The XCKU11P-3FFVD900E is a cutting-edge field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in telecommunications, aerospace, defense, and high-performance computing.
Product Specifications
The XCKU11P-3FFVD900E features advanced 16nm FinFET+ technology, providing an optimal balance of performance, power efficiency, and cost-effectiveness. This FPGA incorporates 1,143,000 system logic cells and 1,968 DSP slices, making it ideal for complex signal processing and compute-intensive applications.
Key Technical Specifications:
- Logic Cells: 1,143,000 system logic cells
- Block RAM: 38.4 Mb total block RAM
- UltraRAM: 22.5 Mb distributed throughout the device
- DSP Slices: 1,968 DSP48E2 slices
- Package: FFVD900 (35mm x 35mm fine-pitch BGA)
- Speed Grade: -3 (highest performance grade)
- I/O Pins: 520 user I/O pins
- Transceivers: 16 GTY transceivers supporting up to 32.75 Gbps
The XCKU11P-3FFVD900E operates with a core voltage of 0.85V and supports multiple I/O standards including LVDS, LVTTL, and high-speed differential signaling. The device features advanced clock management with up to 24 mixed-mode clock managers (MMCMs) and phase-locked loops (PLLs).
Price
Pricing for the XCKU11P-3FFVD900E varies based on order quantity, distribution channel, and current market conditions. Contact authorized distributors or AMD Xilinx directly for current pricing information. Volume discounts are typically available for production quantities.
The XCKU11P-3FFVD900E represents excellent value for applications requiring high logic density and processing capabilities, offering a competitive cost-per-performance ratio within the UltraScale+ portfolio.
Documents & Media
Essential Documentation:
- Product Brief and Datasheet (DS892)
- Kintex UltraScale+ FPGAs Product Selection Guide
- UltraScale+ Architecture User Guide (UG573)
- Package and Pinout Specifications
- Power and Thermal Design Guidelines
Development Resources:
- Vivado Design Suite compatibility information
- Reference designs and application notes
- Getting started guides for new users
- Migration guides from previous FPGA families
Technical Support Materials:
- Errata documents and silicon revision notes
- Characterization reports and performance data
- PCB design guidelines and layout recommendations
Related Resources
Development Tools: The XCKU11P-3FFVD900E is fully supported by AMD Xilinx’s Vivado Design Suite, providing comprehensive tools for design entry, synthesis, implementation, and debugging. Vitis unified software platform enables software developers to optimize applications for this FPGA.
Evaluation Platforms: Several evaluation boards and development kits feature the XCKU11P-3FFVD900E, allowing engineers to quickly prototype and validate designs before committing to custom hardware development.
IP Portfolio: Access to hundreds of verified IP cores optimized for the XCKU11P-3FFVD900E, including signal processing functions, connectivity interfaces, and memory controllers. These IP blocks accelerate development time and ensure reliable operation.
Training and Support: Comprehensive training programs, online tutorials, and technical documentation help engineers maximize the potential of the XCKU11P-3FFVD900E in their applications.
Environmental & Export Classifications
Environmental Compliance: The XCKU11P-3FFVD900E meets RoHS (Restriction of Hazardous Substances) compliance requirements and is manufactured using environmentally responsible processes. The device is halogen-free and supports green electronics initiatives.
Operating Conditions:
- Temperature Range: -40ยฐC to +100ยฐC (commercial grade)
- Extended Temperature: Industrial grade options available
- Humidity: Non-condensing environments
- Altitude: Suitable for high-altitude applications
Export Classifications: Export control regulations may apply to the XCKU11P-3FFVD900E depending on the destination country and end-use application. Consult current export control documentation and regulations before international shipment. The device may be subject to ECCN (Export Control Classification Number) restrictions for certain applications.
Quality and Reliability: The XCKU11P-3FFVD900E undergoes rigorous testing and qualification processes, meeting automotive and industrial quality standards. The device features built-in reliability monitoring and error correction capabilities to ensure robust operation in challenging environments.
Packaging and Handling: The XCKU11P-3FFVD900E is available in moisture-sensitive packaging with appropriate handling guidelines. Anti-static precautions are required during storage, handling, and assembly processes.
The XCKU11P-3FFVD900E represents the pinnacle of FPGA technology, combining high performance, power efficiency, and comprehensive development tool support for next-generation electronic systems.
