Product Overview
The XCKU11P-3FFVA1156E is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Kintex UltraScale+ family, delivering exceptional processing power and versatility for demanding applications. This advanced FPGA combines superior performance with cost-effectiveness, making it ideal for telecommunications, aerospace, defense, and high-performance computing applications.
1. Product Specifications
Core Architecture
- Manufacturer: AMD (formerly Xilinx)
- Series: Kintex UltraScale+ (XCKU11P)
- Speed Grade: -3 (Highest Performance)
- Logic Cells: 653,100 cells
- Technology Node: 20nm FinFET
- Core Voltage: 0.85V
Package and I/O
- Package Type: 1156-pin Flip Chip Ball Grid Array (FCBGA)
- Package Code: FFVA1156E
- Total I/O: 464 user I/O pins
- Temperature Grade: Extended (E) – Commercial temperature range
- Package Size: 35mm x 35mm
Memory and Processing
- Block RAM: High-density block RAM for data storage
- UltraRAM: On-chip UltraRAM memory for reduced BOM cost
- DSP Slices: Optimized for digital signal processing
- Maximum Operating Frequency: Up to 933MHz (typical applications)
Connectivity Features
- Transceiver Support: GTH and GTY high-speed transceivers
- Memory Interface: Support for DDR4, DDR3, and other memory standards
- PCIe Support: PCIe Gen3 and Gen4 capabilities
- Ethernet Support: 100G Ethernet cores available
Power Characteristics
- Low Power Options: Available in -2LE and -1LI variants for reduced power consumption
- Dual Voltage Operation: Can operate at 0.85V or 0.72V (L-variants)
- Advanced Power Management: Multiple power domains and sleep modes
2. Pricing Information
Current Market Pricing (2025)
- Unit Price Range: $4,200 – $5,800 (varies by distributor and quantity)
- Volume Discounts: Available for quantities of 10+, 30+, 50+, and 100+
- Lead Time: Contact distributors for current availability
- Package Format: Tray packaging standard
Authorized Distributors
- DigiKey Electronics
- Mouser Electronics
- Farnell
- Chip1Stop
- Various regional distributors worldwide
Note: Prices are subject to market fluctuation and availability. Contact authorized distributors for current pricing and lead times.
3. Documents & Media
Technical Documentation
- Product Datasheet: DS892 – Kintex UltraScale+ Data Sheet (AMD/Xilinx)
- User Guide: UG575 – UltraScale Architecture Package User Guide
- Pin Reference: Available through AMD Xilinx support portal
- Package Files: ASCII package files in TXT and CSV formats
Design Resources
- Vivado Design Suite: Primary development environment
- IP Catalog: Extensive library of pre-verified IP cores
- Reference Designs: Application-specific reference implementations
- Application Notes: Best practices and design guidelines
Software Tools
- Vivado Design Suite: Synthesis, implementation, and debugging
- SDK/Vitis: Software development for embedded applications
- ChipScope Pro: Real-time debugging and analysis
- ISE Design Suite: Legacy support (limited)
4. Related Resources
Development Platforms
- XEM8370-KU11P: Opal Kelly development board featuring XCKU11P-1FFVA1156E
- Evaluation Boards: Various third-party evaluation platforms available
- Custom Carrier Cards: Partner ecosystem for specialized applications
Compatible IP Cores
- Video Processing: H.264/H.265 encode/decode, video scaling
- Networking: Ethernet MAC, TCP/IP offload engines
- Signal Processing: FFT/IFFT, FIR filters, image processing
- Interface Controllers: PCIe, USB 3.0, SATA, DisplayPort
Application Areas
- 5G Wireless Infrastructure: Baseband processing, beamforming
- Automotive: ADAS, autonomous driving systems
- Industrial: Machine vision, robotics control
- Aerospace & Defense: Radar processing, secure communications
- Data Center: Acceleration, networking, storage
Training and Support
- AMD Xilinx University Program: Educational resources and curriculum
- Partner Training: Authorized training providers worldwide
- Community Forums: User community and technical discussions
- Technical Support: Dedicated support for registered users
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes – Lead-free package and assembly
- REACH Compliant: Meets EU REACH regulation requirements
- Conflict Minerals: AMD conflict minerals compliance statement available
- Green Initiative: Part of AMD’s environmental sustainability program
Operating Conditions
- Operating Temperature Range: 0ยฐC to +85ยฐC (Extended Commercial)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: 10% to 90% non-condensing
- Altitude: Up to 2000m operational
Export Classifications
- ECCN (Export Control Classification Number): 3A001.a.7
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to US Export Administration Regulations (EAR)
- End-Use Restrictions: Dual-use technology – certain applications may require export licenses
Quality and Reliability
- Quality Standards: ISO 9001:2015 certified manufacturing
- Reliability Testing: Extensive qualification per JEDEC standards
- Automotive Grade: AEC-Q100 qualified variants available
- Military Grade: MIL-STD variants available for defense applications
Packaging and Handling
- Moisture Sensitivity Level: MSL 3 (168 hours at 30ยฐC/60% RH)
- ESD Sensitivity: Class 2 (2kV HBM, 200V MM)
- Lead Finish: SAC305 lead-free solder balls
- Package Marking: Laser-etched part numbers and date codes
Why Choose XCKU11P-3FFVA1156E?
The XCKU11P-3FFVA1156E represents the pinnacle of mid-range FPGA technology, offering the optimal balance of performance, power efficiency, and cost-effectiveness. With its advanced 20nm FinFET technology and comprehensive feature set, this FPGA is ideal for applications requiring high computational throughput, flexible I/O capabilities, and reliable operation in demanding environments.
Whether you’re developing next-generation 5G infrastructure, implementing advanced driver assistance systems, or creating high-performance computing solutions, the XCKU11P-3FFVA1156E provides the processing power and flexibility needed to bring your innovations to market successfully.
