The XCV200-4FG256C is a powerful field-programmable gate array (FPGA) from Xilinx’s Virtex series, designed to deliver exceptional performance for demanding digital signal processing and embedded system applications. This advanced programmable logic device offers designers the flexibility and processing power needed for complex electronic designs.
Product Specifications
The XCV200-4FG256C features robust technical specifications that make it ideal for high-performance applications:
Core Architecture:
- Logic cells: 200,000 system gates
- CLB array: 24 x 32 configurable logic blocks
- Flip-flops: 4,704 maximum user flip-flops
- Block RAM: 28 blocks (4KB each, 112KB total)
- Speed grade: -4 (high performance)
Package Details:
- Package type: Fine-pitch Ball Grid Array (FBGA)
- Pin count: 256 pins
- Package size: 17mm x 17mm
- Operating temperature: Commercial grade (0ยฐC to +85ยฐC)
I/O Capabilities:
- Maximum user I/O: 180 pins
- Voltage support: 3.3V, 2.5V, 1.8V standards
- High-speed differential signaling support
- PCI compliance ready
The XCV200-4FG256C incorporates advanced features including distributed RAM, dedicated carry logic, and fast internal routing resources, enabling efficient implementation of complex digital designs with minimal external components.
Price
XCV200-4FG256C pricing varies based on quantity and supplier. Contact authorized distributors for current pricing information and volume discounts. The device is available through major electronic component distributors worldwide, with typical lead times ranging from stock availability to 12-16 weeks for large quantity orders.
Price factors include:
- Order quantity (higher volumes receive better pricing)
- Packaging requirements
- Delivery timeline
- Geographic location and local distributor margins
Documents & Media
Technical Documentation:
- XCV200-4FG256C datasheet with complete electrical specifications
- Virtex FPGA family user manual
- Configuration and programming guidelines
- Pin-out diagrams and package drawings
- Application notes for optimal design practices
Development Resources:
- Xilinx ISE Design Suite compatibility information
- Reference designs and example projects
- PCB layout guidelines for XCV200-4FG256C implementation
- Thermal management recommendations
- Power supply design considerations
Media Resources:
- High-resolution product images
- 3D package models for PCB design tools
- Video tutorials for FPGA programming basics
- Webinar recordings on Virtex series applications
Related Resources
Development Tools: The XCV200-4FG256C integrates seamlessly with Xilinx development environments, including ISE WebPACK (free version) and full ISE Design Suite for professional development.
Evaluation Boards: Several evaluation platforms support the XCV200-4FG256C, enabling rapid prototyping and design validation before committing to custom PCB development.
Technical Support:
- Xilinx technical support portal
- Community forums and user groups
- Local field application engineer support
- Online training courses and certification programs
Compatible Products:
- Configuration PROMs and flash memory devices
- Power management ICs optimized for FPGA applications
- Oscillators and clock generation circuits
- Interface transceivers and level shifters
Environmental & Export Classifications
Environmental Compliance: The XCV200-4FG256C meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device undergoes rigorous quality testing to ensure reliability across its specified operating temperature range.
Export Classifications:
- ECCN (Export Control Classification Number): 3A991.a.2
- Country of origin: Manufacturing location varies by production lot
- Compliance with US export administration regulations
- Documentation available for international shipping requirements
Quality Standards:
- ISO 9001 certified manufacturing
- Automotive grade versions available for AEC-Q100 compliance
- Industrial temperature grade options (-40ยฐC to +100ยฐC)
- Extended reliability testing data available
Environmental Operating Conditions:
- Storage temperature: -65ยฐC to +150ยฐC
- Operating humidity: 10% to 85% non-condensing
- Altitude: Up to 2000 meters above sea level
- Shock and vibration resistance per applicable industry standards
The XCV200-4FG256C represents an excellent choice for designers requiring high-performance programmable logic with proven reliability and comprehensive development tool support. Its combination of logic density, speed performance, and I/O flexibility makes it suitable for telecommunications, industrial automation, medical devices, and aerospace applications.
