Product Specifications
Core Architecture
The XC6VHX255T-1FFG1155C features a robust architecture built on 40nm process technology. This FPGA delivers 255,000 logic cells with advanced DSP capabilities, providing the computational density required for complex signal processing and data manipulation tasks. The device integrates 24 GTH transceivers capable of operating at speeds up to 6.6 Gbps, enabling high-bandwidth serial communication interfaces.
Package and Pin Configuration
Housed in a 1155-pin Fine-Pitch Ball Grid Array (FFG1155) package, the XC6VHX255T-1FFG1155C offers extensive I/O connectivity while maintaining a compact footprint. The commercial temperature grade (-1) ensures reliable operation across standard operating conditions, making it suitable for a wide range of industrial and commercial applications.
Memory and Processing Resources
This Virtex-6 HXT device incorporates substantial block RAM resources alongside distributed RAM, providing flexible memory architectures for diverse application requirements. The integrated DSP48E1 slices enable efficient implementation of digital signal processing algorithms, while the advanced clock management tiles support complex timing requirements.
Price
The XC6VHX255T-1FFG1155C is positioned as a premium FPGA solution, with pricing reflecting its advanced capabilities and high-performance specifications. Contact authorized Xilinx distributors for current pricing information, volume discounts, and availability. Pricing typically varies based on order quantity, delivery requirements, and regional market conditions.
Documents & Media
Technical Documentation
Comprehensive technical resources support the XC6VHX255T-1FFG1155C implementation process. The official datasheet provides detailed electrical specifications, timing parameters, and package information. User guides offer implementation guidance, while application notes demonstrate best practices for specific use cases.
Design Tools and IP
Xilinx Vivado Design Suite provides complete design flow support for the XC6VHX255T-1FFG1155C, including synthesis, implementation, and debugging capabilities. Pre-verified IP cores accelerate development timelines, while reference designs showcase optimal implementation strategies for common applications.
Related Resources
Development Boards
Several evaluation and development platforms support the XC6VHX255T-1FFG1155C, enabling rapid prototyping and system validation. These boards typically include essential support circuitry, connectivity options, and debugging interfaces to streamline the development process.
Software Tools
The complete Xilinx tool chain supports XC6VHX255T-1FFG1155C development, from initial design entry through final bitstream generation. Simulation tools enable thorough design verification, while timing analysis tools ensure performance requirements are met across all operating conditions.
Training and Support
Xilinx provides comprehensive training resources covering FPGA design methodologies, tool usage, and application-specific implementation techniques. Technical support services offer expert assistance throughout the development lifecycle, from initial concept through production deployment.
Environmental & Export Classifications
Operating Conditions
The XC6VHX255T-1FFG1155C operates reliably across commercial temperature ranges, with specified performance characteristics maintained throughout the operating envelope. Power consumption specifications enable accurate thermal management system design, while supply voltage tolerances accommodate various system architectures.
Environmental Compliance
This FPGA meets stringent environmental standards, including RoHS compliance for lead-free manufacturing processes. The device undergoes comprehensive qualification testing to ensure reliability in diverse operating environments, from controlled laboratory conditions to harsh industrial applications.
Export Control Classification
The XC6VHX255T-1FFG1155C is subject to applicable export control regulations. Customers must ensure compliance with relevant export control laws and regulations when incorporating this device into their systems or when shipping products containing this component to international destinations.
The XC6VHX255T-1FFG1155C delivers the performance, flexibility, and reliability required for next-generation electronic systems. Its combination of high-speed transceivers, substantial logic resources, and comprehensive development tool support makes it an optimal choice for applications demanding both processing power and connectivity bandwidth.
