The XCR3384XL-12FTG256C is a sophisticated Complex Programmable Logic Device (CPLD) from AMD Xilinx’s CoolRunner XPLA3 family, engineered for demanding digital logic applications requiring ultra-low power consumption and high-speed performance. This advanced CPLD delivers exceptional versatility for portable, handheld, and power-sensitive electronic systems.
Product Specifications
Core Performance Features
- Part Number: XCR3384XL-12FTG256C
- Manufacturer: AMD Xilinx (formerly Xilinx)
- Product Family: CoolRunner XPLA3 CPLD Series
- Logic Capacity: 384 Macrocells with 9,000 equivalent gates
- Propagation Delay: 10.8 nanoseconds (high-speed operation)
- Operating Frequency: Up to 83 MHz maximum frequency
- Technology Node: 0.35ฮผm CMOS process technology
Electrical Characteristics
- Supply Voltage: 3.3V (3.0V to 3.6V operating range)
- Standby Power: Less than 56 ฮผW (ultra-low power consumption)
- Pin-to-Pin Speed: True 5.0 ns propagation delay
- Fast Zero Power (FZP): Advanced design technique combining low power with high speed
- Dynamic Power: Significantly lower than competitive CPLDs
Package Specifications
- Package Type: 256-pin Fine-pitch Ball Grid Array (FTBGA)
- Pin Count: 256 terminals
- Package Code: FTG256
- Form Factor: Square Ball Grid Array configuration
- Temperature Grade: Commercial temperature range
- Mounting Type: Surface Mount Technology (SMT)
Programming & Configuration
- Programming Type: In-System Programmable (ISP)
- Program/Erase Cycles: Minimum 1,000 cycles guaranteed
- Non-Volatile Configuration: Flash-based memory technology
- Reprogrammability: Electrically reprogrammable using standard device programmers
- Configuration Retention: Non-volatile storage ensures configuration persistence
Design Tools & Software Support
- Primary Tools: Xilinx WebPACK software (free development environment)
- CAE Tool Support: Mentor Graphics, Cadence/OrCAD, Exemplar Logic, Synopsys, Viewlogic, Synplicity
- HDL Support: VHDL, Verilog, and ABEL hardware description languages
- Design Entry: Schematic capture and HDL-based design flows
- Simulation: Industry-standard functional and timing simulation tools
- Platform Support: PC, Sun, and HP development platforms
Price Information
The XCR3384XL-12FTG256C pricing varies based on quantity, supplier, and market conditions. Current market indicators show:
- Stock Availability: Multiple distributors report inventory levels ranging from hundreds to thousands of units
- Pricing Structure: Volume-based pricing with significant discounts for larger quantities
- Lead Time: Typically 1-4 weeks for standard quantities
- Minimum Order: Generally 1 piece minimum order quantity
For current pricing and availability, contact authorized distributors or submit a Request for Quote (RFQ) through electronic component distribution networks. Prices are subject to market fluctuations and supplier inventory levels.
Documents & Media
Technical Documentation
- Official Datasheet: XCR3384XL series datasheet (PDF format)
- User Guide: CoolRunner XPLA3 CPLD User Guide
- Application Notes: Design implementation guidelines and best practices
- Package Drawings: Mechanical specifications and land patterns
- Thermal Characteristics: Junction temperature and thermal resistance data
Design Resources
- IBIS Models: Signal integrity simulation models
- BSDL Files: Boundary scan description language files for testing
- Symbol Libraries: CAD symbols for schematic design
- Footprint Libraries: PCB layout footprints for major CAD systems
- 3D Models: STEP files for mechanical design verification
Software & Development Tools
- Xilinx WebPACK: Free integrated development environment
- ISE Design Suite: Legacy development platform (older designs)
- Device Programmer Support: Compatible with universal device programmers
- Evaluation Boards: Reference designs and development platforms
Related Resources
Compatible Products & Alternatives
- XCR3384XL-10FTG256C: Faster speed grade (10 ns) variant
- XCR3384XL-7FTG256C: High-speed (7 ns) version for demanding applications
- XCR3256XL-12FTG256C: Lower macrocell count alternative (256 macrocells)
- XCR3512XL-12FTG256C: Higher capacity option (512 macrocells)
Application Areas
- Industrial Control Systems: Motor control, automation, and process control
- Telecommunications: Protocol processing, signal conditioning, and interface logic
- Automotive Electronics: Engine management, safety systems, and infotainment
- Medical Devices: Portable diagnostic equipment and patient monitoring
- Consumer Electronics: Power management, user interface control, and system logic
- Aerospace & Defense: Mission-critical systems requiring high reliability
Technical Support Resources
- Xilinx Support Forums: Community-driven technical discussions
- Application Engineering: Direct technical support from Xilinx/AMD
- Training Materials: Online courses and webinars for CPLD design
- Reference Designs: Proven implementations for common applications
- Migration Guides: Transition paths from older CPLD families
Development Ecosystem
- Third-Party IP: Licensed intellectual property cores
- Design Services: Professional design and consulting services
- Testing Solutions: Automated test equipment and boundary scan tools
- Programming Solutions: Production programming services and equipment
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with Restriction of Hazardous Substances directive
- Lead-Free: Manufactured using lead-free soldering processes and materials
- Halogen-Free: Meets halogen-free requirements for environmentally sensitive applications
- REACH Compliance: Compliant with European chemical registration regulations
- Green Classification: Qualified for environmentally conscious design requirements
Operating Environment
- Operating Temperature: Commercial temperature range (0ยฐC to +70ยฐC)
- Storage Temperature: Extended range for long-term storage
- Humidity Rating: Moisture sensitivity level classification
- ESD Protection: Built-in electrostatic discharge protection circuitry
- Altitude Rating: Suitable for standard atmospheric pressure applications
Export & Trade Classifications
- ECCN Classification: Export Control Classification Number for international trade
- Country of Origin: Manufacturing location for customs and trade purposes
- HS Code: Harmonized System classification for international shipping
- Trade Compliance: Meets international trade and export control requirements
- REACH Registration: European chemical safety registration status
Quality & Reliability Standards
- Quality Management: ISO 9001 certified manufacturing processes
- Reliability Testing: Extensive qualification testing per industry standards
- Lifecycle Management: Long-term product availability and support commitment
- Automotive Grade: Available in automotive-qualified versions for vehicular applications
- Military Standards: Enhanced versions available for defense applications
Packaging & Shipping
- Moisture Sensitivity: Level 3 moisture sensitivity rating
- Packaging Standards: Industry-standard anti-static packaging
- Shipping Classification: Appropriate handling and storage requirements
- Traceability: Full lot traceability for quality and reliability tracking
Note: Specifications and availability are subject to change without notice. For the most current information regarding the XCR3384XL-12FTG256C, consult official AMD Xilinx documentation or contact authorized distributors. This product description is optimized for search engines while maintaining technical accuracy and readability for engineering professionals.
