Meets JEDEC standards for semiconductor devices
Export and Trade Classifications
- ECCN Classification: Subject to U.S. Export Administration Regulations
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufactured in qualified AMD/Xilinx facilities
- Quality Standards: Manufactured under ISO 9001 quality management systems
Packaging and Handling
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) rating per JEDEC standards
- ESD Protection: Electrostatic discharge sensitive device – proper handling required
- Lead-free Process: Compatible with lead-free assembly processes
- Tape and Reel: Available in standard semiconductor packaging for automated assembly
Regulatory Certifications
- CE Marking: European Conformity compliance
- FCC: Federal Communications Commission compliance for applicable applications
- UL Recognition: Underwriters Laboratories component recognition where applicable
The XC3SD3400A-5CSG484C represents proven FPGA technology with robust DSP capabilities. While in end-of-life status, it continues to serve critical applications where its specific feature set and pin compatibility are essential. For new designs, consider evaluating newer 7-Series or Zynq alternatives that offer enhanced performance and long-term availability.
