Product Overview
The XCKU13P-2FFVE900I is a high-performance Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) Kintex UltraScale+ family, engineered on advanced 20nm FinFET technology. This powerful programmable logic device delivers exceptional performance, power efficiency, and versatility for demanding applications including data centers, aerospace & defense, telecommunications, and high-frequency trading systems.
1. Product Specifications
Core Architecture
- Manufacturer: AMD (formerly Xilinx)
- Series: Kintex UltraScale+
- Part Number: XCKU13P-2FFVE900I
- Technology Node: 20nm FinFET
- Speed Grade: -2 (Medium performance grade)
- Temperature Grade: Industrial (-40ยฐC to +100ยฐC)
Logic Resources
- Logic Elements/Cells: 746,550
- Number of LABs/CLBs: 42,660
- Total RAM Bits: 70,656,000
- UltraRAM Memory: Integrated on-chip for reduced BOM cost
I/O and Package
- Total I/O Pins: 304
- Package Type: 900-FCBGA (Flip Chip Ball Grid Array)
- Package Dimensions: 31mm ร 31mm
- Ball Count: 900 balls
- Mounting Type: Surface Mount Technology (SMT)
Power Specifications
- Core Voltage (VCCINT): 0.825V to 0.876V
- Multiple Power Options: Optimized balance between performance and power consumption
- Low Power Design: Efficient power envelope for various system requirements
Performance Features
- High-Speed Transceivers: Up to 28Gbps capability
- Memory Interface Support: DDR4, RLDRAM3, QDR-IV
- Connectivity: PCIe Gen3/Gen4, 100G Ethernet cores
- DSP Processing: Advanced signal processing capabilities
2. Pricing Information
Market Pricing (Reference)
Based on current market data from authorized distributors:
- Single Unit: Approximately $3,733 – $4,200
- Volume Pricing (10+): $3,650 – $3,900
- Volume Pricing (100+): $3,343 – $3,600
Note: Prices may vary based on supplier, quantity, market conditions, and availability. Contact authorized distributors for current pricing and volume discounts.
Lead Time
- Standard Lead Time: 25 weeks (manufacturer)
- Stock Availability: Limited quantities available from distributors
- Product Status: Active production
3. Documents & Media
Technical Documentation
- Official Datasheet: AMD Kintex UltraScale+ FPGAs Data Sheet
- Product Guide: Kintex UltraScale+ FPGA Product Selection Guide
- Migration Guide: UltraScale Architecture Migration Guide
- Package Drawings: 900-FCBGA Package specifications
Design Resources
- Vivado Design Suite: Latest version compatibility
- IP Catalog: Extensive library of verified IP cores
- Reference Designs: Application-specific implementations
- Evaluation Boards: KCU116 and similar development platforms
Software Tools
- Vivado Design Suite: Primary development environment
- System Generator: Model-based design tool
- SDSoC Development Environment: System-level optimization
- Partial Reconfiguration Tools: Dynamic function updates
4. Related Resources
Development Platforms
- KCU116 Evaluation Kit: Kintex UltraScale+ development board
- Custom Evaluation Boards: Third-party development solutions
- Starter Kits: Entry-level development platforms
Companion Products
- XCKU11P Series: Lower-density alternatives
- XCKU15P Series: Higher-density options
- XCKU19P Series: Maximum density variants
Application Examples
- Data Center Acceleration: Network processing, compression, encryption
- 5G Infrastructure: Baseband processing, beamforming
- Aerospace & Defense: Radar signal processing, software-defined radio
- High-Frequency Trading: Ultra-low latency financial algorithms
- Video Processing: 4K/8K video transcoding and streaming
Technical Support
- AMD Technical Support: Direct manufacturer assistance
- Community Forums: User community and knowledge base
- Training Resources: Online courses and certification programs
- Application Notes: Detailed implementation guides
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Status: RoHS3 Compliant (Lead-free)
- REACH Certification: EU chemical regulation compliant
- Conflict Minerals: Compliant with conflict-free sourcing requirements
- Green Packaging: Environmentally responsible packaging materials
Operating Environment
- Operating Temperature Range: -40ยฐC to +100ยฐC (TJ – Junction Temperature)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Non-condensing environment recommended
- Altitude: Up to 2000m operational altitude
Export Classifications
- ECCN (Export Control Classification Number): Subject to US export regulations
- Country of Origin: Varies by manufacturing location
- Export License: May require export license for certain destinations
- Dual-Use Technology: Subject to export control regulations
Quality Standards
- ISO Certification: Manufactured under ISO quality management systems
- Automotive Grade: Not automotive qualified (industrial grade only)
- Reliability Standards: JEDEC standards compliance
- Traceability: Full supply chain traceability maintained
Package Marking
- Device Marking: Includes part number, date code, and lot information
- Anti-Static Packaging: ESD-safe packaging and handling
- Moisture Sensitivity: Level 3 (MSL-3) moisture sensitivity rating
- Storage Requirements: Dry storage in sealed moisture barrier bags
The XCKU13P-2FFVE900I represents the perfect balance of high-performance capabilities and cost-effective implementation for advanced programmable logic applications. Its combination of cutting-edge 20nm technology, extensive I/O options, and comprehensive development ecosystem makes it an ideal choice for next-generation system designs.
