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XCR3256XL-10FTG256C: High-Performance CPLD for Advanced Digital Applications

Original price was: $20.00.Current price is: $19.00.

The XCR3256XL-10FTG256C is a cutting-edge Complex Programmable Logic Device (CPLD) from Xilinx’s renowned CoolRunner XPLA3 family. This powerful 256-macrocell CPLD delivers exceptional performance and flexibility for demanding embedded applications, combining high-speed operation with low-power consumption in a compact 256-pin Fine-Pitch Ball Grid Array (FTBGA) package.

Product Specifications

Key Technical Specifications

Architecture & Logic Resources:

  • Device Family: CoolRunner XPLA3 (XCR3256XL)
  • Logic Density: 256 macrocells with 6,000 equivalent gates
  • Technology: 0.35ฮผm CMOS process
  • Operating Frequency: Up to 105MHz maximum performance
  • Propagation Delay: 10ns typical (tpd specification)

Package & Pin Configuration:

  • Package Type: 256-pin Fine-Pitch Ball Grid Array (FTBGA)
  • Package Designation: FTG256C
  • Operating Temperature Range: Commercial grade (0ยฐC to +85ยฐC)
  • Supply Voltage: 3.3V (2.7V to 3.6V operating range)
  • I/O Standards: TTL/CMOS compatible with multiple voltage levels

Advanced Features:

  • Non-volatile Flash-based configuration for instant-on capability
  • In-System Programmable (ISP) via JTAG interface
  • Reconfigurable architecture for design flexibility
  • Low standby power consumption ideal for battery-powered applications
  • Extended temperature range for harsh environment applications
  • RoHS compliant for environmental compliance

Performance Characteristics

The XCR3256XL-10FTG256C delivers outstanding performance metrics including:

  • High-speed operation up to 105MHz system frequency
  • Low propagation delay of 10ns for critical timing applications
  • Power-efficient design with reduced current consumption
  • Robust signal integrity with advanced I/O capabilities

Price Information

Pricing Structure:

  • Unit Price (1-99 pieces): Contact authorized distributors for current pricing
  • Volume Pricing (100+ pieces): Significant discounts available for bulk orders
  • Engineering Samples: Available through Xilinx/AMD authorized partners

Availability:

  • Lead Time: Typically 8-12 weeks from authorized distributors
  • Stock Status: Check with DigiKey, Mouser, and other authorized distributors
  • Minimum Order Quantity: Varies by distributor (typically 1-10 pieces)

Note: Pricing subject to change. Contact authorized distributors for current quotes and availability.

Documents & Media

Technical Documentation

Primary Datasheets:

  • XCR3256XL Data Sheet (DS013) – Complete technical specifications
  • CoolRunner XPLA3 Family Overview – Architecture and feature comparison
  • Package Information – Mechanical drawings and pin assignments

Application Resources:

  • Design Guidelines for optimal performance implementation
  • Programming Specifications for ISP and configuration procedures
  • Timing Analysis Documentation for critical path optimization
  • Power Consumption Guidelines for low-power design considerations

Software & Tools:

  • Xilinx ISE Design Suite compatibility information
  • Programming software for device configuration
  • Simulation models for design verification
  • Reference designs and application examples

Development Support

Evaluation Resources:

  • Development board compatibility information
  • Reference schematics and layout guidelines
  • Programming cable requirements and specifications
  • Design flow documentation and tutorials

Related Resources

Compatible Products & Alternatives

Family Variants:

  • XCR3256XL-7FTG256C – Higher speed grade (7ns) variant
  • XCR3256XL-12FTG256C – Lower speed grade (12ns) option
  • XCR3256XL-10TQG144C – Alternative package option (144-pin TQFP)

Complementary Products:

  • Programming Cables: Platform Cable USB, Platform Cable USB II
  • Development Boards: CoolRunner-II evaluation platforms
  • Design Software: Xilinx ISE WebPACK (free version available)

Application Areas

The XCR3256XL-10FTG256C excels in diverse applications:

Industrial & Automotive:

  • Motor control and automation systems
  • Automotive electronics and safety systems
  • Industrial process control and monitoring

Communications & Networking:

  • Telecommunications equipment
  • Network switching and routing hardware
  • Protocol processing and interface control

Consumer Electronics:

  • Portable and battery-powered devices
  • Digital signal processing applications
  • Interface bridging and protocol conversion

Medical & Aerospace:

  • Medical device control systems
  • Aerospace and defense applications
  • High-reliability embedded systems

Environmental & Export Classifications

Environmental Compliance

RoHS Compliance:

  • RoHS Directive 2011/65/EU: Fully compliant
  • Lead-free Package: Yes (Pb-free solder balls)
  • Halogen-free: Meets industry requirements
  • REACH Regulation: Compliant with EU chemical regulations

Environmental Specifications:

  • Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
  • Storage Temperature Range: -65ยฐC to +150ยฐC
  • Humidity: 5% to 95% non-condensing
  • Vibration Resistance: Per JESD22-B103 standards
  • Thermal Shock: Per JESD22-A106 standards

Export Control Classifications

Trade Classifications:

  • ECCN (Export Control Classification Number): EAR99
  • USHTS (US Harmonized Tariff Schedule): 8542390001
  • TARIC (EU Integrated Tariff): 8542399000
  • Country of Origin: Varies by manufacturing location

Compliance Certifications:

  • CE Marking: Compliant for European markets
  • FCC Part 15: Suitable for unintentional radiator applications
  • ITAR: Not subject to International Traffic in Arms Regulations

Quality & Reliability

Quality Standards:

  • ISO 9001:2015 certified manufacturing
  • Automotive Grade variants available (AEC-Q100 qualified)
  • Industrial Temperature options for extended range applications
  • Qualification Level: Commercial/Industrial grade standard

Reliability Metrics:

  • MTBF (Mean Time Between Failures): >1,000,000 hours at 25ยฐC
  • Package Reliability: Meets JEDEC standards
  • Electrostatic Discharge (ESD): >2kV HBM protection
  • Latch-up Immunity: >100mA current injection

The XCR3256XL-10FTG256C represents the pinnacle of CPLD technology, offering designers the perfect balance of performance, power efficiency, and design flexibility. Whether you’re developing next-generation industrial control systems, automotive electronics, or communications infrastructure, this advanced CPLD provides the reliability and capabilities needed for mission-critical applications.

For technical support, pricing inquiries, or design consultation, contact your authorized Xilinx/AMD distributor or visit the official AMD Xilinx website for comprehensive documentation and development resources.