1. Product Specifications
Core Architecture
- Family: Zynq UltraScale+ RFSoC
- Process Technology: 20nm Technology
- Logic Cells: 930,300 Cells
- Operating Voltage: 0.85V
Processing System
- Application Processing Unit (APU): 64-bit quad-core Arm Cortex-A53
- Real-time Processing Unit (RPU): dual-core Arm Cortex-R5
RF Data Converter Integration
- RF-ADCs: Up to 16 channels of RF-ADCs
- RF-DACs: Up to 16 channels of RF-DACs
- Performance: Excellent noise spectral density
Package Information
- Package Type: 1760-Pin FCBGA
- Package Code: FFVF1760
- Speed Grade: -1
Connectivity and I/O
- High-Speed Interfaces: I/O, Transceiver, PCIe, 100G Ethernet, and 150G Interlaken
2. Price Information
The XCZU29DR-1FFVF1760I is available through multiple authorized distributors worldwide. Pricing comparison is available from 5 distributors with bulk discount options. For current pricing and availability:
- Real-time Pricing: Available through electronic component distributors
- Bulk Discounts: Volume pricing available for quantity orders
- Quote Requests: Contact authorized distributors for custom pricing
Note: Prices vary by distributor, quantity, and market conditions. Contact suppliers directly for current quotes.
3. Documents & Media
Technical Documentation
- Product Datasheet: Official AMD/Xilinx datasheet with complete specifications
- Package Pinout Files: ASCII package files in TXT and CSV formats
- User Guides: Implementation and design guides
- Application Notes: Best practices and design recommendations
Design Tools and Software
- Vivado Design Suite: User-friendly synthesis and implementation tools
- Development Environment: Complete toolchain for FPGA development
- Programming Tools: Hardware configuration and debugging utilities
Media Resources
- Reference designs and evaluation materials
- Technical documentation in PDF format
- Implementation guides and tutorials
4. Related Resources
Development Platforms
While specific development boards for the XCZU29DR-1FFVF1760I may vary, the Zynq UltraScale+ ecosystem includes:
- Evaluation Kits: RFSoC development and evaluation platforms
- Starter Kits: Entry-level development solutions
- Reference Designs: Pre-built application examples
Application Areas
The XCZU29DR-1FFVF1760I is optimized for:
- Wireless Infrastructure: Multiband, multi-mode cellular radios
- Cable Infrastructure: DOCSIS applications
- Software-Defined Radio (SDR): High-performance RF signal processing
- 5G/6G Communications: Next-generation wireless systems
- Aerospace and Defense: Mission-critical RF applications
Technical Support
- FPGA technical engineering support
- Pinout information and replacement guidance
- Programming tools assistance
- Design consultation services
5. Environmental & Export Classifications
Operating Conditions
- Temperature Grade: Industrial temperature range
- Voltage Rating: 0.85V core voltage
- Package Compliance: Industry-standard FCBGA packaging
Regulatory Compliance
- RoHS Compliant: Meets environmental standards
- Quality Standards: Manufactured to aerospace and automotive quality requirements
- Export Classification: Subject to export control regulations
Environmental Specifications
- Process Technology: Advanced 20nm manufacturing process
- Power Efficiency: Optimized for low-power applications
- Thermal Management: Designed for efficient heat dissipation
Quality and Reliability
- Manufacturing Standards: ISO 9001 certified facilities
- Testing: Comprehensive functional and parametric testing
- Traceability: Full component traceability and documentation
Keywords: XCZU29DR-1FFVF1760I, Zynq UltraScale+ RFSoC, FPGA, AMD Xilinx, RF data converters, cellular infrastructure, DOCSIS, ARM Cortex-A53, programmable logic, 5G communications
Part Number: XCZU29DR-1FFVF1760I
Manufacturer: AMD (formerly Xilinx)
Category: Field Programmable Gate Arrays – FPGAs
Status: Production
