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XC3S1500L-4FGG456C – Xilinx Spartan-3L Low Power FPGA

Original price was: $20.00.Current price is: $19.00.

Product Overview

The XC3S1500L-4FGG456C is a high-performance, low-power Field-Programmable Gate Array (FPGA) from Xilinx’s Spartan-3L family. This FPGA features 150K gates, 29952 cells, operates at 1.2V, and comes in a 456-pin FBGA package. Designed for power-sensitive applications, the XC3S1500L-4FGG456C delivers exceptional performance while maintaining reduced static current consumption compared to standard Spartan-3 devices.

1. Product Specifications

Core Features

  • Part Number: XC3S1500L-4FGG456C
  • Manufacturer: Xilinx (now AMD)
  • Family: Spartan-3L Low Power FPGA
  • System Gates: 150K gates
  • Logic Cells: 29,952 cells
  • Supply Voltage: 1.2V (1.14V to 1.26V range)
  • Speed Grade: -4
  • Package Type: 456-pin Fine-pitch Ball Grid Array (FBGA)
  • Operating Temperature: 0ยฐC to +85ยฐC (Commercial grade)
  • Process Technology: 90nm

I/O and Connectivity

  • I/O Pins: 333 I/O
  • I/O Standards: 3.3V, 2.5V, 1.8V, 1.5V, 1.2V compatible
  • Maximum Operating Frequency: Up to 630MHz internal clock

Embedded Resources

  • Configurable Logic Blocks (CLBs)
  • Block RAM memory
  • Digital Clock Managers (DCMs)
  • Dedicated multiplier blocks
  • Hibernate mode for ultra-low power consumption

Key Advantages

  • Low Power Design: Reduced static current consumption compared to standard Spartan-3 family
  • Cost-Effective: Optimized price-performance ratio for high-volume applications
  • Pin-Compatible: Identical pinout and function to standard Spartan-3 devices
  • Power Management: Advanced Hibernate mode for minimal power consumption during idle states

2. Pricing Information

The XC3S1500L-4FGG456C is available through authorized distributors and electronic component suppliers. Pricing varies based on quantity, supplier, and market conditions:

Typical Price Ranges

  • Small Quantities (1-9 units): $200-$300 per unit
  • Medium Quantities (10-99 units): $150-$250 per unit
  • Large Quantities (100+ units): $120-$200 per unit
  • Volume Pricing (1000+ units): Contact manufacturer for custom pricing

Where to Purchase

  • Authorized distributors: Digi-Key, Mouser Electronics, Arrow Electronics
  • Electronic component marketplaces: Octopart, FPGAkey
  • Regional distributors and specialty FPGA suppliers

Note: Prices are subject to market fluctuations and availability. Contact authorized distributors for current pricing and lead times.

3. Documents & Media

Technical Documentation

  • Primary Datasheet: Spartan-3L FPGA Family Data Sheet (DS100)
  • Reference Manual: Spartan-3 Complete Data Sheet (DS099) for detailed specifications
  • User Guides: Spartan-3L Configuration User Guide
  • Application Notes: Power management and design optimization guides

Design Resources

  • Development Tools: Xilinx Vivado Design Suite or ISE Design Suite
  • IP Cores: Compatible with Xilinx IP catalog
  • Reference Designs: Available through Xilinx Design Hub
  • Package Information: Pinout files, footprint recommendations, and PCB layout guidelines

Software Support

  • Design Software: Vivado Design Suite (recommended) or ISE Design Suite (legacy)
  • Simulation Tools: ModelSim, Vivado Simulator
  • Programming Tools: iMPACT, Vivado Hardware Manager

4. Related Resources

Development Platforms

  • Evaluation Boards: Various third-party development boards available
  • Starter Kits: Compatible with Spartan-3 development platforms
  • Reference Designs: Industrial control, communications, and DSP applications

Compatible Products

  • Alternative Packages: XC3S1500L-4FG320C (320-pin version)
  • Speed Variants: XC3S1500L-5FGG456C (slower speed grade)
  • Density Options: XC3S400L, XC3S1000L (smaller densities)

Technical Support

  • Design Communities: Xilinx Community Forums, AMD Developer Zone
  • Technical Documentation: Comprehensive application notes and user guides
  • Training Resources: Online tutorials and webinars for FPGA design
  • Professional Services: Design consulting and support services available

Application Areas

  • Industrial Automation: Control systems, motor drives, sensor interfaces
  • Communications: Protocol processing, signal conditioning, interface bridging
  • Medical Devices: Portable instrumentation, diagnostic equipment
  • Consumer Electronics: Audio/video processing, display controllers
  • Automotive: Infotainment systems, driver assistance applications

5. Environmental & Export Classifications

Environmental Compliance

  • RoHS Compliance: Compliant with RoHS Directive 2011/65/EU and 2015/863
  • REACH Registration: Registered under REACH regulation
  • Pb-Free: Lead-free package and assembly process
  • Halogen-Free: Available in halogen-free package options

Quality Standards

  • ISO Certification: Manufactured under ISO 9001 quality management system
  • Automotive Grade: AEC-Q100 qualified versions available for automotive applications
  • Reliability Testing: Comprehensive qualification and reliability testing performed

Export Classifications

  • ECCN (Export Control Classification Number): Subject to U.S. export regulations
  • Country of Origin: Manufactured in various global facilities
  • Trade Compliance: Adherence to international trade regulations and sanctions

Temperature and Environmental Ratings

  • Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
  • Storage Temperature Range: -65ยฐC to +150ยฐC
  • Humidity: 85% relative humidity (non-condensing)
  • Vibration: MIL-STD-883 compliant
  • ESD Protection: Human Body Model (HBM) and Machine Model (MM) tested

Packaging and Handling

  • Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
  • Package Marking: Compliant with industry standards for traceability
  • Anti-Static Packaging: ESD-safe packaging and handling procedures
  • Shipping Classification: Standard electronic components classification

The XC3S1500L-4FGG456C represents an excellent choice for power-conscious designs requiring the flexibility and performance of FPGA technology. Its combination of low power consumption, comprehensive I/O capabilities, and cost-effective pricing makes it ideal for a wide range of embedded applications.