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XCZU27DR-1FFVE1156I – AMD Xilinx Zynq UltraScale+ RFSoC FPGA

Original price was: $20.00.Current price is: $19.00.

1. Product Specifications

Processing System

  • ARM Cores: Quad-core ARM Cortex-A53 (64-bit) + Dual-core ARM Cortex-R5 (32-bit)
  • Clock Speed: Up to 1.5 GHz (Cortex-A53), up to 600 MHz (Cortex-R5)
  • Cache: L1 and L2 cache hierarchy for optimized performance

Programmable Logic

  • Logic Cells: 930,300 system logic cells
  • LUTs: Configurable Logic Blocks (CLBs) with 6-input Look-Up Tables
  • Block RAM: Distributed and block memory resources
  • DSP Slices: Dedicated DSP48E2 slices for signal processing

RF Data Converters

  • RF-ADCs: Up to 16 channels of RF Analog-to-Digital Converters
  • RF-DACs: Up to 16 channels of RF Digital-to-Analog Converters
  • Sampling Rate: Multi-GSPS sampling capabilities
  • Resolution: High-resolution conversion for precision applications

Memory Interfaces

  • DDR4/DDR3: High-speed memory controller support
  • On-Chip Memory: Various on-chip memory configurations
  • External Memory: Support for external memory devices

I/O and Connectivity

  • High-Speed Transceivers: GTY transceivers for high-speed serial communication
  • Standard I/O: Configurable I/O pins with various voltage standards
  • Interfaces: PCIe, Ethernet, USB, UART, SPI, I2C support

Physical Characteristics

  • Package Type: FFVE (Flip-Chip Fine-Pitch BGA)
  • Pin Count: 1156 pins
  • Package Size: Industry-standard BGA footprint
  • Operating Temperature: Commercial and extended temperature ranges available
  • Process Technology: 16nm FinFET+ TSMC process

2. Pricing

Pricing Information

The XCZU27DR-1FFVE1156I is available through authorized AMD Xilinx distributors and electronic component suppliers. Pricing varies based on:

  • Order Quantity: Volume discounts available for large orders
  • Lead Time: Standard and expedited delivery options
  • Distribution Channel: Authorized distributors vs. direct sales
  • Market Conditions: Current supply and demand factors

How to Get Pricing

  1. Contact Authorized Distributors: Request quotes from verified AMD Xilinx distributors
  2. Volume Pricing: Submit RFQ (Request for Quote) for quantity-based pricing
  3. Technical Support: Access to technical documentation and application support
  4. Availability: Real-time inventory and lead time information

Note: Pricing is subject to change based on market conditions. Contact authorized distributors for current pricing and availability.


3. Documents & Media

Technical Documentation

Datasheets & Reference Manuals

  • Zynq UltraScale+ RFSoC Data Sheet (DS889)
  • Product Selection Guide
  • Package and Pinout Information
  • Electrical Characteristics Specification

Design Resources

  • Reference Designs and Application Notes
  • Software Development Kit (SDK) Documentation
  • Hardware Description Language (HDL) Examples
  • Board Design Guidelines

Development Tools

  • Vivado Design Suite compatibility information
  • IP Core documentation
  • Simulation models and verification IP

Software & Tools

AMD Xilinx Vivado Design Suite

  • Synthesis and implementation tools
  • IP catalog and customization
  • Hardware-software co-design environment
  • Debug and analysis tools

Software Development Kit

  • Embedded software development environment
  • Board Support Packages (BSPs)
  • Real-time operating system support
  • Linux and bare-metal application development

Media Resources

  • Product overview videos
  • Technical webinars and training materials
  • Application showcase demonstrations
  • Getting started tutorials

4. Related Resources

Development Platforms

Evaluation Boards

  • ZCU216 Evaluation Kit (compatible with XCZU27DR family)
  • RFSoC development boards and starter kits
  • Third-party development platforms

Reference Designs

  • Software Defined Radio implementations
  • 5G wireless infrastructure designs
  • Cable infrastructure (DOCSIS) applications
  • Beamforming and MIMO systems

Application Areas

Wireless Infrastructure

  • 5G New Radio (NR) base stations
  • Massive MIMO systems
  • Small cell and macro cell applications
  • Software-defined radio platforms

Wired Infrastructure

  • DOCSIS 3.1 and 4.0 cable modems
  • Cable modem termination systems (CMTS)
  • Optical transport networks
  • Network function virtualization (NFV)

Test & Measurement

  • RF signal generators and analyzers
  • Software-defined test equipment
  • Beamforming test systems
  • Protocol analyzers

Technical Support

  • AMD Xilinx Community Forums
  • Technical support portal and knowledge base
  • Application engineering support
  • Training and certification programs

Partner Ecosystem

  • Third-party IP providers
  • Board and system design partners
  • Software and tools vendors
  • System integrators and consultants

5. Environmental & Export Classifications

Environmental Compliance

RoHS Compliance

  • Compliant with RoHS (Restriction of Hazardous Substances) directive
  • Lead-free package construction
  • Halogen-free options available
  • Environmental sustainability initiatives

Temperature Ratings

  • Commercial temperature range: 0ยฐC to +85ยฐC
  • Extended temperature range options available
  • Thermal management considerations for high-performance applications

Reliability Standards

  • Automotive qualification (AEC-Q100) for automotive variants
  • Industrial temperature and reliability standards
  • Quality management system certification (ISO 9001)

Export Control Classifications

Export Administration Regulations (EAR) The XCZU27DR-1FFVE1156I is subject to U.S. Export Administration Regulations and may require export licensing depending on:

  • Destination Country: Export restrictions may apply to certain countries
  • End User: Verification of end user and end use may be required
  • Application: Specific applications may require additional licensing

ECCN Classification

  • Subject to Export Control Classification Number (ECCN) designation
  • Advanced computing and semiconductor manufacturing controls apply
  • Classification may affect export, reexport, and in-country transfer requirements

Due Diligence Requirements

  • Front-end fabricators and OSAT companies must verify classifications
  • Quarterly reporting requirements for certain applications
  • Know Your Customer (KYC) vetting procedures

Important Notes

  • Export License Requirements: May require export licenses for certain destinations and applications
  • Technology Transfer: Sharing of technical information may be subject to export controls
  • Compliance Responsibility: Exporters must verify current regulations and obtain appropriate licenses
  • Professional Advice: Consult with export control professionals for specific applications

Disclaimer: Export control regulations are subject to change. Users must verify current regulations and obtain appropriate licenses before export, reexport, or transfer of controlled items.


Why Choose XCZU27DR-1FFVE1156I?

The XCZU27DR-1FFVE1156I represents the pinnacle of programmable SoC technology, offering unmatched integration of processing power, programmable logic, and RF capabilities. Whether you’re developing next-generation wireless infrastructure, advanced test equipment, or innovative software-defined radio applications, this device provides the performance, flexibility, and integration needed to bring your designs to market faster.

With comprehensive development tools, extensive documentation, and strong ecosystem support, the XCZU27DR-1FFVE1156I is the ideal choice for engineers and organizations looking to leverage the latest advances in programmable SoC technology.

For technical inquiries, pricing information, or to request samples, contact your local AMD Xilinx representative or authorized distributor.