The XC3S700AN-5FGG484C is a powerful field-programmable gate array (FPGA) from Xilinx’s Spartan-3AN family, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This versatile FPGA combines high logic density with integrated flash memory, making it an ideal choice for applications requiring both processing power and non-volatile configuration storage.
Product Specifications
Core Features of XC3S700AN-5FGG484C
The XC3S700AN-5FGG484C offers robust specifications that make it suitable for a wide range of applications:
Logic Resources:
- Logic cells: 700,000 equivalent gates
- Configurable Logic Blocks (CLBs): 1,472
- Slices: 5,888 (4 LUTs and 2 flip-flops per slice)
- Distributed RAM: 92 Kbits
- Block RAM: 360 Kbits (20 blocks of 18 Kbits each)
Memory and Storage:
- Integrated Flash Memory: 11 Mbit In-System Flash for configuration storage
- JTAG configuration support
- Master Serial and Slave Serial configuration modes
I/O Capabilities:
- Package: 484-pin Fine-Pitch Ball Grid Array (FBGA)
- User I/O pins: 372 maximum
- Differential I/O pairs: 159 maximum
- I/O standards support: LVTTL, LVCMOS, SSTL, HSTL, and differential standards
Performance Specifications:
- Speed grade: -5 (industrial temperature range)
- Operating temperature: -40ยฐC to +85ยฐC
- Core voltage: 1.2V ยฑ 5%
- I/O voltage: 1.2V to 3.3V
Digital Signal Processing:
- Dedicated multiplier blocks: 20 (18×18 bit)
- Digital Clock Manager (DCM): 4 units
- Phase-Locked Loops (PLLs) for clock management
Price Information
The XC3S700AN-5FGG484C pricing varies based on quantity and supplier. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are typically available for orders exceeding 100 units. The XC3S700AN-5FGG484C offers excellent value for applications requiring both high performance and integrated flash memory capabilities.
For the most competitive XC3S700AN-5FGG484C pricing, consider factors such as:
- Order quantity requirements
- Lead time specifications
- Geographic location and shipping costs
- Authorized distributor relationships
- Long-term supply agreements
Documents & Media
Technical Documentation for XC3S700AN-5FGG484C
Datasheets and Specifications:
- XC3S700AN-5FGG484C Product Datasheet (DS312)
- Spartan-3AN FPGA Family Complete Data Sheet
- DC and AC Switching Characteristics
- Package and Pinout Information
Design Resources:
- Spartan-3AN FPGA User Guide
- Configuration User Guide
- In-System Flash User Guide
- Clocking Resources User Guide
Development Tools:
- ISE Design Suite compatibility information
- Vivado Design Suite migration guides
- IP Core documentation
- Reference designs and application notes
Package Information:
- FBGA484 package drawings and specifications
- PCB layout guidelines
- Thermal management recommendations
- Assembly and soldering profiles
Related Resources
Development Ecosystem for XC3S700AN-5FGG484C
Development Boards:
- Spartan-3AN Starter Kit
- Third-party evaluation boards
- Custom development platforms
Software Tools:
- ISE Design Suite (legacy support)
- Vivado Design Suite (for newer designs)
- SDK for embedded processor development
- ChipScope Pro for debugging
IP Cores and Libraries:
- Xilinx LogiCORE IP portfolio
- Memory controllers
- Communication protocols (Ethernet, USB, PCIe)
- Digital signal processing libraries
Application Examples:
- Industrial control systems
- Communications infrastructure
- Automotive electronics
- Medical device applications
- Aerospace and defense systems
Community Resources:
- Xilinx forums and community support
- Application notes and white papers
- Video tutorials and webinars
- Third-party design services
Environmental & Export Classifications
Compliance and Environmental Standards
Environmental Certifications:
- RoHS compliant (lead-free package)
- REACH regulation compliance
- Conflict minerals reporting template available
- Green package options
Operating Conditions:
- Commercial temperature range: 0ยฐC to +85ยฐC
- Industrial temperature range: -40ยฐC to +85ยฐC
- Humidity: 10% to 90% non-condensing
- Altitude: Up to 2000 meters
Export Control Information:
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of origin: Various (check specific lot)
- HTS (Harmonized Tariff Schedule) code: 8542.31.0001
Quality and Reliability:
- AEC-Q100 automotive qualification available
- Military temperature range options (-55ยฐC to +125ยฐC)
- Extended lifecycle support
- Quality management system ISO 9001 certified
Packaging and Handling:
- Moisture sensitivity level: MSL 3
- ESD sensitive device – proper handling required
- Tape and reel packaging available
- Tray packaging options
The XC3S700AN-5FGG484C represents a mature, reliable FPGA solution that continues to serve critical applications across multiple industries. Its combination of proven architecture, integrated flash memory, and comprehensive development ecosystem makes it an excellent choice for both new designs and legacy system maintenance.
For additional information about the XC3S700AN-5FGG484C or technical support, consult the official Xilinx documentation or contact authorized distributors for the most current specifications and availability.
