The XCKU11P-L1FFVD900I represents cutting-edge FPGA technology from AMD Xilinx, delivering exceptional processing power and versatility for demanding applications. This Kintex UltraScale+ series device combines advanced 20nm FinFET+ technology with comprehensive I/O capabilities, making it ideal for high-performance computing, signal processing, and embedded system applications.
Product Specifications
The XCKU11P-L1FFVD900I features robust technical specifications designed for professional applications:
Core Architecture:
- Device Family: Kintex UltraScale+
- Logic Cells: 1,143,000 system logic cells
- CLB Flip-Flops: 1,451,520
- CLB LUTs: 725,760
- Block RAM: 75.9 Mb total block RAM
- UltraRAM: 360 Mb integrated UltraRAM blocks
Processing Elements:
- DSP Slices: 5,520 DSP48E2 slices
- Maximum Operating Frequency: Up to 891 MHz
- PCIe Blocks: 4 integrated PCIe Gen4 blocks
- Ethernet MACs: 4 integrated 100G Ethernet subsystems
Package Details:
- Package Type: FFVD900 (Fine-Pitch Flip Chip BGA)
- Pin Count: 900 pins
- Package Size: 31mm x 31mm
- Operating Temperature Range: Industrial (-40ยฐC to +100ยฐC)
- Speed Grade: -1L (Low Power variant)
I/O Capabilities:
- User I/O: 312 user I/O pins
- High-Performance I/O Banks: 8 HP I/O banks
- Voltage Support: 1.2V, 1.8V, 2.5V, 3.3V standards
- SerDes Transceivers: 32 GTY transceivers at 32.75 Gbps
Price Information
The XCKU11P-L1FFVD900I is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities. Contact authorized distributors for current pricing and volume discounts. Educational institutions and qualified research organizations may be eligible for special academic pricing programs.
Factors affecting price include order quantity, delivery requirements, and current market conditions. The device’s industrial temperature rating and low-power designation contribute to its value proposition for mission-critical applications.
Documents & Media
Technical Documentation:
- Product Data Sheet: Complete electrical and mechanical specifications
- User Guide: Comprehensive implementation and design guidance
- Package and Pinout Information: Detailed pin assignments and package drawings
- Power and Thermal Guidelines: Power consumption analysis and thermal management
Design Resources:
- Reference Designs: Pre-verified IP and example implementations
- Application Notes: Best practices for specific use cases
- Simulation Models: IBIS and SPICE models for signal integrity analysis
- Development Board Schematics: Hardware reference designs
Software Tools:
- Vivado Design Suite compatibility information
- IP Core documentation and licensing details
- Debugging and verification tool guides
Related Resources
Development Platforms: Compatible development boards and evaluation kits provide rapid prototyping capabilities for the XCKU11P-L1FFVD900I. These platforms include necessary power supplies, clocking resources, and I/O interfaces for immediate development start.
IP Portfolio: Extensive intellectual property library includes DSP functions, connectivity protocols, memory controllers, and processor subsystems optimized for Kintex UltraScale+ architecture.
Training and Support: Technical training courses, webinars, and comprehensive support documentation help engineers maximize the potential of the XCKU11P-L1FFVD900I in their applications.
Design Services: Professional design services and consulting support are available for complex implementations requiring specialized expertise.
Environmental & Export Classifications
Environmental Compliance: The XCKU11P-L1FFVD900I meets stringent environmental standards including RoHS compliance for lead-free manufacturing. The device incorporates halogen-free materials where applicable and follows sustainable manufacturing practices.
Operating Conditions:
- Industrial temperature range: -40ยฐC to +100ยฐC junction temperature
- Humidity tolerance: Non-condensing environments
- Altitude rating: Up to 2000 meters operational
- Vibration and shock resistance per industry standards
Export Control Information: This product may be subject to export control regulations including EAR (Export Administration Regulations) and ITAR (International Traffic in Arms Regulations) depending on the final application. Customers are responsible for determining applicable export requirements and obtaining necessary licenses.
Quality Standards: Manufactured in ISO 9001 certified facilities with comprehensive quality assurance processes. The device undergoes extensive testing including functional verification, thermal cycling, and reliability screening to ensure consistent performance across the specified operating range.
Packaging and Shipping: Anti-static packaging protects the XCKU11P-L1FFVD900I during transport and storage. Moisture sensitivity level classification ensures proper handling procedures are followed throughout the supply chain.
The XCKU11P-L1FFVD900I delivers exceptional performance for applications requiring high-speed processing, extensive I/O capabilities, and reliable operation in demanding environments. Its combination of advanced FPGA architecture, comprehensive feature set, and industrial-grade specifications makes it an ideal choice for next-generation embedded systems and high-performance computing applications.
