1. Product Specifications
Core Technical Specifications
- Part Number: XC1701LPD8C
- Manufacturer: Xilinx (AMD)
- Memory Capacity: 1 Megabit (1Mb)
- Memory Type: Serial Configuration PROM
- Technology: One-Time Programmable (OTP)
- Supply Voltage: 3.3V
- Package Type: 8-Pin PDIP (Plastic Dual In-line Package)
- Operating Temperature Range: 0ยฐC to +70ยฐC (Commercial grade)
Key Features
- Simple FPGA Interface: Requires only one user I/O pin for configuration
- Master/Slave Serial Mode Compatible: Works with FPGA in both Master Serial and Slave Serial modes
- Cascadable Design: Multiple XC1701LPD8C devices can be chained together for storing longer or multiple bitstreams
- Programmable Reset Polarity: Supports both active High and active Low reset configurations
- Fast Configuration: Optimized for quick FPGA startup times
- Low Power Operation: Efficient 3.3V operation with minimal power consumption
Pin Configuration
- 8-Pin PDIP Package: Compact form factor suitable for various board designs
- Standard Pinout: Compatible with industry-standard configuration PROM interfaces
- CEO Output: Chip Enable Output for cascading multiple devices
- CLK Input: Clock input for serial data transfer
- DATA Output: Serial data output to FPGA
- CE Input: Chip Enable input for device selection
Compatible FPGA Families
The XC1701LPD8C is compatible with various Xilinx FPGA families including:
- XC4000 Series
- Virtex Series
- Spartan Series
- XC4000XLA and XC4000XV families
2. Pricing
Market Pricing Information
- Typical Unit Price: Contact suppliers for current pricing
- Volume Discounts: Available for quantities of 100+ units
- Stock Availability: Generally available from authorized distributors
- Lead Time: Standard lead times range from 2-8 weeks depending on quantity
Purchasing Options
- Authorized Distributors: Available through major electronic component distributors
- Direct from Manufacturer: Contact AMD/Xilinx for large volume orders
- Online Marketplaces: Available through various electronic component e-commerce platforms
Note: Prices are subject to market fluctuations and availability. Contact authorized distributors for current pricing and volume discounts.
3. Documents & Media
Technical Documentation
- Datasheet: DS027 (v3.5) – XC1700E, XC1700EL, and XC1700L Series Configuration PROMs
- Programming Guide: Comprehensive programming instructions and specifications
- Application Notes: Design guidelines and best practices for implementation
- Pin Diagrams: Detailed pinout information and package drawings
Design Resources
- Reference Designs: Example circuits and implementation guides
- Timing Specifications: Detailed AC/DC characteristics and timing parameters
- Programming Software: Compatible with leading programmer manufacturers
- CAD Models: ECAD models available for PCB design tools
Software Support
- Xilinx Alliance Software: Full design support and integration
- Vivado Design Suite: Modern design environment with enhanced usability
- ISE Design Tools: Legacy support for older design flows
- Programming Tools: Support from multiple third-party programmer manufacturers
4. Related Resources
Development Tools
- Programming Hardware: Compatible with universal device programmers
- Evaluation Boards: Various FPGA development boards support XC1701LPD8C
- Design Software: Xilinx Vivado and ISE design suites
- Simulation Tools: ModelSim and other industry-standard simulators
Related Products
- XC17128LPD8C: Lower capacity 128Kb variant
- XC17256LPD8C: 256Kb capacity option
- XC17512LPD8C: Higher capacity 512Kb variant
- XC1702LPD8C: 2Mb capacity for larger configurations
Technical Support
- Online Resources: Comprehensive documentation and FAQs available
- Community Forums: Active user communities and technical discussions
- Application Engineering: Direct support from AMD/Xilinx technical teams
- Training Materials: Webinars, tutorials, and certification programs
Alternative Packages
- XC1701LPDG8C: Same specifications in 8-pin SOIC package
- XC1701LPC20C: 20-pin PLCC package option
- XC1701LSO20C: 20-pin SOIC package variant
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets European Union RoHS directive requirements
- Lead-Free: Pb-free package options available
- REACH Compliant: Complies with EU REACH regulation
- Conflict Minerals: Sourced from conflict-free suppliers
Operating Conditions
- Operating Temperature: 0ยฐC to +70ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- Altitude: Up to 3000 meters above sea level
Reliability Standards
- MTBF: High reliability with extensive qualification testing
- Quality Standards: Manufactured to ISO 9001 quality standards
- Automotive Grade: AEC-Q100 qualified versions available
- Industrial Grade: Extended temperature variants available
Export Classification
- ECCN: Export Control Classification Number as per US Commerce Department
- Country of Origin: Manufactured in various approved facilities
- Export Restrictions: Subject to applicable export control regulations
- Licensing: May require export license for certain destinations
Packaging & Shipping
- ESD Protection: Electrostatic discharge protective packaging
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- Shipping Classification: Non-hazardous material classification
- Recycling: Semiconductor recycling programs available
Disclaimer: Specifications and availability are subject to change without notice. Please consult the latest datasheet and contact authorized distributors for current information. The XC1701LPD8C may be subject to obsolescence – verify current product status before new designs.
