1. Product Specifications
Core Architecture
- Part Number: XCZU29DR-1FSVF1760E
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Zynq UltraScale+ RFSoC
- Process Technology: 20nm FinFET+ node
- Speed Grade: -1 (Standard performance)
- Package Type: FSVF1760 (1760-pin FCBGA)
- Logic Cells: 930,300 equivalent logic cells
- Operating Voltage: 0.85V core voltage
Processing System (PS)
- Application Processing Unit (APU): Quad-core ARM Cortex-A53 64-bit processor
- Real-time Processing Unit (RPU): Dual-core ARM Cortex-R5 32-bit processor
- Maximum Frequency: Up to 1.5 GHz (Cortex-A53), 600 MHz (Cortex-R5)
- Memory Support: DDR4/DDR3L, LPDDR4, QSPI, eMMC, NAND Flash
RF Data Converters
- RF-ADC Channels: Up to 16 channels
- RF-DAC Channels: Up to 16 channels
- Sampling Rate: Up to 4.096 GSPS (ADC), 6.554 GSPS (DAC)
- Resolution: 12-bit ADC, 14-bit DAC
- Excellent noise spectral density for high-fidelity signal processing
Programmable Logic (PL)
- LUT6: 146,880
- Flip-Flops: 293,760
- Block RAM: 1.6 MB
- UltraRAM: 45 MB
- DSP Slices: 4,272 (18×27 multipliers)
High-Speed Connectivity
- Transceivers: 16x GTY transceivers
- Transceiver Speed: Up to 32.75 Gbps per lane
- PCIe Support: PCIe Gen4 x16
- Ethernet: 100G Ethernet MAC
- Interlaken: 150G Interlaken support
I/O and Interfaces
- Total I/O Pins: 832 maximum user I/O
- High-Performance I/O Banks: 12 banks
- Voltage Standards: LVCMOS, LVDS, LVPECL, and more
- SerDes: Integrated high-speed serial transceivers
2. Price
The XCZU29DR-1FSVF1760E is positioned as a premium RFSoC solution with pricing reflecting its advanced capabilities. Contact authorized distributors for current pricing:
- Pricing Model: Volume-based pricing available
- Availability: Contact authorized AMD/Xilinx distributors
- Lead Time: Subject to current market conditions
- Minimum Order Quantity: Varies by distributor
For the most current pricing and availability of the XCZU29DR-1FSVF1760E, please contact:
- Authorized AMD distributors
- Electronic component suppliers
- Direct from AMD sales representatives
Note: Pricing varies based on volume, packaging options, and current market conditions.
3. Documents & Media
Technical Documentation
- Datasheet: Zynq UltraScale+ RFSoC Data Sheet (DS889)
- Technical Reference Manual: UG1085 – Zynq UltraScale+ RFSoC Technical Reference Manual
- Package and Pinout Files: Available from AMD support portal
- Power Analysis Tools: Power Design Manager (PDM)
Software and Development Tools
- Vivado Design Suite: Complete FPGA design environment
- Vitis Unified Software Platform: Software development for embedded applications
- RF Data Converter IP: Pre-verified IP for RF converter configuration
- System Generator: Model-based design for DSP applications
Application Notes and User Guides
- UG1075: Zynq UltraScale+ Package and Pinout Files
- Application notes for 5G wireless applications
- Software-defined radio design guides
- Power optimization guidelines
Evaluation and Development Boards
- RFSoC evaluation boards available
- ZCU111 Evaluation Board (compatible family member)
- Third-party development platforms
4. Related Resources
Compatible Products
- XCZU29DR-2FSVF1760E: Higher speed grade variant (-2)
- XCZU29DR-1FFVF1760E: Alternative package option (FFVF1760)
- XCZU28DR Series: Lower-cost alternative with similar features
- XCZU47DR Series: Higher-end option with additional resources
Development Ecosystem
- IP Portfolio: Extensive library of verified IP cores
- Third-party IP: Partners offering specialized IP solutions
- Reference Designs: Pre-built applications for common use cases
- Community Support: Active developer community and forums
Training and Support
- Technical Training: AMD training courses and webinars
- Design Services: Professional services for custom development
- Technical Support: Comprehensive support through AMD portal
- Documentation Portal: Extensive online documentation library
Application Areas
- 5G Wireless Infrastructure: Base stations, small cells, massive MIMO
- Software-Defined Radio: Cognitive radio, spectrum monitoring
- Test and Measurement: High-speed data acquisition, signal generation
- Aerospace and Defense: Radar systems, electronic warfare, SATCOM
- Cable Infrastructure: DOCSIS 3.1, broadband access equipment
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes, meets RoHS 2011/65/EU requirements
- REACH Compliant: Compliant with REACH regulation
- Lead-free: Pb-free package and assembly process
- Halogen-free: Package meets halogen-free requirements
- Conflict Minerals: Compliant with conflict minerals regulations
Operating Conditions
- Operating Temperature Range:
- Commercial (C): 0ยฐC to +85ยฐC
- Extended (E): -40ยฐC to +100ยฐC
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% (non-condensing)
- Thermal Resistance: Junction-to-case: 0.15ยฐC/W (typical)
Export and Trade Compliance
- ECCN Classification: Subject to US Export Administration Regulations (EAR)
- HTS Code: 8542.31.00.01
- Country of Origin: Various (depends on final assembly)
- Export Restrictions: May require export license for certain destinations
- ITAR Classification: Not subject to ITAR restrictions
Quality and Reliability
- AEC-Q100 Qualified: Automotive-grade versions available
- ISO 9001 Certified: Manufacturing facilities ISO 9001 certified
- Quality Grade: Industrial and automotive grades available
- Reliability Testing: Comprehensive reliability qualification program
- Failure Rate: Low FIT (Failures in Time) rate demonstrated
Packaging and Handling
- Package Type: BGA (Ball Grid Array) with lead-free solder balls
- Moisture Sensitivity Level (MSL): MSL3 (168 hours at 30ยฐC/60% RH)
- ESD Sensitivity: Class 1C (>1000V Human Body Model)
- Packaging Options: Tray, tape and reel available
- Handling Precautions: ESD-sensitive device, proper handling required
The XCZU29DR-1FSVF1760E represents the pinnacle of programmable SoC technology, combining high-performance processing, advanced RF capabilities, and flexible programmable logic in a single device. Its comprehensive feature set makes it the ideal choice for next-generation wireless infrastructure, software-defined radio applications, and high-performance signal processing systems.
