The XCKU15P-L1FFVA1156I is a powerful field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in data center acceleration, wireless infrastructure, and high-performance computing.
Product Specifications
The XCKU15P-L1FFVA1156I features advanced 16nm FinFET+ technology, providing an optimal balance of performance, power efficiency, and cost-effectiveness. This FPGA delivers:
Core Architecture:
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 914,000
- CLB LUTs: 457,000 6-input lookup tables
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 59.6 Mb of UltraRAM memory
- DSP Slices: 1,968 DSP48E2 slices for signal processing
Connectivity & I/O:
- Package: FFVA1156 (35mm ร 35mm flip-chip fine-pitch BGA)
- Total I/O Pins: 832 user I/O pins
- High-Speed Transceivers: 32 GTY transceivers supporting up to 32.75 Gbps
- PCIe Support: PCIe Gen3 x16 and PCIe Gen4 x8 interfaces
Performance Characteristics:
- Speed Grade: -1L (low-power variant)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Core Voltage: 0.85V typical
- Maximum Operating Frequency: Up to 650 MHz fabric performance
The XCKU15P-L1FFVA1156I integrates hardened IP blocks including PCIe Gen3/Gen4 controllers, 150G Interlaken, 100G Ethernet MAC, and advanced security features with built-in AES and SHA authentication engines.
Price
Pricing for the XCKU15P-L1FFVA1156I varies based on quantity, lead time, and supplier. Contact authorized AMD Xilinx distributors for current pricing and availability. Volume pricing typically ranges from $3,000 to $5,000 per unit, with evaluation samples available through AMD Xilinx direct sales channels.
Factors affecting XCKU15P-L1FFVA1156I pricing include:
- Order quantity and volume discounts
- Lead time requirements
- Geographic region and distribution channel
- Package and testing options
- Long-term supply agreements
Documents & Media
Technical Documentation:
- XCKU15P-L1FFVA1156I Product Brief and Datasheet
- Kintex UltraScale+ FPGAs Data Sheet (DS892)
- UltraScale+ FPGAs Memory Interface Solutions (DS1156)
- Package and Pinout Specifications
- Power and Thermal Design Guidelines
Development Resources:
- Vivado Design Suite compatibility guide for XCKU15P-L1FFVA1156I
- Reference designs and application notes
- Hardware evaluation boards and development kits
- IP core integration guides and examples
Software Tools:
- Vivado ML Enterprise/Standard Edition support
- Vitis Unified Software Platform compatibility
- Hardware debugging and analysis tools
- Simulation and verification environments
Related Resources
Development Platforms:
- KCU116 Evaluation Board (compatible architecture)
- Custom carrier boards supporting FFVA1156 package
- FMC and PCIe development cards
IP Cores and Solutions:
- High-speed connectivity IP (Ethernet, PCIe, Aurora)
- Video and imaging processing IP cores
- Signal processing and DSP IP libraries
- Security and encryption IP blocks
Design Services:
- AMD Xilinx Alliance Program partners
- Third-party design service providers
- Training and certification programs
- Technical support and consulting services
Application Areas: The XCKU15P-L1FFVA1156I excels in data center acceleration, 5G wireless infrastructure, aerospace and defense systems, high-performance computing, and industrial automation applications requiring high-speed processing and connectivity.
Environmental & Export Classifications
Environmental Compliance:
- RoHS compliant (lead-free package)
- REACH regulation compliance
- Conflict minerals reporting template available
- Halogen-free package option
Quality Standards:
- AEC-Q100 automotive qualification available
- Military temperature grade variants (-55ยฐC to +125ยฐC)
- Space-grade radiation-tolerant versions
- Industrial quality and reliability testing
Export Control Classifications:
- ECCN (Export Control Classification Number): 3A001
- HTS (Harmonized Tariff Schedule): 8542.33.0001
- Country of Origin: Various (check specific lot)
- Export licensing requirements may apply
Packaging and Handling:
- MSL (Moisture Sensitivity Level): Level 3
- ESD sensitive device – proper handling required
- Tray and tape-and-reel packaging options
- Storage temperature: -55ยฐC to +150ยฐC
The XCKU15P-L1FFVA1156I represents cutting-edge FPGA technology, combining high performance, power efficiency, and comprehensive connectivity options for next-generation electronic systems. Its robust feature set and extensive ecosystem support make it an ideal choice for demanding applications requiring flexible, high-performance processing capabilities.
