Product Overview
The XCKU11P-2FFVE1517I is a cutting-edge Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ family, engineered to deliver exceptional performance and power efficiency for demanding applications. This advanced programmable logic device combines high-speed processing capabilities with optimal power consumption, making it the ideal choice for next-generation system designs.
1. Product Specifications
Core Architecture
- Device Family: Kintex UltraScale+ FPGA
- Manufacturer: AMD (formerly Xilinx)
- Part Number: XCKU11P-2FFVE1517I
- Technology Node: 20nm FinFET process technology
Logic Resources
- Logic Cells: 653,100 system logic cells
- Logic Blocks: 298,560 configurable logic blocks (CLBs)
- UltraRAM: 21,100 Kbit on-chip memory
- I/O Pins: 512 user I/O pins
- Maximum I/O: 1,517 total pins
Performance Specifications
- Speed Grade: -2 (industrial temperature range)
- Core Voltage: 0.825V ~ 0.876V (typical 0.85V)
- Operating Temperature: -40ยฐC to +100ยฐC (TJ)
- Maximum Frequency: Up to 933 MHz (depending on design)
Package Details
- Package Type: FCBGA-1517 (Flip Chip Ball Grid Array)
- Package Size: 1517-pin Ball Grid Array
- Mounting Type: Surface Mount Technology (SMT)
- Packaging: Tray packaging for volume applications
Advanced Features
- UltraRAM Technology: Integrated high-capacity memory blocks
- High-Speed Transceivers: Advanced serial connectivity options
- DSP Slices: Optimized digital signal processing capabilities
- Clock Management: Advanced clocking and timing resources
- Power Management: Multiple voltage domains and power optimization
2. Pricing Information
The XCKU11P-2FFVE1517I pricing varies based on quantity, distributor, and market conditions. Current market intelligence indicates:
- Manufacturer Lead Time: Approximately 25 weeks
- Availability: Active production status
- Volume Pricing: Contact authorized distributors for quantity-based pricing
- Market Position: Premium pricing tier reflecting advanced capabilities
Note: Prices fluctuate based on market demand and supply chain conditions. Contact authorized distributors for current pricing and availability.
3. Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD/Xilinx official website
- Product Brief: Comprehensive feature overview and specifications
- User Guide: Detailed implementation and design guidelines
- Reference Manual: Complete technical reference documentation
Design Resources
- CAD Models: 3D models and footprints for PCB design
- Application Notes: Design best practices and implementation guides
- White Papers: Technical deep-dives and application insights
- Errata Documents: Known issues and workaround solutions
Software Tools
- Vivado Design Suite: Primary development environment
- IP Catalog: Pre-verified intellectual property cores
- Example Designs: Reference implementations and tutorials
- Simulation Models: Behavioral and timing simulation support
4. Related Resources
Development Tools
- Vivado Design Suite: Complete FPGA design and implementation toolchain
- Vivado HLS: High-Level Synthesis for C/C++ to RTL conversion
- SDK/Vitis: Software development kit for embedded applications
- ChipScope Pro: Real-time in-system debugging and analysis
Evaluation Platforms
- Development Boards: Various evaluation and development platforms
- Reference Designs: Proven application-specific implementations
- IP Cores: Extensive library of verified intellectual property
- Third-Party Solutions: Partner ecosystem support and resources
Application Areas
- High-Performance Computing: Acceleration and parallel processing
- Communications Infrastructure: 5G/6G base stations and networking
- Signal Processing: Digital signal processing and filtering applications
- Machine Learning: AI acceleration and inference engines
- Test & Measurement: High-speed data acquisition and analysis
Support Resources
- Technical Support: Comprehensive customer support services
- Training Programs: Educational resources and certification programs
- Community Forums: Developer community and knowledge sharing
- Partner Network: Authorized distributors and design service providers
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 compliant (Lead-free)
- REACH Compliance: No SVHC (Substances of Very High Concern) as of January 15, 2019
- Conflict Minerals: Compliant with conflict minerals regulations
- Environmental Standards: Meets international environmental regulations
Export Control Classifications
- ECCN: Export Control Classification Number (contact manufacturer for specific details)
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufacturing location and origin documentation
- Export Restrictions: Subject to applicable export control regulations
Quality & Reliability
- Quality Standards: ISO 9001 certified manufacturing processes
- Reliability Testing: Comprehensive qualification and stress testing
- Product Lifecycle: Long-term availability and support commitment
- Traceability: Full component traceability and documentation
Packaging & Shipping
- Anti-Static Packaging: ESD-safe packaging and handling procedures
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) specifications
- Storage Requirements: Temperature and humidity storage guidelines
- Shipping Classifications: Proper shipping classifications and handling
Key Benefits of XCKU11P-2FFVE1517I:
- Optimal price-performance-watt balance in FinFET technology
- Advanced UltraRAM for reduced system cost
- Industrial temperature range operation
- Comprehensive development tool support
- Long-term product availability and support
For the latest specifications, pricing, and availability, consult authorized AMD distributors or visit the official AMD website.
