Product Specifications
Core Architecture
- Device Family: Virtex UltraScale+
- Part Number: XCVU45P-2FSVH2104E
- Speed Grade: -2 (Standard performance)
- Package Type: FSVH2104 (Fine-pitch Staggered Via BGA)
- Pin Count: 2104 pins
- Operating Temperature: Extended (-40ยฐC to +100ยฐC)
Logic Resources
- Logic Cells: 5,541,000 system logic cells
- CLB Flip-Flops: 2,364,480
- CLB LUTs: 1,182,240
- Distributed RAM: 346 Kb
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb high-density memory
Processing Power
- DSP Slices: 5,952 DSP48E2 slices
- Peak DSP Performance: Up to 1.5 TOPS (int8)
- Maximum User I/O: 832 pins
- PCIe Gen4 x16: Up to 4 integrated blocks
- Ethernet: 100G Ethernet MAC support
Connectivity & Interfaces
- Transceivers: Up to 80 GTY transceivers
- Transceiver Speed: Up to 32.75 Gbps per channel
- Memory Interfaces: DDR4-2400, DDR4-2666 support
- SerDes Technology: Advanced 7nm FinFET+ process
Price
The XCVU45P-2FSVH2104E is positioned as a premium FPGA solution with pricing typically ranging from $8,000 to $12,000 per unit, depending on volume and distribution channel. Contact authorized Xilinx distributors for current pricing and availability. Volume discounts are available for production quantities.
Pricing Factors:
- Order quantity and volume commitments
- Lead times and delivery requirements
- Technical support and development tool licensing
- Regional market variations
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and timing parameters
- User Guide: Comprehensive implementation and design guidelines
- Reference Manual: Detailed architecture and programming information
- Package Drawing: Mechanical specifications and pin assignments
- Migration Guide: Upgrade path from previous FPGA generations
Development Resources
- Vivado Design Suite: Complete development environment
- IP Catalog: Pre-verified intellectual property cores
- Application Notes: Design best practices and optimization techniques
- White Papers: Performance benchmarks and use case studies
- Video Tutorials: Step-by-step design implementation guides
Quality Documentation
- Quality and Reliability Report: Comprehensive testing data
- MSL Rating: Moisture sensitivity level classifications
- RoHS Compliance: Environmental compliance certificates
Related Resources
Development Boards
- VCU128 Evaluation Kit: Full-featured development platform
- Custom Carrier Boards: Third-party development solutions
- Prototyping Modules: Rapid design validation tools
Software Tools
- Vivado HLS: High-level synthesis for C/C++/SystemC
- Vitis Unified Platform: Acceleration development environment
- System Generator: Model-based design for DSP applications
- ChipScope Pro: Real-time debugging and analysis
Support Ecosystem
- Xilinx Alliance Partners: Certified design service providers
- IP Partner Program: Third-party IP solutions
- Training Programs: Comprehensive educational resources
- Technical Support: 24/7 global engineering assistance
Application Areas
- 5G Wireless Infrastructure: Baseband processing and beamforming
- Aerospace & Defense: Radar, SIGINT, and secure communications
- Data Center Acceleration: AI inference and high-frequency trading
- Test & Measurement: High-speed protocol analysis
- Broadcasting: 4K/8K video processing and streaming
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Directive 2011/65/EU requirements
- REACH Compliant: Complies with European chemical regulations
- Conflict Minerals: Sourced from conflict-free supply chains
- Halogen-Free: Environmentally responsible packaging materials
Export Control Classifications
- ECCN: 3A991.a.2 (US Export Administration Regulations)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Manufactured in advanced semiconductor facilities
- Export Restrictions: Subject to technology transfer controls
Quality Standards
- AEC-Q100 Qualified: Automotive electronics reliability standards
- ISO 9001: Quality management system certification
- AS9100: Aerospace quality management standards
- IPC Standards: PCB assembly and soldering specifications
Reliability Data
- MTBF: Mean time between failures exceeding 1,000,000 hours
- Operating Life: 20+ years under specified conditions
- Qualification Testing: Comprehensive stress and endurance validation
- Supply Chain: Secure and traceable component sourcing
The XCVU45P-2FSVH2104E represents the pinnacle of FPGA technology, combining massive parallel processing capabilities with advanced connectivity options. This device enables system architects to implement complex algorithms and high-speed interfaces in a single, programmable solution, making it ideal for next-generation applications demanding ultimate performance and flexibility.
