XCV812E-6FGG900C – Xilinx Virtex-E Extended Memory FPGA

Product Overview

The XCV812E-6FGG900C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s renowned Virtex-E Extended Memory family. This advanced programmable logic device delivers exceptional processing capabilities with 254,016K gates and 21,168 logic cells, making it an ideal choice for demanding applications requiring high-speed data processing and flexible digital design implementation.

1. Product Specifications

Core Features

• Device Family: Xilinx Virtex-E Extended Memory (EM) Series
• Part Number: XCV812E-6FGG900C
• Logic Capacity: 254,016K Gates
• Logic Elements: 21,168 Cells
• Maximum Operating Frequency: 357MHz
• Process Technology: 0.18μm CMOS
• Supply Voltage: 1.8V (1.71V – 1.89V operating range)

Package Details

• Package Type: 900-Pin Fine-Pitch Ball Grid Array (FBGA)
• Package Designation: FGG900
• Total Pin Count: 900 pins
• I/O Count: 556 Input/Output pins
• Mounting Type: Surface Mount Technology (SMT)

Memory Configuration

• RAM Capacity: 140kB (1,146,880 RAM bits)
• Logic Array Blocks (LABs): 4,704 CLBs
• Speed Grade: -6 (Commercial grade)

Operating Conditions

• Operating Temperature Range: 0°C to +85°C (TJ – Junction Temperature)
• Voltage Supply: 1.71V to 1.89V
• Package Thermal Characteristics: Optimized for high-performance applications

2. Pricing Information

Current Market Pricing:

• Pricing varies by distributor and quantity
• Available from multiple authorized distributors worldwide
• Request quote (RFQ) basis for volume purchases
• Competitive pricing available through global electronics distributors

Availability:

• In stock at major distributors including Heisener (17,424+ pieces), IC-Components, and Xecor
• New original manufacturer parts available
• Lead times vary by supplier (typically 2-4 days for standard delivery)

3. Documents & Media

Technical Documentation

• Official Datasheet: Available from Xilinx/AMD and authorized distributors
• Pin Configuration: 900-pin FBGA pinout documentation
• Programming Guides: Compatible with Xilinx development tools
• Application Notes: Available for specific implementation scenarios

Development Resources

• Design Tools: Compatible with Xilinx Vivado Design Suite and ISE tools
• Programming Software: Supports standard Xilinx programming interfaces
• Reference Designs: Available through Xilinx design libraries
• Technical Support: Professional engineering support available from distributors

Media Files

• Product Images: High-resolution package images available
• 3D Models: CAD models for PCB design integration
• Simulation Models: SPICE and behavioral models available

4. Related Resources

Compatible Development Boards

• ZedBoard development platform
• Basys 3 FPGA board
• Nexys4-DDR development board
• Custom evaluation boards from third-party manufacturers

Alternative Parts

• XCV812E-6FG900I: Industrial temperature grade variant (-40°C to +100°C)
• XCV812E-6BG560C: 560-pin BGA package alternative
• XCV812E-7FGG900C: -7 speed grade option
• XCV812E-8FGG900C: -8 speed grade for higher performance

Application Areas

• High-Speed Digital Signal Processing
• Communications Infrastructure
• Industrial Automation and Control
• Test and Measurement Equipment
• Video Processing Applications
• Embedded System Design
• Prototyping and Development

Technical Support

• Global network of Xilinx-certified design partners
• Community forums and knowledge base
• Professional consulting services available
• Training courses and certification programs

5. Environmental & Export Classifications

Environmental Compliance

• RoHS Status: Non-compliant (contains restricted substances typical of legacy products)
• REACH Compliance: Subject to European chemical regulations
• Environmental Rating: Standard commercial grade
• Packaging: ESD-safe packaging with anti-static protection

Export Control Information

• ECCN Classification: Subject to export control regulations
• Country of Origin: Manufactured in Xilinx/AMD facilities
• Export Restrictions: May require export licenses for certain destinations
• Dual-Use Technology: Subject to international trade regulations

Quality Standards

• ISO Compliance: Manufactured under ISO quality standards
• Reliability Testing: Extensive qualification and reliability testing
• Warranty Period: Standard manufacturer warranty (varies by distributor)
• Quality Assurance: 100% factory testing and quality control

Disposal and Recycling

• WEEE Directive: Electronic waste recycling requirements apply
• Material Content: Lead-containing solder (non-RoHS)
• Recycling Guidelines: Follow local electronic waste disposal regulations
• Environmental Impact: Standard semiconductor environmental profile

---

Why Choose XCV812E-6FGG900C?

The XCV812E-6FGG900C represents proven FPGA technology from Xilinx’s successful Virtex-E family. With its substantial logic capacity, high-speed performance, and robust 900-pin package, this device offers excellent value for established designs requiring reliable, high-performance programmable logic solutions.

Key Benefits:

• ✅ High logic density with 254K gates
• ✅ Proven reliability in demanding applications
• ✅ Extensive development tool support
• ✅ Wide availability from multiple distributors
• ✅ Cost-effective solution for volume production
• ✅ Compatible with existing Virtex-E design infrastructure

Contact authorized distributors for current pricing, availability, and technical support for your XCV812E-6FGG900C requirements.