Product Specification
The XC6VHX250T-3FFG1154C is a cutting-edge Field Programmable Gate Array (FPGA) from Xilinx’s Virtex-6 HXT family, engineered for demanding high-performance applications. This advanced FPGA combines exceptional processing power with flexible programmability, making it ideal for telecommunications, aerospace, defense, and high-speed digital signal processing applications.
Key Technical Specifications:
- Logic Cells: 241,152 logic cells providing extensive computational capacity
- System Gates: Approximately 6 million system gates for complex design implementation
- Block RAM: 14,976 Kb of dedicated block RAM for efficient data storage and buffering
- DSP Slices: 768 DSP48E1 slices optimized for high-speed mathematical operations
- Package Type: FFG1154 – Fine-pitch Ball Grid Array with 1154 pins
- Speed Grade: -3 (fastest commercial speed grade available)
- Operating Temperature: Commercial grade (0ยฐC to +85ยฐC)
- Supply Voltage: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
- I/O Standards: Support for multiple I/O standards including LVDS, SSTL, HSTL
- Configuration: Multiple configuration options including SelectMAP, SPI, BPI
The XC6VHX250T-3FFG1154C features advanced 40nm process technology, delivering superior performance per watt while maintaining excellent signal integrity. The HXT designation indicates this device includes high-speed transceivers capable of operating at multi-gigabit data rates.
Price
Pricing for the XC6VHX250T-3FFG1154C varies based on quantity, distribution channel, and current market conditions. As a high-end FPGA solution, this device typically falls into the premium pricing category due to its advanced capabilities and specialized applications.
Pricing Considerations:
- Volume Discounts: Significant price reductions available for large quantity orders
- Distribution Partners: Authorized distributors may offer competitive pricing and support
- Lifecycle Status: Pricing may be affected by product lifecycle and availability
- Regional Variations: Costs may vary by geographic region and local market conditions
For current pricing information and volume quotes, contact authorized Xilinx distributors or visit the official Xilinx website. Educational and research institutions may qualify for special academic pricing programs.
Documents & Media
Comprehensive technical documentation and resources are available for the XC6VHX250T-3FFG1154C to support design, implementation, and deployment:
Essential Documentation:
- Datasheet: Complete electrical and timing specifications
- User Guide: Detailed implementation guidelines and best practices
- Package Information: Mechanical drawings, pinout diagrams, and thermal data
- Migration Guide: Information for upgrading from previous FPGA generations
- Power Estimation Tools: Utilities for calculating power consumption and thermal requirements
Development Resources:
- Reference Designs: Pre-validated designs demonstrating key features
- Application Notes: Specialized implementation guidance for specific use cases
- Errata Documents: Known issues and recommended workarounds
- Characterization Reports: Detailed performance analysis and benchmarks
All documentation is available through the Xilinx website and authorized distribution partners. Regular updates ensure designers have access to the latest information and improvements.
Related Resources
The XC6VHX250T-3FFG1154C ecosystem includes extensive development tools, evaluation platforms, and complementary products:
Development Tools:
- Vivado Design Suite: Complete FPGA design environment with synthesis, implementation, and debugging capabilities
- ISE Design Suite: Legacy development environment with continued support
- IP Catalog: Extensive library of pre-verified intellectual property cores
- System Generator: High-level modeling and code generation tools
Evaluation Platforms:
- Development Boards: Purpose-built evaluation platforms featuring the XC6VHX250T-3FFG1154C
- FMC Modules: FPGA Mezzanine Cards for rapid prototyping and expansion
- Reference Kits: Complete system demonstrations for specific applications
Complementary Products:
- Configuration Devices: Dedicated memory solutions for FPGA configuration
- Power Management: Optimized power supply solutions
- Connectivity Solutions: High-speed interface and protocol IP
Environmental & Export Classifications
The XC6VHX250T-3FFG1154C meets stringent environmental and regulatory requirements for commercial and industrial applications:
Environmental Compliance:
- RoHS Compliant: Meets European Union Restriction of Hazardous Substances directive
- REACH Regulation: Complies with EU chemical safety requirements
- Halogen-Free: Available in halogen-free package options for environmentally sensitive applications
- Pb-Free: Lead-free soldering and assembly processes supported
Operating Specifications:
- Temperature Range: 0ยฐC to +85ยฐC junction temperature (commercial grade)
- Humidity: Up to 85% relative humidity (non-condensing)
- Altitude: Operational up to 2000 meters above sea level
- Shock and Vibration: Meets JEDEC standards for mechanical reliability
Export Classifications:
- ECCN: Export Control Classification Number as designated by US Commerce Department
- HTS Code: Harmonized Tariff Schedule classification for international trade
- Country of Origin: Manufacturing location and associated trade implications
The XC6VHX250T-3FFG1154C is subject to export control regulations and may require appropriate licenses for shipment to certain destinations. Consult with Xilinx or authorized distributors for specific export compliance requirements and documentation.
The XC6VHX250T-3FFG1154C represents the pinnacle of FPGA technology, combining exceptional performance with comprehensive development support. This versatile solution enables designers to implement complex, high-performance systems across a wide range of demanding applications.
