The XC3S1500L-4FGG676C is a high-performance, low-power Field-Programmable Gate Array (FPGA) manufactured by AMD Xilinx. This advanced semiconductor device belongs to the renowned Spartan-3L family, specifically engineered to deliver exceptional processing capabilities while maintaining reduced power consumption compared to standard Spartan-3 variants.
Product Specifications
Core Architecture & Performance
- Family: Spartan-3L Low Power FPGA
- System Gates: 1.5 Million (1,500K)
- Logic Cells: 29,952 configurable cells
- Configurable Logic Blocks (CLBs): 3,328 CLBs
- Process Technology: 90nm CMOS
- Operating Voltage: 1.2V core voltage
- Speed Grade: -4 (630MHz maximum frequency)
Package & I/O Configuration
- Package Type: 676-Pin Fine-Pitch Ball Grid Array (FBGA)
- Package Dimensions: 27mm x 27mm
- User I/O Pins: 487 configurable I/O pins
- Package Designation: FGG676C
- Temperature Grade: Commercial (0ยฐC to +85ยฐC)
Memory & Storage Features
- Total RAM Bits: 589,824 bits
- Block RAM: Embedded dual-port RAM blocks
- Distributed RAM: Available within CLBs
- Configuration Memory: SRAM-based configuration
Advanced Features
- Digital Clock Managers (DCMs): Integrated clock management
- Multiplier Blocks: Dedicated 18×18 multipliers
- Hibernate Mode: Ultra-low power sleep mode
- I/O Standards Support: LVTTL, LVCMOS, PCI, SSTL, and more
- Power Management: Advanced static current reduction technology
Price Information
The XC3S1500L-4FGG676C pricing varies based on quantity, distribution channel, and market conditions. Current inventory shows stock availability of over 4,000 pieces from various distributors, with competitive pricing available for volume orders.
Pricing Factors:
- Quantity breaks available for bulk orders
- Regional pricing variations
- Distributor-specific promotions
- Lead times may affect pricing
Availability Status:
- Multiple authorized distributors maintain stock
- New, original factory-sealed units available
- Various packaging options (tray, tube, reel)
For current pricing and availability, please contact authorized distributors or submit a request for quotation (RFQ).
Documents & Media
Technical Documentation
- Primary Datasheet: XC3S1500L-4FGG676C.pdf
- Spartan-3L Family Overview: DS099 (Reference document)
- Application Notes: Available through AMD Xilinx documentation portal
- Pin Configuration Guide: Package-specific pinout documentation
- Power Consumption Guidelines: Low-power design recommendations
Development Resources
- Design Software: Compatible with Xilinx ISE and Vivado Design Suite
- Programming Tools: Impact programming software support
- ECAD Models: Available for PCB design integration
- Simulation Models: VHDL/Verilog behavioral models
Reference Designs
- Starter Kit Compatibility: Works with various Xilinx development boards
- Example Projects: Digital signal processing, communications, and control applications
- IP Core Library: Access to Xilinx IP catalog
Related Resources
Development Platforms
- Evaluation Boards: Compatible with Spartan-3L development kits
- Third-Party Boards: Support from various hardware vendors
- Design Tools: Xilinx ISE, Vivado, and third-party synthesis tools
Technical Support
- Online Forums: Xilinx community support and discussions
- Application Engineering: Direct technical assistance available
- Training Materials: Webinars, tutorials, and documentation
- Design Services: Professional design consultation options
Alternative Products
- XC3S1500-4FGG676C: Standard Spartan-3 variant (higher power)
- XC3S1500L-4FGG456C: Same family, different package (456-pin)
- XC3S1500L-4FGG320C: Smaller package variant (320-pin)
- Spartan-3A Family: Enhanced features with additional power modes
Application Areas
- Industrial Control Systems: Process automation and monitoring
- Communications Equipment: Protocol processing and data handling
- Medical Devices: Signal processing and control applications
- Automotive Electronics: Engine control and safety systems
- Consumer Electronics: Digital signal processing applications
Environmental & Export Classifications
Environmental Specifications
- Operating Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Non-condensing, up to 85% RH
- Altitude: Up to 2000 meters operational
- Vibration Resistance: Compliant with JEDEC standards
RoHS Compliance
- RoHS Status: Lead-free package available
- Environmental Standards: Compliant with EU RoHS directive
- Material Composition: Halogen-free options available
- Recycling Information: Semiconductor recycling guidelines apply
Export Control Classification
The XC3S1500L-4FGG676C is subject to U.S. export control regulations under the Export Administration Regulations (EAR).
Classification Details:
- Jurisdiction: U.S. Department of Commerce, Bureau of Industry and Security (BIS)
- Likely Classification: May be classified under Category 3 (Electronics) of the Commerce Control List
- ECCN Determination: Specific Export Control Classification Number (ECCN) should be verified with manufacturer
- EAR99 Possibility: May qualify for EAR99 designation for certain applications
Export Considerations:
- Export licensing requirements vary by destination country
- End-user verification may be required for certain destinations
- Military or dual-use applications may require additional licensing
- Consult with export compliance specialists for specific requirements
Trade Compliance
- Country of Origin: Manufacturing location varies by production lot
- HS Code: Harmonized System classification for customs purposes
- Certificate of Origin: Available upon request for trade documentation
- Anti-Counterfeiting: Purchase only from authorized distributors
Important Note: Export control regulations are subject to change. Always verify current export requirements with the U.S. Department of Commerce Bureau of Industry and Security (BIS) or consult with qualified export compliance professionals before international shipment.
The XC3S1500L-4FGG676C represents AMD Xilinx’s commitment to delivering high-performance, low-power FPGA solutions for demanding applications across multiple industries. Its advanced architecture, comprehensive I/O capabilities, and power-efficient design make it an ideal choice for modern electronic systems requiring flexible, programmable logic capabilities.
