The XCKU11P-2FFVA1156I is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and energy efficiency. This advanced FPGA delivers outstanding performance for data center acceleration, wireless infrastructure, and high-performance computing applications.
Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+ (KU11P)
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 2,928,000
- CLB LUTs: 1,464,000
- Block RAM: 38.2 Mb total block RAM
- UltraRAM: 59.6 Mb UltraRAM capacity
Processing Components
- DSP Slices: 5,472 DSP48E2 slices
- PCIe Blocks: 4 PCIe Gen3/Gen4 blocks
- Ethernet MACs: 6 x 10/25G Ethernet MACs
- SerDes: 20 GTY transceivers at 32.75 Gbps
- Hard IP: Built-in PCIe Gen4 and 100G Ethernet controllers
Package Details
- Package Type: FFVA1156 (Flip-chip Fine-pitch BGA)
- Pin Count: 1,156 pins
- Package Size: 35mm x 35mm
- Speed Grade: -2 (high performance)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
- Part Number: XCKU11P-2FFVA1156I
Power and Performance
- Operating Voltage: 0.85V core, 1.8V I/O
- Maximum Operating Frequency: Up to 741 MHz
- Power Consumption: Optimized for low power consumption
- Process Technology: 16nm FinFET+ technology
Price Information
The XCKU11P-2FFVA1156I pricing varies based on order quantity and distributor:
- Single Unit Price: Contact authorized distributors for current pricing
- Volume Pricing: Significant discounts available for quantities of 100+ units
- Development Kit: Evaluation boards available separately
- Lead Time: Standard lead times range from 12-20 weeks
- Availability: Available through authorized AMD Xilinx distributors worldwide
Note: Prices subject to change based on market conditions and order volume. Contact your local distributor for the most current XCKU11P-2FFVA1156I pricing.
Documents & Media
Technical Documentation
- Data Sheet: Complete electrical specifications and AC/DC characteristics
- User Guide: Comprehensive implementation and design guidelines
- Packaging Information: Mechanical drawings and thermal specifications
- Migration Guide: Upgrade path from previous FPGA generations
- Application Notes: Design best practices and optimization techniques
Development Resources
- Vivado Design Suite: Complete development environment
- IP Catalog: Pre-verified IP cores and reference designs
- Hardware Debug Tools: ChipScope and other debugging utilities
- Simulation Models: Behavioral and timing simulation models
- Board Design Files: Reference schematics and layout guidelines
Multimedia Resources
- Product Videos: Architecture overview and application demonstrations
- Webinar Recordings: Technical deep-dives and design workshops
- White Papers: Performance benchmarks and case studies
- Training Materials: Online courses and certification programs
Related Resources
Development Platforms
- VCU128 Evaluation Kit: Full-featured development platform for XCKU11P-2FFVA1156I
- ZCU216 Evaluation Kit: RF data converter evaluation platform
- Alveo Cards: Data center acceleration cards featuring Kintex UltraScale+
- Third-party Boards: Partner-developed carrier cards and modules
Software Tools
- Vivado ML Edition: AI-driven design optimization and implementation
- Vitis Unified Platform: Software development environment for acceleration
- PetaLinux Tools: Embedded Linux development kit
- SDK and Runtime: Application development and deployment tools
IP and Libraries
- LogiCORE IP: Verified IP portfolio including processors, interfaces, and DSP functions
- SmartConnect: Intelligent interconnect IP for system-level integration
- Video Codec Units: Hardware-accelerated video processing IP
- AI Engine Integration: Machine learning acceleration capabilities
Support Resources
- Technical Support: 24/7 support through AMD Xilinx support portal
- Community Forums: Active developer community and knowledge base
- Application Engineers: Regional support and consultation services
- Training Centers: Hands-on training facilities worldwide
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Fully compliant with RoHS directive 2011/65/EU
- REACH Regulation: Compliant with EC 1907/2006 REACH regulation
- Conflict Minerals: DRC conflict-free mineral sourcing certified
- ISO 14001: Manufactured in ISO 14001 certified facilities
- Halogen-Free: Available in halogen-free package options
Export Control Classifications
- ECCN: 3A001.a.7 (Export Control Classification Number)
- HTS Code: 8542.33.0001 (Harmonized Tariff Schedule)
- Country of Origin: Various (check specific lot markings)
- Export License: May require export license for certain destinations
- Dual-Use: Subject to dual-use export control regulations
Quality Standards
- Automotive Grade: AEC-Q100 qualified versions available
- Military Grade: MIL-PRF-38535 compliant options
- Commercial Grade: Standard commercial temperature range
- Quality Management: ISO 9001:2015 certified manufacturing
- Reliability Testing: Comprehensive qualification and reliability testing
Packaging and Shipping
- Moisture Sensitivity: MSL 3 (Moisture Sensitivity Level)
- ESD Protection: Class 1C ESD sensitive device
- Packaging Options: Tray, tape and reel, or tube packaging
- Shipping Labels: All required regulatory and safety markings
- Documentation: Certificate of compliance included with shipments
Note: The XCKU11P-2FFVA1156I specifications and availability are subject to change. Always consult the latest datasheets and contact authorized distributors for the most current information regarding this high-performance FPGA solution.
