Product Specifications
The XC6VHX380T-1FF1154C features robust technical specifications that set it apart in the FPGA market. This device incorporates 380,000 logic cells with advanced 40nm CMOS technology, providing exceptional power efficiency and performance optimization. The FPGA includes 1,200 DSP48E1 slices for high-speed arithmetic operations and 1,632 36Kb block RAMs totaling approximately 58.6 Mb of internal memory.
Key specifications of the XC6VHX380T-1FF1154C include a FlipGrid BGA package (FF1154) with 1,154 pins, operating at commercial temperature ranges from 0ยฐC to +85ยฐC. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, and high-speed serial connectivity through integrated GTH transceivers capable of speeds up to 6.6 Gbps. The -1 speed grade ensures optimal timing performance for critical path applications.
The XC6VHX380T-1FF1154C incorporates advanced clock management units (CMTs) with phase-locked loops (PLLs) and digital clock managers (DCMs) for precise timing control. Memory controller blocks support DDR3, DDR2, QDR II+, and RLDRAM II interfaces, enabling seamless integration with various memory architectures.
Price
Pricing for the XC6VHX380T-1FF1154C varies based on quantity, distribution channel, and current market conditions. As a high-end FPGA solution, the XC6VHX380T-1FF1154C typically commands premium pricing reflecting its advanced capabilities and specialized applications. Contact authorized Xilinx distributors or sales representatives for current pricing information, volume discounts, and availability status.
Educational institutions and qualifying research organizations may be eligible for academic pricing programs. Long-term supply agreements and design-win programs may offer additional cost optimization opportunities for high-volume applications.
Documents & Media
Comprehensive technical documentation supports the XC6VHX380T-1FF1154C implementation and development process. The official datasheet provides detailed electrical characteristics, timing specifications, and packaging information essential for design planning. User guides cover architecture overview, configuration procedures, and best practices for optimal performance.
Application notes demonstrate specific use cases and design techniques for the XC6VHX380T-1FF1154C, including high-speed serial communication implementations, DSP algorithm optimization, and power management strategies. PCB design guidelines ensure proper signal integrity and thermal management in system implementations.
Development tools documentation covers ISE Design Suite compatibility, ChipScope Pro debugging capabilities, and IP core integration procedures. White papers explore advanced topics such as partial reconfiguration, clock domain crossing techniques, and system-level optimization strategies specific to the XC6VHX380T-1FF1154C architecture.
Related Resources
The XC6VHX380T-1FF1154C ecosystem includes comprehensive development tools and support resources. Xilinx ISE Design Suite provides complete design entry, synthesis, implementation, and verification capabilities optimized for Virtex-6 HXT devices. ChipScope Pro analyzer enables real-time debugging and system verification directly within the FPGA fabric.
IP core libraries accelerate development with pre-verified functions including memory controllers, communication protocols, DSP algorithms, and interface standards. Reference designs demonstrate proven implementations for common applications such as software-defined radio, video processing, and network packet processing.
Development boards featuring the XC6VHX380T-1FF1154C provide rapid prototyping platforms with extensive connectivity options, memory interfaces, and peripheral support. Training courses and webinars offer technical knowledge transfer for design teams implementing XC6VHX380T-1FF1154C solutions.
Environmental & Export Classifications
The XC6VHX380T-1FF1154C meets stringent environmental and regulatory standards for commercial and industrial applications. RoHS compliance ensures lead-free manufacturing processes and environmental responsibility. The device operates reliably across commercial temperature ranges with proper thermal management and power supply design.
Export classification for the XC6VHX380T-1FF1154C follows applicable international trade regulations and may require export licenses for certain destinations or applications. Consult current export control documentation and legal requirements for specific deployment scenarios, particularly in aerospace, defense, or dual-use applications.
Quality certifications include ISO 9001 manufacturing standards and automotive-grade reliability testing where applicable. The XC6VHX380T-1FF1154C undergoes comprehensive qualification testing including temperature cycling, humidity exposure, and accelerated aging to ensure long-term reliability in demanding operating environments.
Environmental impact considerations include power consumption optimization features, recyclable packaging materials, and end-of-life disposal guidelines. The XC6VHX380T-1FF1154C design incorporates advanced power management capabilities to minimize energy consumption while maintaining peak performance levels.
