The XC3S700AN-4FG484I is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for complex digital applications. This advanced FPGA combines high logic density with integrated flash memory, making it an ideal solution for system designers requiring reliable, cost-effective programmable logic solutions.
Product Specifications
The XC3S700AN-4FG484I offers robust specifications that meet demanding application requirements:
Core Architecture:
- Logic Cells: 13,248 equivalent logic cells
- System Gates: 700,000 gates
- Distributed RAM: 184 Kbits
- Block RAM: 360 Kbits total (20 blocks of 18 Kbits each)
- Dedicated Multipliers: 20 embedded 18×18 multipliers
Memory & Storage:
- Integrated Flash Memory: 4 Mbit In-System Flash for configuration storage
- Configuration Memory: Non-volatile flash eliminates need for external configuration devices
I/O Capabilities:
- User I/O Pins: 372 maximum user I/O
- Package: 484-pin Fine-pitch Ball Grid Array (FBGA)
- I/O Standards: Support for multiple voltage standards including LVTTL, LVCMOS, SSTL, HSTL
Performance Specifications:
- Speed Grade: -4 (high-performance grade)
- Operating Temperature: Industrial grade (-40ยฐC to +85ยฐC)
- Supply Voltage: 1.2V core, 3.3V I/O
- Maximum Frequency: Up to 200+ MHz depending on design complexity
Price Information
Pricing for the XC3S700AN-4FG484I varies based on quantity, supplier, and market conditions. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for production quantities. Consider factors such as lead times and packaging options when requesting quotes for the XC3S700AN-4FG484I.
Documents & Media
Essential documentation for the XC3S700AN-4FG484I includes:
Datasheets & Technical References:
- Spartan-3AN FPGA Family Datasheet
- XC3S700AN-4FG484I Product Brief
- Packaging and Pinout Documentation
- DC and AC Switching Characteristics
Design Resources:
- Xilinx ISE Design Suite compatibility information
- Spartan-3AN Configuration User Guide
- Power Estimation and Thermal Management Guidelines
- PCB Design Guidelines for FBGA packages
Application Notes:
- Flash Memory Programming Procedures
- Clock Management and Distribution
- High-Speed Design Considerations
- Signal Integrity Guidelines
Related Resources
Maximize your XC3S700AN-4FG484I implementation with these complementary resources:
Development Tools:
- Xilinx ISE WebPACK (free development environment)
- ChipScope Pro Analyzer for debugging
- PlanAhead Design Analysis Tool
Evaluation Platforms:
- Spartan-3AN Starter Kit
- Third-party development boards supporting XC3S700AN-4FG484I
- Reference designs and IP cores
Technical Support:
- Xilinx Online Support Center
- Community forums and user groups
- Application engineering support
- Design consultation services
Compatible Components:
- Configuration accessories and programming cables
- Power management solutions
- Clock generation and distribution devices
- Interface and connectivity solutions
Environmental & Export Classifications
The XC3S700AN-4FG484I meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS Compliant (Lead-free manufacturing)
- REACH Regulation compliant
- Industrial temperature range operation (-40ยฐC to +85ยฐC)
- Moisture Sensitivity Level (MSL): Level 3
Quality & Reliability:
- Automotive-grade quality processes
- Extended product lifecycle support
- Comprehensive reliability testing
- Statistical quality control
Export Classifications:
- Export Control Classification Number (ECCN): As specified by current regulations
- Country of Origin: Manufactured in ISO-certified facilities
- Compliance with international trade regulations
- Documentation available for customs clearance
Package & Handling:
- Anti-static packaging for ESD protection
- Tray packaging for automated assembly
- Proper storage conditions specified
- Handling guidelines for BGA packages
The XC3S700AN-4FG484I represents an excellent choice for designers requiring high-performance FPGA capabilities with integrated flash memory. Its combination of logic density, built-in configuration storage, and robust I/O capabilities makes it suitable for applications ranging from industrial control systems to communications infrastructure. When selecting the XC3S700AN-4FG484I for your next project, consider the comprehensive ecosystem of tools, documentation, and support resources available to ensure successful implementation.
