The XCKU15P-1FFVA1156E is a premium field-programmable gate array (FPGA) from AMD Xilinx’s renowned Kintex UltraScale+ family. This advanced FPGA delivers exceptional performance and power efficiency, making it the ideal choice for demanding applications requiring high-speed processing, connectivity, and computational flexibility.
1. Product Specifications
Core Architecture
- FPGA Family: Kintex UltraScale+ KU15P
- Manufacturing Process: 16nm FinFET technology
- Package Type: 1156-pin FCBGA (Flip-Chip Ball Grid Array)
- Speed Grade: -1 (Industrial grade)
- Temperature Range: 0ยฐC to 100ยฐC (Commercial/Industrial)
Logic Resources
- Logic Blocks: 522,720 configurable logic blocks (CLBs)
- Macrocells: 1,143,450 equivalent macrocells
- Logic Cells: 1,143,450 logic elements
- LABs/CLBs: 65,340 logic array blocks
Memory & Storage
- Block RAM: 34.6 Mbit total RAM capacity
- UltraRAM: Integrated high-density memory blocks
- Distributed RAM: Additional distributed memory resources
- Memory Interfaces: Support for DDR4, DDR3, and other high-speed memory standards
I/O & Connectivity
- Total I/O Pins: 516 user I/O pins
- High-Speed Transceivers: Advanced GTH/GTY transceivers
- Transceiver Speed: Up to 16.3 Gb/s per channel
- I/O Standards: Support for multiple I/O voltage standards including 3.3V
- Connectivity: Optimized for 100G networking and data center applications
Performance Specifications
- Operating Frequency: Up to 667 MHz (typical applications)
- Maximum Performance: 645 MHz (speed-optimized configurations)
- DSP Slices: 2,160 dedicated DSP slices for signal processing
- Power Supply:
- Core Voltage: 0.825V to 0.876V (0.85V nominal)
- I/O Supply Voltage: 3.3V
- Low-power variants available at 0.72V
Clock Management
- Clock Resources: Mixed-Mode Clock Manager (MMCM) and Phase-Locked Loop (PLL)
- Clock Domains: Multiple independent clock domains
- Clock Distribution: Advanced clock distribution network
2. Pricing Information
The XCKU15P-1FFVA1156E is positioned as a premium FPGA solution with pricing that reflects its advanced capabilities and performance specifications. Current market pricing varies based on:
- Volume Requirements: Bulk pricing available for large quantities
- Distribution Channel: Authorized distributors offer competitive pricing
- Lead Times: Current market demand has extended lead times
- Regional Availability: Pricing may vary by geographic region
Pricing Notes:
- Product exempt from standard promotional discounts due to high demand
- Extended lead times may affect delivery schedules
- Contact authorized distributors for current pricing and availability
- Volume discounts available through major electronic component distributors
3. Documents & Media
Technical Documentation
- Official Datasheet: Comprehensive PDF datasheet available from AMD Xilinx
- Programming Guide: Vivado Design Suite programming documentation
- Pin Configuration: Detailed pinout diagrams and ball map
- Electrical Specifications: Complete DC/AC characteristics and timing specifications
- Thermal Guidelines: Package thermal characteristics and cooling requirements
Design Resources
- CAD Models: 3D models and footprint libraries for PCB design
- Reference Designs: Sample designs and application notes
- IP Cores: Compatible intellectual property cores and libraries
- Development Tools: Vivado Design Suite compatibility information
Media Resources
- Product Images: High-resolution product photography
- Package Drawings: Mechanical drawings and dimensions
- Application Diagrams: Block diagrams and system architectures
- Technical Videos: Design tutorials and implementation guides
4. Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for synthesis and implementation
- Hardware Support: Compatible with various development boards and evaluation platforms
- IP Portfolio: Access to extensive IP core library
- Programming Tools: JTAG programming and debugging interfaces
Compatible Products
- Development Boards: ZedBoard, Basys 3, Nexys4-DDR, and other evaluation platforms
- Memory Solutions: DDR4/DDR3 memory modules and controllers
- Connectivity Solutions: High-speed transceivers and communication IP
- Power Management: Compatible power supply solutions and DC-DC converters
Application Areas
- Wireless Communications: MIMO technology and 5G infrastructure
- Networking: 100G Ethernet and data center applications
- Digital Signal Processing: High-performance DSP applications
- Aerospace & Defense: Mission-critical systems and radar applications
- Industrial Automation: Real-time control and monitoring systems
- Video Processing: 4K/8K video processing and broadcasting
Technical Support
- Documentation Portal: Comprehensive online documentation library
- Community Forums: FPGA design community and technical discussions
- Application Engineers: Direct technical support from AMD Xilinx specialists
- Training Resources: Online courses and certification programs
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: RoHS3 compliant (Lead-free)
- SVHC Status: No SVHC (Substances of Very High Concern) as of January 15, 2019
- REACH Compliance: Compliant with European REACH regulations
- Environmental Rating: Commercial/Industrial temperature grade
- Halogen-Free: Meets halogen-free requirements for green manufacturing
Export Classifications
- USHTS Code: 8542390001 (US Harmonized Tariff Schedule)
- TARIC Code: 8542399000 (European customs classification)
- ECCN Classification: 3A991.d (Export Administration Regulations)
- Country of Origin: Manufacturing locations vary by supply chain requirements
- Export Restrictions: Subject to applicable export control regulations
Quality Standards
- ISO Certification: Manufactured under ISO quality management systems
- Reliability Standards: Meets JEDEC and industry reliability standards
- Temperature Grades: Available in Extended (E), Industrial (I), and Military (M) grades
- Quality Assurance: Comprehensive testing and quality control procedures
Packaging & Handling
- Package Type: Tray packaging standard
- ESD Protection: Electrostatic discharge sensitive device
- Storage Requirements: Controlled temperature and humidity storage
- Handling Procedures: Follow industry-standard ESD precautions
The XCKU15P-1FFVA1156E represents the pinnacle of FPGA technology, combining exceptional performance with power efficiency in AMD Xilinx’s advanced Kintex UltraScale+ architecture. This versatile solution enables engineers to implement complex digital designs across a wide range of high-performance applications.
