Product Specifications
The XCVU35P-2FSVH2104E features advanced 20nm FinFET+ technology, providing superior power efficiency and performance density. This FPGA includes approximately 870,000 logic cells and 1,728 DSP slices, making it ideal for complex signal processing and computational workloads.
Key specifications of the XCVU35P-2FSVH2104E include:
- Logic Cells: ~870K system logic cells
- DSP Slices: 1,728 DSP48E2 slices
- Block RAM: 52.9 Mb total block RAM
- Package: FSVH2104 (Flip-Chip, Staggered Via BGA)
- Speed Grade: -2 (standard performance)
- I/O Pins: Up to 832 user I/Os
- Memory Controllers: DDR4-2666 support
- PCIe: Gen3 x16 and Gen4 x8 support
The XCVU35P-2FSVH2104E operates across commercial temperature ranges and supports various voltage standards, ensuring compatibility with diverse system requirements.
Price
Pricing for the XCVU35P-2FSVH2104E varies based on quantity, distribution channel, and current market conditions. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume discounts are typically available for large-scale deployments. Lead times may vary depending on global supply chain conditions.
Documents & Media
Comprehensive technical documentation supports the XCVU35P-2FSVH2104E implementation:
Technical Documentation:
- Product datasheet with complete electrical specifications
- Package and pinout documentation for FSVH2104 package
- PCB design guidelines and layout recommendations
- Power estimation and thermal management guides
Design Resources:
- Vivado Design Suite compatibility information
- IP core integration guides
- Reference designs and application notes
- Development board specifications and schematics
Software Tools:
- Vivado Design Suite support for synthesis and implementation
- Vitis unified software platform compatibility
- Hardware debugging and verification tools
Related Resources
The XCVU35P-2FSVH2104E integrates seamlessly with AMD Xilinx’s comprehensive ecosystem:
Development Platforms:
- VCU128 evaluation board for rapid prototyping
- Third-party development modules and carrier cards
- Custom evaluation platforms from ecosystem partners
IP Portfolio:
- Extensive library of verified IP cores
- Memory controllers and interface IP
- DSP and math function libraries
- Connectivity and networking IP cores
Design Services:
- AMD Xilinx Alliance Program partners
- Professional design services and consulting
- Training and certification programs
- Technical support and customer service
Environmental & Export Classifications
The XCVU35P-2FSVH2104E meets stringent environmental and regulatory standards:
Environmental Compliance:
- RoHS compliant lead-free package
- REACH regulation compliance
- Conflict minerals reporting compliance
- ISO 14001 environmental management certification
Quality Standards:
- Commercial temperature grade: 0ยฐC to +85ยฐC junction temperature
- Industrial temperature options available
- Qualification per JEDEC standards
- Automotive-grade variants for specific applications
Export Classifications:
- Export Control Classification Number (ECCN) varies by configuration
- International Traffic in Arms Regulations (ITAR) considerations
- Dual-use technology export licensing requirements
- Country-specific import/export documentation
The XCVU35P-2FSVH2104E represents the pinnacle of FPGA technology, combining high performance, power efficiency, and comprehensive tool support to accelerate innovation across multiple industries. Its robust feature set and extensive ecosystem support make it an ideal choice for next-generation applications requiring maximum computational flexibility and performance.
