The XCKU11P-L2FFVD900E is a premium field-programmable gate array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, designed to deliver exceptional performance for demanding applications in aerospace, defense, communications, and high-performance computing sectors.
Product Specifications
The XCKU11P-L2FFVD900E features advanced 20nm FinFET+ technology, providing optimal power efficiency and performance density. This FPGA incorporates 1,143,000 system logic cells with 2,520 DSP slices for intensive signal processing applications. The device includes 67.6 Mb of block RAM and 312.5 Mb of UltraRAM, ensuring ample memory resources for complex designs.
Key technical specifications of the XCKU11P-L2FFVD900E include a maximum operating frequency exceeding 740 MHz, supporting high-speed data processing requirements. The device operates within a commercial temperature range and features advanced power management capabilities. The FFVD900 package provides 900 pins in a flip-chip fine-pitch BGA configuration, offering excellent thermal performance and signal integrity.
The XCKU11P-L2FFVD900E supports multiple I/O standards including DDR4, MIPI, PCIe Gen3, and 100G Ethernet, making it versatile for various system integration scenarios. Advanced clock management units and built-in security features enhance system reliability and data protection.
Price
Pricing for the XCKU11P-L2FFVD900E varies based on quantity, delivery timeline, and distributor. Enterprise customers typically receive volume discounts for bulk orders. Contact authorized AMD Xilinx distributors for current pricing, availability, and lead times. Educational institutions and research organizations may qualify for special academic pricing programs.
Documents & Media
Comprehensive technical documentation supports the XCKU11P-L2FFVD900E implementation process. The official datasheet provides detailed electrical characteristics, timing specifications, and package information. Application notes cover design best practices, power estimation guidelines, and optimization techniques specific to Kintex UltraScale+ architecture.
Reference designs and development board schematics accelerate project development timelines. Video tutorials and webinars explain advanced features and implementation strategies. The Vivado Design Suite provides complete development tools, including synthesis, implementation, and debugging capabilities optimized for the XCKU11P-L2FFVD900E.
Related Resources
The XCKU11P-L2FFVD900E ecosystem includes evaluation boards, development kits, and third-party IP cores. Compatible development platforms enable rapid prototyping and proof-of-concept validation. Xilinx Alliance Program partners offer specialized IP, design services, and application-specific solutions.
Online forums and community resources provide peer support and design guidance. Training courses cover FPGA fundamentals through advanced implementation techniques. Technical support services ensure successful project completion and troubleshooting assistance.
Environmental & Export Classifications
The XCKU11P-L2FFVD900E complies with RoHS directives and environmental regulations for lead-free manufacturing processes. The device meets automotive and industrial quality standards for harsh environment applications. Comprehensive reliability testing ensures long-term operational stability across specified temperature and voltage ranges.
Export classification information ensures compliance with international trade regulations. The XCKU11P-L2FFVD900E may be subject to export control restrictions depending on end-use applications and destination countries. Customers should verify current export requirements and obtain necessary licenses before international shipment.
Quality certifications include ISO standards and industry-specific qualifications. The device undergoes extensive testing protocols including burn-in procedures, electrical parameter validation, and package integrity verification to ensure consistent performance across production lots.
The XCKU11P-L2FFVD900E represents cutting-edge FPGA technology, combining high logic density with advanced features for next-generation system designs. Its robust architecture and comprehensive development ecosystem make it an ideal choice for performance-critical applications requiring flexibility and scalability.
