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XCVU47P-3FSVH2892E: High-Performance Xilinx Virtex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

Product Specifications

The XCVU47P-3FSVH2892E features cutting-edge architecture optimized for maximum throughput and efficiency:

Core Specifications:

  • Logic Cells: 4,743,000 system logic cells
  • CLB Flip-Flops: 9,486,400 configurable logic blocks
  • CLB LUTs: 4,743,200 lookup tables
  • Block RAM: 38,304 Kb total block RAM
  • UltraRAM: 540,000 Kb UltraRAM memory
  • DSP Slices: 9,024 DSP48E2 slices for high-speed signal processing
  • Speed Grade: -3 (highest performance grade)
  • Package: FSVH2892 (2892-pin flip chip BGA)
  • Operating Temperature: Extended commercial (0ยฐC to 85ยฐC)

Advanced Features:

  • 16nm FinFET+ process technology
  • Integrated PCIe Gen4 x16 interfaces
  • 100G Ethernet MACs
  • High-speed serial transceivers (GTY and GTM)
  • ARM Cortex-A53 processing system (where applicable)
  • Advanced security features including AES and SHA authentication

The XCVU47P-3FSVH2892E delivers industry-leading performance per watt, making it ideal for applications requiring massive parallel processing capabilities and ultra-low latency requirements.

Price

Pricing for the XCVU47P-3FSVH2892E varies based on quantity, distributor, and current market conditions. This high-end FPGA typically falls within the premium price range due to its advanced specifications and capabilities.

For current pricing information on the XCVU47P-3FSVH2892E:

  • Contact authorized Xilinx distributors
  • Request quotes through official Xilinx sales channels
  • Check major electronic component suppliers for availability
  • Consider evaluation pricing for development and prototyping phases

Volume discounts and long-term supply agreements may be available for production quantities of the XCVU47P-3FSVH2892E.

Documents & Media

Comprehensive technical documentation supports the XCVU47P-3FSVH2892E development process:

Essential Documentation:

  • Product datasheet with complete electrical specifications
  • Package and pinout documentation for FSVH2892 package
  • DC and AC switching characteristics
  • Power consumption and thermal management guidelines
  • Migration guides from previous Virtex generations

Development Resources:

  • Reference designs and application notes
  • Xilinx Vivado Design Suite compatibility information
  • IP core libraries and example implementations
  • Board design guidelines and layout recommendations
  • Signal integrity analysis tools and models

Multimedia Resources:

  • Product overview videos and technical presentations
  • Webinar recordings covering advanced features
  • Training materials for XCVU47P-3FSVH2892E optimization
  • Community forums and technical support resources

Related Resources

The XCVU47P-3FSVH2892E ecosystem includes comprehensive tools and support:

Development Tools:

  • Xilinx Vivado Design Suite (latest version recommended)
  • Vitis unified software platform
  • Hardware debugging and analysis tools
  • Simulation and verification environments

Evaluation Platforms:

  • Development boards featuring XCVU47P-3FSVH2892E
  • Reference designs for common applications
  • Starter kits and evaluation modules
  • Third-party development platforms

Support Resources:

  • Technical support through Xilinx channels
  • Community forums and knowledge base
  • Training programs and certification courses
  • Partner ecosystem for specialized solutions

Complementary Products:

  • Compatible memory solutions and interfaces
  • Power management solutions
  • Cooling and thermal management systems
  • Programming and configuration devices

Environmental & Export Classifications

The XCVU47P-3FSVH2892E meets stringent environmental and regulatory standards:

Environmental Compliance:

  • RoHS (Restriction of Hazardous Substances) compliant
  • REACH regulation compliance for European markets
  • Halogen-free package options available
  • Lead-free manufacturing processes

Export Classifications:

  • Export Control Classification Number (ECCN) as designated by BIS
  • Subject to U.S. export administration regulations
  • International traffic in arms regulations (ITAR) considerations
  • Country-specific import/export requirements may apply

Quality Standards:

  • ISO 9001 certified manufacturing
  • Automotive quality standards (where applicable)
  • Military and aerospace qualification options
  • Extended temperature and reliability testing

Packaging and Handling:

  • Moisture sensitivity level (MSL) rating
  • Anti-static packaging requirements
  • Storage and handling guidelines
  • Traceability and lot identification systems

The XCVU47P-3FSVH2892E represents the pinnacle of FPGA technology, combining massive logic capacity with advanced features to enable next-generation applications across multiple industries. Its robust environmental qualifications and comprehensive support ecosystem make it an ideal choice for mission-critical applications requiring the highest levels of performance and reliability.