The XC3S1400AN-4FG484C is a versatile field-programmable gate array (FPGA) from AMD Xilinx’s Spartan-3AN series, designed to deliver exceptional performance for cost-sensitive applications. This advanced FPGA combines high-density programmable logic with integrated non-volatile configuration memory, making it an ideal solution for embedded systems, industrial automation, and communication applications.
Product Specifications
The XC3S1400AN-4FG484C features robust specifications that meet demanding application requirements:
Core Architecture:
- Logic cells: 1,400,000 system gates
- Configurable Logic Blocks (CLBs): 8,064
- Block RAM: 576 Kb total
- Distributed RAM: 172 Kb
- Speed grade: -4 (commercial temperature range)
I/O and Package Details:
- Package type: FG484 (Fine-pitch Ball Grid Array)
- Total I/O pins: 372 user I/O
- Package size: 23mm x 23mm
- Operating temperature: 0ยฐC to +85ยฐC (commercial grade)
Power and Performance:
- Core voltage: 1.2V
- I/O voltage support: 1.2V to 3.3V
- Low power consumption design
- High-speed performance up to 326 MHz
Integrated Features:
- 18 x 18 multipliers: 32 dedicated multipliers
- Digital Clock Manager (DCM): 4 DCMs
- Phase-Locked Loops (PLLs): Enhanced clocking capabilities
- Configuration memory: Integrated Platform Flash for non-volatile storage
Pricing Information
The XC3S1400AN-4FG484C pricing varies based on quantity and supplier. Contact authorized distributors for current pricing information, volume discounts, and lead times. The FPGA is available through major electronic component distributors worldwide, with competitive pricing for both prototype and production quantities.
Pricing Factors:
- Order quantity (unit, reel, or tray packaging)
- Lead time requirements
- Geographic location
- Distributor relationships
- Market conditions
Documents & Media
Essential Documentation:
- XC3S1400AN-4FG484C datasheet with complete electrical specifications
- Spartan-3AN FPGA family user guide
- Configuration and programming guidelines
- Package and pinout documentation
- Thermal characteristics and PCB design guidelines
Development Tools:
- Vivado Design Suite compatibility information
- ISE Design Suite legacy support documentation
- Reference designs and application notes
- Evaluation board documentation
- Programming cable specifications
Technical Resources:
- Timing analysis reports
- Power estimation tools and guidelines
- Signal integrity design considerations
- Layout and routing best practices
Related Resources
Development Boards:
- Spartan-3AN evaluation kits
- Starter development platforms
- Custom reference designs
- Third-party development modules
Compatible Components:
- Configuration memory devices
- Power management solutions
- Clock generation circuits
- Interface components and connectors
Software Tools:
- Xilinx development environment setup
- IP core libraries and generators
- Simulation and verification tools
- Debug and analysis utilities
Application Examples:
- Digital signal processing implementations
- Communication protocol processors
- Industrial control systems
- Automotive electronics applications
Environmental & Export Classifications
The XC3S1400AN-4FG484C meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant (lead-free manufacturing)
- REACH regulation compliance
- Conflict minerals reporting
- Environmental management system certifications
Quality Standards:
- ISO 9001 manufacturing quality
- Automotive grade options available (contact for AEC-Q100 qualified versions)
- Industrial temperature range variants
- Extended reliability testing and qualification
Export Classifications:
- Export Control Classification Number (ECCN) compliance
- International traffic in Arms Regulations (ITAR) status
- Country-specific import/export requirements
- Trade compliance documentation
Package and Handling:
- Moisture sensitivity level (MSL) ratings
- ESD protection requirements
- Storage and handling guidelines
- Shelf life specifications
The XC3S1400AN-4FG484C delivers the performance, flexibility, and reliability required for modern FPGA applications while maintaining cost-effectiveness for high-volume production. Its comprehensive feature set and robust support ecosystem make it an excellent choice for engineers developing next-generation embedded systems.
