The XCV812E-7FG900C represents a cutting-edge field-programmable gate array (FPGA) designed for demanding applications requiring exceptional processing power and flexibility. This advanced programmable logic device delivers superior performance characteristics while maintaining energy efficiency, making it an ideal choice for complex digital signal processing, telecommunications, and high-speed computing applications.
Product Specifications
The XCV812E-7FG900C features a robust architecture built on advanced semiconductor technology. This FPGA incorporates thousands of configurable logic blocks, providing designers with the flexibility to implement custom digital circuits tailored to specific application requirements. The device supports high-speed I/O operations and includes dedicated memory blocks for efficient data storage and retrieval.
Key technical specifications of the XCV812E-7FG900C include high-density logic capacity, multiple clock domains for complex timing requirements, and integrated DSP slices for mathematical operations. The device operates across industrial temperature ranges, ensuring reliable performance in challenging environments. Power management features help optimize energy consumption while maintaining peak performance levels.
The XCV812E-7FG900C utilizes a fine-pitch ball grid array (BGA) package configuration, enabling high pin density and superior electrical characteristics. This packaging approach facilitates efficient heat dissipation and supports high-frequency signal integrity requirements essential for advanced applications.
Pricing Information
Pricing for the XCV812E-7FG900C varies based on order quantity, delivery requirements, and specific customer configurations. Volume pricing is available for large-scale deployments, with significant cost reductions for orders exceeding standard quantity breaks. Educational institutions and research organizations may qualify for special academic pricing programs.
For current pricing information on the XCV812E-7FG900C, contact authorized distributors or submit a quote request through official channels. Pricing includes standard warranty coverage and technical support services. Extended warranty options and premium support packages are available for mission-critical applications requiring additional coverage.
Documents & Media
Comprehensive technical documentation supports the XCV812E-7FG900C throughout the design and implementation process. The complete datasheet provides detailed electrical specifications, timing characteristics, and package information essential for PCB design and system integration. Application notes offer practical guidance for common implementation scenarios and design optimization techniques.
Development tools and software packages specifically designed for the XCV812E-7FG900C streamline the design process from initial concept through final implementation. These tools include synthesis software, simulation environments, and debugging utilities that accelerate development timelines while ensuring design reliability.
Reference designs and evaluation boards demonstrate the capabilities of the XCV812E-7FG900C in real-world applications. These resources provide working examples that designers can modify and adapt for their specific requirements, reducing development risk and time-to-market.
Related Resources
The XCV812E-7FG900C ecosystem includes complementary components and development resources that enhance system capabilities. Compatible memory interfaces, high-speed transceivers, and specialized I/O components work seamlessly with this FPGA to create comprehensive solutions for complex applications.
Training materials and educational resources help engineers maximize the potential of the XCV812E-7FG900C. Online tutorials, video presentations, and hands-on workshops provide valuable learning opportunities for both novice and experienced FPGA designers. Technical forums and community resources offer peer support and knowledge sharing opportunities.
Third-party IP cores and design services extend the functionality of the XCV812E-7FG900C beyond standard capabilities. These resources include pre-verified functional blocks, custom design services, and specialized consulting support for challenging implementation requirements.
Environmental & Export Classifications
The XCV812E-7FG900C meets stringent environmental standards and regulatory requirements for global deployment. RoHS compliance ensures the device meets lead-free manufacturing requirements, while REACH compliance addresses chemical substance regulations in European markets. These certifications demonstrate the manufacturer’s commitment to environmental responsibility and regulatory compliance.
Export classification information for the XCV812E-7FG900C provides guidance for international shipments and compliance with trade regulations. The device classification includes ECCN (Export Control Classification Number) details and HTS (Harmonized Tariff Schedule) codes required for customs documentation and regulatory compliance.
Temperature cycling, humidity resistance, and vibration testing ensure the XCV812E-7FG900C performs reliably across diverse operating environments. These qualification tests validate the device’s suitability for automotive, industrial, and aerospace applications where environmental stress factors demand exceptional reliability and durability.
The XCV812E-7FG900C represents an advanced solution for engineers and system designers requiring high-performance programmable logic capabilities. Its combination of technical excellence, comprehensive support resources, and regulatory compliance makes it an optimal choice for next-generation electronic systems across multiple industry sectors.
