Product Specifications
Core Architecture
The XC6VHX380T-2FF1923C features Xilinx’s proven 40nm CMOS technology, providing an optimal balance of performance, power efficiency, and cost-effectiveness. This FPGA integrates 380,000 logic cells with advanced DSP capabilities and high-speed serial connectivity.
Key Technical Specifications
- Logic Cells: 380,160 logic cells for complex digital designs
- CLB Slices: 59,400 configurable logic block slices
- DSP48E1 Slices: 864 dedicated DSP slices for high-performance arithmetic operations
- Block RAM: 1,344 blocks (48.2 Mb total memory)
- Package Type: FF1923 (Fine-pitch Ball Grid Array)
- Speed Grade: -2 (commercial temperature range)
- I/O Pins: Up to 720 user I/O pins
- GTX Transceivers: 24 high-speed serial transceivers supporting up to 6.6 Gbps
- Operating Temperature: 0ยฐC to +85ยฐC (commercial grade)
- Supply Voltage: Multiple voltage domains (1.0V core, 1.8V/2.5V/3.3V I/O)
Performance Characteristics
The XC6VHX380T-2FF1923C delivers exceptional performance with its advanced architecture, supporting complex algorithms and high-bandwidth applications. The integrated GTX transceivers enable high-speed serial communication protocols including PCIe, SATA, and custom high-speed interfaces.
Price
Pricing for the XC6VHX380T-2FF1923C varies based on quantity, distribution channel, and market conditions. Contact authorized Xilinx distributors for current pricing information. Volume discounts are typically available for production quantities. The XC6VHX380T-2FF1923C represents a premium FPGA solution with pricing reflecting its advanced capabilities and high logic density.
Documents & Media
Technical Documentation
- Datasheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation guidelines and best practices
- Package Information: Detailed pinout diagrams and mechanical specifications
- Migration Guide: Instructions for upgrading from previous Virtex generations
- Application Notes: Design implementation examples and optimization techniques
Development Resources
- Vivado Design Suite: Latest FPGA design software supporting the XC6VHX380T-2FF1923C
- Reference Designs: Pre-validated IP cores and example implementations
- Evaluation Boards: Development platforms featuring the XC6VHX380T-2FF1923C
- Simulation Models: SPICE and behavioral models for system-level simulation
Related Resources
Compatible IP Cores
The XC6VHX380T-2FF1923C supports extensive IP core libraries including:
- High-speed communication protocols (PCIe, Ethernet, SRIO)
- Digital signal processing functions (FFT, FIR filters)
- Video and image processing algorithms
- Memory controllers (DDR3, QDR-II+)
- Processor cores (MicroBlaze soft processor)
Development Tools
- ISE Design Suite: Complete FPGA development environment
- ChipScope Pro: Real-time debugging and analysis tools
- System Generator: MATLAB/Simulink integration for DSP applications
- EDK (Embedded Development Kit): Embedded processor design tools
Evaluation Platforms
Several evaluation boards feature the XC6VHX380T-2FF1923C, providing complete development platforms with high-speed connectivity, memory interfaces, and expansion capabilities for rapid prototyping and system validation.
Environmental & Export Classifications
Environmental Compliance
The XC6VHX380T-2FF1923C meets stringent environmental standards:
- RoHS Compliant: Lead-free manufacturing process
- REACH Regulation: Compliant with European chemical safety requirements
- Conflict Minerals: Sourced from verified conflict-free suppliers
- Green Package: Environmentally friendly packaging materials
Export Control Information
- ECCN (Export Control Classification Number): 3A001.a.2
- HTS (Harmonized Tariff Schedule): 8542.31.0001
- Country of Origin: Manufactured in accordance with international trade regulations
- Export Restrictions: Subject to export administration regulations (EAR)
Quality and Reliability
The XC6VHX380T-2FF1923C undergoes rigorous quality testing including:
- Temperature cycling and thermal shock testing
- Electrostatic discharge (ESD) qualification
- Latch-up immunity verification
- Long-term reliability assessment (HTOL, HTGB)
Package and Handling
The FF1923 package provides robust mechanical characteristics with proper handling procedures recommended to maintain device integrity. Anti-static precautions are essential during handling and assembly processes.
The XC6VHX380T-2FF1923C represents Xilinx’s commitment to delivering high-performance FPGA solutions for the most demanding applications, combining advanced technology with proven reliability and comprehensive development support.
