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XCV812E-6BGG560C: High-Performance FPGA Solution

Original price was: $20.00.Current price is: $19.00.

The XCV812E-6BGG560C represents a cutting-edge field-programmable gate array (FPGA) device designed for demanding applications requiring exceptional processing power and flexibility. This advanced semiconductor solution delivers robust performance for telecommunications, industrial automation, and high-speed data processing applications.

Product Specification

The XCV812E-6BGG560C features comprehensive technical specifications that make it ideal for complex digital signal processing tasks. This FPGA incorporates advanced logic elements with high-speed I/O capabilities, supporting various interface standards for seamless integration into existing systems.

Key specifications include optimized power consumption characteristics, extensive memory resources, and configurable logic blocks that enable custom circuit implementations. The device operates across industrial temperature ranges while maintaining signal integrity and processing reliability.

The XCV812E-6BGG560C package configuration provides optimal thermal management and electrical performance, ensuring stable operation in demanding environments. Multiple clock domains and phase-locked loops support precise timing requirements for time-critical applications.

Price

Pricing for the XCV812E-6BGG560C varies based on order quantities, delivery schedules, and specific customer requirements. Volume discounts are typically available for large-scale deployments and OEM partnerships.

For current pricing information and quotations, contact authorized distributors or the manufacturer directly. Pricing may fluctuate based on market conditions, component availability, and regional factors.

Educational and research institutions may qualify for special pricing programs. Long-term supply agreements can provide price stability for production planning and budgeting purposes.

Documents & Media

Comprehensive technical documentation supports the XCV812E-6BGG560C implementation process. The complete datasheet provides detailed electrical characteristics, timing specifications, and mechanical package information.

Application notes demonstrate practical implementation examples and best practices for optimal performance. Reference designs showcase proven circuit topologies and configuration methodologies.

Software development tools include synthesis and place-and-route utilities, simulation environments, and debugging interfaces. Programming guides cover configuration procedures and memory initialization processes.

Design verification resources include timing analysis tools, signal integrity guidelines, and electromagnetic compatibility considerations. Updated documentation reflects the latest silicon revisions and recommended design practices.

Related Resources

The XCV812E-6BGG560C ecosystem includes complementary components and development tools that enhance design efficiency and reduce time-to-market. Compatible memory interfaces, clock management devices, and power supply solutions provide complete system-level support.

Evaluation boards and development kits enable rapid prototyping and proof-of-concept validation. These platforms include reference schematics, layout guidelines, and sample code for common applications.

Third-party IP cores extend functionality with pre-verified modules for digital signal processing, communications protocols, and interface standards. These resources accelerate development while ensuring design reliability.

Training materials and online resources support engineers throughout the design process. Technical support services provide expert assistance for complex implementation challenges and optimization requirements.

Environmental & Export Classifications

The XCV812E-6BGG560C complies with international environmental standards and regulations. RoHS compliance ensures lead-free manufacturing processes and environmentally responsible materials usage.

Operating temperature ranges accommodate industrial and commercial applications across diverse environmental conditions. Humidity and altitude specifications define operational boundaries for reliable performance.

Export classification information addresses international trade requirements and regulatory compliance. These classifications may affect availability in certain geographic regions or application sectors.

Environmental stress testing validates long-term reliability under accelerated aging conditions. Quality assurance processes ensure consistent manufacturing standards and performance characteristics throughout production lifecycles.

The XCV812E-6BGG560C represents a sophisticated FPGA solution combining high performance, flexibility, and reliability for advanced digital systems. Its comprehensive feature set and robust design make it suitable for demanding applications across multiple industry sectors.