1. Product Specifications
Core Architecture
- Device Family: Virtex UltraScale+ HBM FPGA
- Manufacturer: AMD (formerly Xilinx)
- Part Number: XCVU35P-3FSVH2892E
- Speed Grade: -3 (Highest Performance)
- Process Technology: 16nm FinFET
- Package Type: 2892-pin Flip-Chip Ball Grid Array (FCBGA)
- Operating Temperature: Extended range (-40ยฐC to +100ยฐC)
Logic Resources
- Logic Cells: 1,906,800 cells
- Configurable Logic Blocks (CLBs): 89,520
- Logic Elements: 1,566,600
- Look-Up Tables (LUTs): Advanced 6-input LUTs
- Flip-Flops: High-speed registers for sequential logic
Memory Specifications
- Total On-Chip Memory: Up to 500 Mb integrated memory
- High Bandwidth Memory (HBM): Up to 16 GB HBM Gen2
- Memory Bandwidth: 460 GB/s HBM bandwidth
- Block RAM: Multiple sizes for flexible memory hierarchy
- UltraRAM: Advanced memory blocks for large data buffering
DSP and I/O Features
- DSP Slices: High-performance DSP blocks for signal processing
- I/O Pins: 416 user I/O pins
- High-Speed Transceivers: Up to 32.75 Gbps capability
- PCIe Support: Gen3 x16 integrated PCIe block
- DDR4 Support: Up to 2,666 Mb/s memory interface
Power and Performance
- Core Voltage (VCCINT): 0.85V standard operation
- Low Power Options: 0.72V operation for reduced power consumption
- Power Efficiency: Optimized for high-performance/watt ratio
- Thermal Management: Advanced thermal design for sustained performance
2. Pricing Information
Market Pricing
- Typical Price Range: $45,000 – $65,000 USD (varies by distributor and quantity)
- Volume Discounts: Available for large quantity orders
- Lead Time: 12-20 weeks standard delivery
- Minimum Order Quantity: 1 piece available from authorized distributors
Pricing Factors
- Market demand and semiconductor availability
- Speed grade and package options
- Regional distributor pricing
- Volume purchase agreements
- Current market conditions
Note: Prices are subject to change based on market conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Datasheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive design and implementation guide
- Product Brief: Overview of key features and benefits
- Selection Guide: Comparison with other Virtex UltraScale+ devices
- Pin Assignment Guide: Detailed pin configuration documentation
Design Resources
- Reference Designs: Pre-built designs for common applications
- Application Notes: Implementation guidance for specific use cases
- Vivado Design Suite: Complete development environment
- IP Cores: Pre-verified intellectual property blocks
- Board Support Packages: Ready-to-use hardware abstractions
Development Tools
- Vivado Design Suite: Primary development environment
- Model Composer: High-level synthesis tools
- Vitis Unified Software Platform: Application acceleration framework
- Hardware Debug Tools: ChipScope and other debugging utilities
4. Related Resources
Development Platforms
- VCU128 Evaluation Board: Complete development platform featuring VU37P
- Alveo Data Center Cards: Production-ready acceleration cards
- Custom Carrier Boards: Third-party development platforms
- Evaluation Modules: Smaller form-factor evaluation options
Compatible Technologies
- HBM Controller IP: Integrated memory controller solutions
- 100G Ethernet MAC: High-speed networking IP
- Video Processing IP: Codecs and video processing blocks
- AI/ML IP: Machine learning acceleration IP cores
- Signal Processing IP: DSP and communications IP
Software Ecosystem
- Vitis AI: Machine learning inference optimization
- Vitis Video SDK: Video processing acceleration
- OpenCL Support: Heterogeneous computing framework
- Linux Drivers: Operating system support packages
Support Resources
- AMD Support Community: Online forums and knowledge base
- Technical Support: Direct engineering support services
- Training Programs: Design methodology and tool training
- Certification Programs: Professional development courses
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- REACH Compliant: Complies with EU chemical regulation
- Conflict Minerals: Compliant with conflict minerals regulations
- ISO 14001: Environmental management system compliance
- Green Packaging: Environmentally friendly packaging materials
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Extended commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 3,000 meters operational
- Vibration: MIL-STD-810 compliant
Export Classifications
- Export Control Classification Number (ECCN): 3A001.a.7
- Country of Origin: Manufactured in various AMD/TSMC facilities
- Export License: May require export license for certain countries
- Dual-Use Technology: Subject to export administration regulations
- End-Use Restrictions: Restrictions apply for military/defense applications
Quality and Reliability
- Automotive Grade: Available in automotive-qualified versions
- Industrial Grade: Extended temperature and reliability specifications
- Military/Aerospace: Screened versions available for defense applications
- Quality Standards: ISO 9001, AS9100 manufacturing quality systems
- Reliability Testing: Comprehensive qualification and reliability testing
Packaging and Handling
- ESD Protection: Electrostatic discharge protection required
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- Anti-Static Packaging: Specialized packaging for component protection
- Traceability: Full lot traceability for quality control
- Handling Guidelines: Specific handling procedures for optimal reliability
Key Applications
The XCVU35P-3FSVH2892E excels in demanding applications including:
- Artificial Intelligence & Machine Learning: Real-time inference acceleration
- 5G Infrastructure: Baseband processing and beamforming
- Video Processing: 4K/8K transcoding and streaming
- High-Frequency Trading: Ultra-low latency financial applications
- Radar & Defense Systems: Signal processing and electronic warfare
- Data Center Acceleration: Compute-intensive workload acceleration
- Network Infrastructure: High-throughput packet processing
Why Choose XCVU35P-3FSVH2892E?
This flagship FPGA delivers unmatched performance with 460 GB/s memory bandwidth, advanced DSP capabilities, and the flexibility to adapt to evolving requirements. The integrated HBM memory eliminates external memory bottlenecks while reducing system complexity and power consumption.
For technical specifications, pricing, and availability, contact authorized AMD distributors or visit the official AMD website for the most current information.
