COB (Chip-on-Board) Assembly is an advanced electronic packaging technology that directly mounts and interconnects semiconductor chips onto a printed circuit board substrate without traditional packaging. This innovative approach eliminates the need for individual chip packages, creating a more compact, efficient, and cost-effective solution for electronic devices.
In COB assembly, bare semiconductor dies are attached directly to the PCB using conductive or non-conductive adhesives, then wire-bonded to create electrical connections between the chip and board traces. The entire assembly is typically protected with an encapsulant material to shield the delicate components from environmental factors and mechanical stress.
Key Features:
- Space Efficiency: Dramatically reduces component footprint by eliminating individual chip packages
- Enhanced Performance: Shorter interconnect paths result in improved electrical performance and reduced parasitic effects
- Thermal Management: Direct substrate contact provides superior heat dissipation compared to packaged components
- Cost Optimization: Reduces material costs by eliminating packaging steps and materials
- Design Flexibility: Enables custom layouts and mixed-technology integration on a single substrate
Technical Specifications:
- Wire bonding diameter typically ranges from 15-50 microns
- Operating temperature range: -40ยฐC to +125ยฐC (depending on encapsulant)
- Interconnect pitch capabilities down to 50 microns
- Compatible with various substrate materials including FR-4, ceramic, and flexible substrates
Applications: COB assembly is widely utilized in LED lighting systems, automotive electronics, consumer devices, telecommunications equipment, and industrial control systems where space constraints and performance requirements are critical.
This technology offers manufacturers a reliable pathway to achieve miniaturization goals while maintaining high performance standards and reducing overall system costs.
