1. Product Specifications
Core Architecture
- Product Family: Zynq UltraScale+ RFSoC
- Part Number: XCZU29DR-1FSVF1760I
- Logic Cells: 930,300 cells
- Processing System: 64-bit quad-core ARM Cortex-A53 (APU) + dual-core ARM Cortex-R5 (RPU)
- Technology Node: 20nm FinFET process
- Operating Voltage: 0.85V core voltage
Package Details
- Package Type: FSVF1760 (Flip-Chip Stacked Very Fine Pitch BGA)
- Pin Count: 1,760 pins
- Package Size: High-density BGA configuration
- Speed Grade: -1 (Commercial grade)
- Temperature Grade: I (Industrial: -40ยฐC to +100ยฐC)
RF Data Converters
- RF-ADC Channels: Up to 16 channels with excellent noise spectral density
- RF-DAC Channels: Up to 16 channels for direct RF synthesis
- Sample Rates: Multi-GSPS capability for wideband applications
- Resolution: High-resolution converters for precision applications
Connectivity & I/O
- High-Speed Transceivers: GTY transceivers for multi-gigabit communication
- PCIe Support: PCIe Gen3/Gen4 capability
- Ethernet: 100G Ethernet support
- Interlaken: 150G Interlaken interface support
- Memory Interfaces: DDR4/DDR3L support with high bandwidth
Key Features
- Integrated RF signal chain eliminates external components
- Multiband, multi-mode cellular radio support
- Cable infrastructure (DOCSIS) applications
- Advanced DSP slices for signal processing
- Hardware security features
- Power management and optimization
2. Pricing Information
Current Market Pricing (Subject to change based on quantity and supplier):
- Unit pricing varies significantly based on order quantity
- Volume discounts available for orders of 100+ units
- Extended lead times may affect pricing
- Contact authorized distributors for current quotes
Pricing Factors:
- Order quantity (significant volume discounts available)
- Lead time requirements
- Package and temperature grade specifications
- Regional availability and import/export considerations
Note: Prices fluctuate based on market conditions. For current pricing, contact authorized AMD/Xilinx distributors or use electronic component search engines.
3. Documents & Media
Technical Documentation
- Datasheet: DS889 – Zynq UltraScale+ RFSoCs Data Sheet
- User Guides: UG1075 – Zynq UltraScale+ Package and Pinout Guide
- Reference Manuals: Architecture and programming references
- Application Notes: Design guidelines and best practices
Design Resources
- Pinout Files: Available in CSV and TXT formats
- Package Information: Mechanical drawings and specifications
- Schematic Symbols: For CAD software integration
- 3D Models: For mechanical design verification
Software Support
- Vivado Design Suite: Primary development environment
- Vitis Unified Software Platform: Application development
- Model Composer: DSP algorithm development
- System Generator: MATLAB/Simulink integration
4. Related Resources
Development Platforms
- ZCU216 Evaluation Kit: Complete development platform for XCZU29DR
- ZCU208 Evaluation Kit: Alternative evaluation platform
- Custom Development Boards: Available from third-party vendors
Reference Designs
- 5G New Radio (NR) reference designs
- Massive MIMO implementations
- Beamforming applications
- Software Defined Radio (SDR) examples
Support Resources
- AMD Developer Zone: Online resources and community
- Technical Support: Direct engineering support
- Training Materials: Webinars and documentation
- Community Forums: User discussions and solutions
Compatible Components
- Memory Solutions: DDR4 SODIMM modules
- Clock Management: Low-jitter oscillators and PLLs
- Power Management: Switching regulators and LDOs
- RF Components: Baluns, filters, and amplifiers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical safety regulations
- Conflict Minerals: Compliant with conflict minerals reporting requirements
- Halogen-Free: Available in halogen-free package options
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Vibration/Shock: Meets JEDEC standards
Export Control Classification
- ECCN: Check current Export Administration Regulations (EAR)
- Export Restrictions: May require export licenses for certain countries
- ITAR Classification: Verify current International Traffic in Arms Regulations status
- Country of Origin: Manufactured under strict quality controls
Quality & Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extensive qualification testing per JEDEC standards
- Traceability: Full supply chain traceability
- Lifecycle Support: Long-term availability and support commitment
Package Markings
- Device Marking: Includes part number, speed grade, and date code
- MSL Rating: Moisture Sensitivity Level classification
- Lead-Free: Pb-free package construction
- Lot Traceability: Unique lot identification for quality control
Keywords: XCZU29DR-1FSVF1760I, Zynq UltraScale+ RFSoC, AMD FPGA, RF data converters, 5G infrastructure, wireless communication, programmable logic, ARM Cortex-A53, industrial FPGA, high-speed communication
For the latest specifications, pricing, and availability of the XCZU29DR-1FSVF1760I, contact authorized AMD distributors or visit the official AMD documentation portal.
