The XC3S700AN-4FGG484I is a versatile field-programmable gate array (FPGA) from Xilinx’s proven Spartan-3AN family, designed to deliver exceptional performance for cost-sensitive applications. This automotive-grade FPGA combines advanced programmable logic with integrated flash memory, making it an ideal solution for industrial automation, communications, and consumer electronics.
Product Specifications
Core Features
The XC3S700AN-4FGG484I delivers robust performance with its comprehensive feature set:
Logic Capacity:
- 700,000 system gates
- 13,248 logic cells
- 360 CLB (Configurable Logic Block) slices
- Advanced lookup tables and flip-flops for complex digital designs
Memory Architecture:
- 360 Kbits of distributed RAM
- 324 Kbits of block RAM
- Integrated 4 Mbit configuration flash memory
- Non-volatile storage eliminates external configuration devices
I/O and Connectivity:
- 372 user I/O pins in FGG484 package
- Support for multiple I/O standards including LVDS, SSTL, and HSTL
- High-speed differential signaling capabilities
- Flexible pin assignment options
Performance Specifications:
- Speed grade: -4 (high performance)
- Operating frequency up to 300+ MHz
- Low propagation delays for time-critical applications
- Optimized for high-speed digital signal processing
Package Details:
- FGG484: 484-pin Fine-pitch Ball Grid Array
- Compact footprint: 23mm x 23mm
- Industrial temperature range: -40ยฐC to +100ยฐC
- Automotive-qualified (AEC-Q100 compliant)
Price Information
The XC3S700AN-4FGG484I pricing varies based on quantity and distributor. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for quantities over 100 units. Educational institutions may qualify for special academic pricing programs.
For the most competitive pricing on the XC3S700AN-4FGG484I, we recommend requesting quotes from multiple suppliers and considering factors such as lead times, warranty terms, and technical support availability.
Documents & Media
Technical Documentation
Access comprehensive technical resources for the XC3S700AN-4FGG484I:
Datasheets and Specifications:
- Spartan-3AN FPGA Family Data Sheet
- XC3S700AN-4FGG484I Product Brief
- Electrical characteristics and AC/DC parameters
- Package mechanical drawings and dimensions
Design Resources:
- Spartan-3AN FPGA User Guide
- Configuration and programming guidelines
- Power consumption analysis tools
- Thermal management recommendations
Development Tools:
- ISE Design Suite compatibility information
- Place and route optimization guides
- Timing analysis methodologies
- Debug and verification strategies
Application Notes:
- PCB design guidelines for FGG484 package
- Signal integrity considerations
- EMI/EMC compliance recommendations
- Automotive application examples
Related Resources
Development Platforms
Accelerate your XC3S700AN-4FGG484I development with these compatible resources:
Evaluation Boards:
- Spartan-3AN Starter Kit
- Custom evaluation platforms from third-party vendors
- Prototyping boards with FGG484 socket support
Software Tools:
- Xilinx ISE Design Suite (Legacy support)
- Third-party synthesis and simulation tools
- Programming and configuration utilities
- IP core libraries and reference designs
Training and Support:
- Online training modules for Spartan-3AN architecture
- Community forums and technical support
- Design consultation services
- Migration guides for newer FPGA families
Compatible Products
Consider these related Xilinx products for your design requirements:
- XC3S400AN-4FGG400I (smaller capacity alternative)
- XC3S1400AN-4FGG484I (higher capacity option)
- Spartan-6 family for new designs requiring advanced features
Environmental & Export Classifications
Environmental Compliance
The XC3S700AN-4FGG484I meets stringent environmental standards:
RoHS Compliance:
- Lead-free manufacturing process
- Restriction of hazardous substances compliant
- Green packaging and materials
- Halogen-free options available
Automotive Standards:
- AEC-Q100 qualified for automotive applications
- Grade 2 temperature range (-40ยฐC to +105ยฐC junction)
- Suitable for under-hood automotive environments
- Long-term reliability testing completed
Quality Certifications:
- ISO 9001 manufacturing quality systems
- Military-grade screening options available
- Extended temperature range variants
- High-reliability screening programs
Export Classifications
The XC3S700AN-4FGG484I is subject to export control regulations:
ECCN Classification:
- Export Control Classification Number: 3A001.a.7
- Subject to EAR (Export Administration Regulations)
- License requirements vary by destination country
- Encryption capabilities may require additional licensing
Country-Specific Restrictions:
- Consult current Bureau of Industry and Security guidelines
- Some destinations may require export licenses
- Re-export restrictions may apply
- End-use and end-user verification required for certain applications
Compliance Recommendations:
- Verify current export regulations before shipment
- Maintain proper documentation for international transactions
- Consult legal counsel for complex export scenarios
- Consider dual-use technology implications
The XC3S700AN-4FGG484I represents a mature, reliable FPGA solution backed by extensive documentation and proven performance in demanding applications. While newer FPGA families offer advanced features, the Spartan-3AN continues to serve applications requiring cost-effective programmable logic with integrated flash memory. Contact your local Xilinx representative or authorized distributor to discuss how the XC3S700AN-4FGG484I can meet your specific design requirements.
