The XA6SLX25T-3CSG324I is an automotive-qualified Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-6 LXT family, specifically engineered for mission-critical automotive, industrial, and embedded applications. This high-performance FPGA combines exceptional reliability with cost-effectiveness, making it the ideal choice for demanding environments requiring extended temperature operation and enhanced durability.
Product Specifications
Core Architecture
- FPGA Family: Spartan-6 LXT (Low-power with Transceivers)
- Logic Elements: 24,051 configurable logic cells
- Process Technology: Advanced 45nm CMOS low-power process
- Supply Voltage: 1.14V to 1.26V core voltage (1.2V nominal)
- Speed Grade: -3 (highest performance grade)
- Package Type: 324-pin CSBGA (Chip Scale Ball Grid Array)
- Package Size: 15mm ร 15mm ร 1.0mm
Memory and DSP Resources
- Block RAM: 117 Kb total capacity (configurable as 18 Kb or 36 Kb blocks)
- Distributed RAM: Available through LUT configuration
- DSP Slices: 58 ร DSP48A1 slices for high-performance signal processing
- 18ร18 Multipliers: Integrated for efficient arithmetic operations
I/O and Connectivity Features
- User I/O Pins: 190 configurable I/O pins
- Differential Pairs: Support for LVDS, TMDS, and other differential standards
- High-Speed Transceivers: 4 ร 3.2 Gbps low-power serial transceivers
- Clock Management: 8 ร CMT (Clock Management Tiles) with DCM and PLL
- Memory Interfaces: Built-in SDRAM, DDR, DDR2, DDR3 memory controllers
Automotive-Grade Specifications
- Temperature Range: -40ยฐC to +100ยฐC (Extended Automotive Grade)
- AEC-Q100 Qualified: Grade 2 qualification for automotive applications
- Enhanced Reliability: ISO/TS 16949 manufacturing standards
- Vibration Resistance: Automotive-grade mechanical stress tolerance
- Humidity Tolerance: Enhanced moisture resistance for harsh environments
Performance Characteristics
- Logic Delay: Optimized for -3 speed grade performance
- Maximum Frequency: Up to 375 MHz internal clock performance
- Power Consumption: Ultra-low power design with multiple power modes
- Configuration Time: Fast configuration with multiple boot options
Price Information
Current market pricing for the XA6SLX25T-3CSG324I varies based on quantity and distributor:
Volume Pricing (USD, 2025)
- 1-25 pieces: $95.00 – $110.00 per unit
- 26-99 pieces: $85.00 – $95.00 per unit
- 100-499 pieces: $75.00 – $85.00 per unit
- 500+ pieces: $65.00 – $75.00 per unit
- 1000+ pieces: Contact for volume discounts
Note: Prices are subject to market fluctuation and availability. Automotive-grade components typically command a 15-25% premium over commercial equivalents due to enhanced testing and qualification requirements.
Documents & Media
Official Documentation
- Product Datasheet: Spartan-6 FPGA Data Sheet (DS162)
- User Guide: Spartan-6 FPGA Configuration Guide (UG380)
- PCB Design Guide: Spartan-6 FPGA PCB Design and Pin Planning Guide
- Automotive Qualification Report: AEC-Q100 Grade 2 Test Report
Design Resources
- Reference Designs: Automotive-specific application examples
- Development Boards: Compatible evaluation platforms and starter kits
- IP Cores: Extensive library of pre-verified intellectual property
- Application Notes: Best practices for automotive implementation
Software Tools
- Vivado Design Suite: Primary development environment (legacy ISE support)
- ChipScope Pro: Integrated logic analyzer for debugging
- PlanAhead: Advanced floorplanning and constraint management
- XPower Estimator: Power analysis and optimization tools
3D Models and Symbols
- CAD Models: STEP and 3D mechanical models for PCB design
- Schematic Symbols: Standard and custom library components
- Footprint Libraries: Verified PCB footprints for major CAD tools
- Simulation Models: SPICE and IBIS models for signal integrity analysis
Related Resources
Compatible Development Platforms
- Spartan-6 FPGA SP605 Evaluation Kit
- Automotive-Grade Development Board (Custom Solutions)
- Low-Cost Spartan-6 Development Boards
Recommended Accessories
- JTAG Programming Cables: Platform Cable USB II, Digilent cables
- Configuration Memory: SPI Flash, Parallel Flash options
- Power Management: Automotive-grade power supply modules
- Thermal Management: Heat sinks and thermal interface materials
Software Ecosystem
- Embedded Development Kit (EDK): System-level design tools
- MicroBlaze Soft Processor: 32-bit RISC processor core
- PCI Express Cores: Endpoint and Root Complex implementations
- Ethernet Cores: 10/100/1000 Ethernet MAC and PHY interfaces
Training and Support
- Technical Documentation Portal: Comprehensive online resources
- Community Forums: Active developer community support
- Training Courses: Online and instructor-led FPGA design courses
- Application Engineering Support: Regional technical support teams
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: RoHS3 Directive 2011/65/EU compliant
- REACH Regulation: EU Chemical Registration compliance
- Conflict Minerals: Responsible sourcing certification
- Green Packaging: Environmentally responsible packaging materials
Quality Standards
- ISO/TS 16949: Automotive quality management system
- AEC-Q100 Grade 2: Automotive Electronics Council qualification
- JEDEC Standards: Industry-standard reliability testing
- IPC Standards: PCB assembly and soldering guidelines
Export Control Classifications
- ECCN: 3A991.a.2 (US Export Administration Regulations)
- HTS Code: 8542.31.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in various AMD/contractor facilities
- License Requirements: Check local export regulations for specific destinations
Automotive Certifications
- PPAP Documentation: Production Part Approval Process compliant
- IMDS Registration: International Material Data System registered
- CAMDS Compliance: Chinese Automotive Material Data System
- Supplier Quality Requirements: Major OEM supplier standards certified
Storage and Handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- Storage Temperature: -55ยฐC to +125ยฐC
- ESD Sensitivity: Class 2 (2kV HBM, 200V CDM)
- Shelf Life: 5 years under proper storage conditions
Regional Compliance
- CE Marking: European Conformity for applicable directives
- FCC Part 15: US electromagnetic compatibility compliance
- IC Standards: Industry Canada certification where applicable
- WEEE Directive: Waste electrical and electronic equipment compliance
The XA6SLX25T-3CSG324I represents the pinnacle of automotive-grade FPGA technology, delivering uncompromising reliability and performance for next-generation automotive electronics, industrial automation, and mission-critical embedded systems.
