The XC3S700AN-4FGG484C is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-3AN family, designed to deliver exceptional performance and reliability for space-constrained applications. This innovative device combines traditional FPGA capabilities with integrated nonvolatile Flash memory, making it the ideal choice for automotive, medical, and industrial applications requiring robust, self-contained configuration solutions.
Product Specifications
Core Features
- FPGA Family: Spartan-3AN Series
- Logic Capacity: 700,000 gates with 13,248 logic cells
- Clock Frequency: 667 MHz maximum operating frequency
- I/O Pins: 372 user I/O pins with multi-voltage support
- Package Type: 484-pin Fine-pitch Ball Grid Array (FBGA)
- Technology Node: Advanced 90nm CMOS process technology
- Supply Voltage: 1.2V core voltage (1.14V to 1.26V range)
Memory and Configuration
- RAM Bits: 368,640 bits of embedded block RAM
- Configuration Logic Blocks (CLBs): 1,472 CLBs
- Flash Memory: Integrated nonvolatile configuration memory
- MultiBoot Support: Multiple configuration files in single device
- Data Retention: 20 years Flash memory data retention
- Program/Erase Cycles: 100,000 robust Flash memory cycles
Physical Characteristics
- Package: 484-BBGA (Ball Grid Array)
- Mounting Type: Surface Mount Technology (SMT)
- Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
- Pin Count: 484 pins with 1mm ball pitch
- RoHS Compliance: Yes, fully RoHS3 compliant
Performance Specifications
- Speed Grade: -4 (Standard performance)
- I/O Standards: LVCMOS, LVTTL, HSTL, SSTL, True LVDS, RSDS, mini-LVDS
- I/O Drive Current: 24 mA output drive capability
- Suspend Mode: Low power consumption with fast wake-up (<100 ฮผs)
Price Information
The XC3S700AN-4FGG484C is competitively priced in the FPGA market, with costs varying based on quantity and supplier. Current market pricing ranges from approximately $29-45 USD for single units, with significant volume discounts available for quantities over 100 pieces. Pricing depends on factors such as:
- Order quantity and volume breaks
- Authorized distributor vs. independent supplier
- Lead time requirements
- Package condition (new vs. refurbished)
- Regional market variations
For the most current pricing and availability, we recommend contacting authorized Xilinx distributors or electronic component suppliers directly, as prices fluctuate based on market demand and supply chain conditions.
Documents & Media
Technical Documentation
- Official Datasheet: Complete specifications and electrical characteristics
- User Guide: Programming and implementation guidelines
- Application Notes: Design best practices and reference implementations
- Development Tools: Xilinx Vivado Design Suite and ISE compatibility
- Reference Manual: Detailed architectural information
Software Resources
- Xilinx Vivado Design Suite: Primary development environment
- ISE Design Tools: Legacy development platform support
- Programming Files: Bitstream generation and configuration utilities
- Simulation Models: VHDL and Verilog behavioral models
Design Resources
- Evaluation Boards: Compatible development platforms
- Reference Designs: Sample implementations and starter projects
- IP Cores: Licensed intellectual property blocks
- Technical Support: Xilinx community forums and documentation
Related Resources
Compatible Development Boards
- Digilent Basys 3: Educational FPGA development board
- Nexys4-DDR: Advanced prototyping platform
- Arty S7: Maker-friendly development board
- ZedBoard: Professional development platform
Alternative Xilinx FPGAs
- XC3S700A-4FGG484C: Standard Spartan-3A variant without Flash
- XC3S700AN-4FG484C: Same family, different package option
- XC3S700AN-5FGG484C: Higher speed grade variant
- XC3SD1800A-4CSG484I: Higher density Spartan-3A DSP option
Software Tools
- Xilinx Vivado: Modern integrated development environment
- ModelSim: Industry-standard simulation platform
- ChipScope Pro: Integrated logic analyzer
- PlanAhead: Design planning and analysis tool
Technical Support
- Xilinx Community Forums: Peer-to-peer technical assistance
- Application Engineering: Direct technical support
- Training Courses: FPGA design methodology education
- Webinar Series: Latest technology updates and best practices
Environmental & Export Classifications
Environmental Compliance
- RoHS Directive: Fully compliant with RoHS3 (2015/863/EU)
- REACH SVHC: Compliant with REACH substance restrictions
- Conflict Minerals: Compliant with conflict minerals regulations
- WEEE Directive: Waste electrical equipment compliance
- Lead-Free: Pb-free package and manufacturing process
Quality Standards
- AEC-Q100: Automotive Electronics Council qualified
- ISO 9001: Quality management system certified
- ISO 14001: Environmental management certified
- Medical Device: Suitable for medical equipment applications
Export Control Classifications
- ECCN: Export Control Classification Number compliance
- ITAR: International Traffic in Arms Regulations status
- Country of Origin: Manufactured in accordance with trade regulations
- Export Licensing: Standard commercial electronic components classification
Operating Environment
- Humidity: 10% to 90% relative humidity (non-condensing)
- Altitude: Up to 2000 meters above sea level
- Vibration: MIL-STD-883 compliant mechanical specifications
- Shock: Industrial-grade mechanical robustness
The XC3S700AN-4FGG484C represents Xilinx’s commitment to delivering innovative FPGA solutions that combine performance, reliability, and ease-of-use. With its integrated nonvolatile memory, robust security features, and comprehensive development ecosystem, this device is perfectly suited for next-generation embedded systems requiring flexible, programmable logic solutions in demanding applications.
