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XCKU15P-2FFVE1760I: High-Performance Kintex UltraScale+ FPGA

Original price was: $20.00.Current price is: $19.00.

Product Specification

The XCKU15P-2FFVE1760I is a cutting-edge FPGA (Field-Programmable Gate Array) from AMD Xilinx’s Kintex UltraScale+ family, engineered for high-performance computing applications. This industrial-grade device delivers exceptional processing power and versatility for demanding system designs.

Key Technical Specifications:

Logic Resources:

  • Logic Cells: 1,143,000
  • CLB LUTs: 663,360
  • CLB Flip-Flops: 1,326,720
  • Block RAM: 38.4 Mb
  • UltraRAM: 57.6 Mb

DSP and Processing:

  • DSP Slices: 1,968
  • Maximum Operating Frequency: Up to 741 MHz
  • Process Technology: 16nm FinFET+

Package and I/O:

  • Package Type: FFVE1760 (Fine-Pitch Ball Grid Array)
  • Total I/O Pins: 832
  • Speed Grade: -2 (High Performance)
  • Temperature Grade: Industrial (-40ยฐC to +100ยฐC)

Connectivity Features:

  • PCIe Gen3 x16 capability
  • 100G Ethernet support
  • High-speed serial transceivers
  • DDR4-2666 memory interface support

The XCKU15P-2FFVE1760I integrates advanced 16nm technology with UltraScale+ architecture, providing optimal power efficiency and performance for applications including data center acceleration, 5G infrastructure, aerospace systems, and high-performance computing platforms.

Price

Pricing for the XCKU15P-2FFVE1760I varies based on quantity, supplier, and market conditions. As a high-end FPGA device, expect pricing in the range of $8,000-$15,000 per unit for small quantities, with significant volume discounts available for production orders.

Contact authorized distributors or AMD Xilinx directly for current pricing, as costs fluctuate based on:

  • Order volume and commitment
  • Lead times and availability
  • Geographic region
  • Support package requirements

Documents & Media

Official Documentation:

  • Datasheet: Complete electrical and timing specifications
  • User Guide: Comprehensive implementation guidelines
  • Package Information: Mechanical drawings and pin assignments
  • Migration Guide: Compatibility information for design transitions

Development Resources:

  • Vivado Design Suite: Primary development environment
  • Reference Designs: Pre-built application examples
  • IP Catalog: Extensive library of verified IP cores
  • Simulation Models: SPICE and behavioral models

Technical Support Materials:

  • Application notes covering specific use cases
  • White papers on optimization techniques
  • Video tutorials and training materials
  • Community forums and knowledge base

All documentation is available through the AMD Xilinx support portal with regular updates ensuring access to the latest technical information.

Related Resources

Development Tools:

  • Vivado ML Edition: Advanced synthesis and implementation
  • Vitis Unified Software Platform: Application acceleration framework
  • System Generator for DSP: Model-based design environment
  • ChipScope Pro: Integrated logic analyzer

Evaluation Platforms:

  • Kintex UltraScale+ development boards
  • Reference design kits for specific applications
  • Third-party evaluation modules
  • Custom carrier board solutions

Complementary Products:

  • XCKU15P variants: Different speed grades and packages
  • Zynq UltraScale+ MPSoCs: ARM-based processing solutions
  • Versal ACAP devices: Next-generation adaptive computing
  • Memory and connectivity solutions: Supporting components

Training and Support:

  • Online training courses and certifications
  • Design methodology workshops
  • Technical webinar series
  • Regional application engineering support

Environmental & Export Classifications

Environmental Compliance:

The XCKU15P-2FFVE1760I meets stringent environmental standards:

  • RoHS Compliant: Lead-free manufacturing process
  • REACH Regulation: Compliant with European chemical safety standards
  • Conflict Minerals: Certified conflict-free sourcing
  • Green Package: Halogen-free and environmentally responsible

Operating Conditions:

  • Junction Temperature: -40ยฐC to +100ยฐC (Industrial grade)
  • Storage Temperature: -65ยฐC to +150ยฐC
  • Humidity: 5% to 85% non-condensing
  • Altitude: Up to 3,000 meters operational

Export Control Information:

  • ECCN Classification: 3A001.a.7 (US Export Administration Regulations)
  • HTS Code: 8542.33.0001
  • Country of Origin: Varies by manufacturing location
  • Export License: May require authorization for certain destinations

Quality Standards:

  • Automotive Grade: AEC-Q100 qualified variants available
  • Military/Aerospace: Extended temperature and screening options
  • ISO Certification: Manufactured in ISO 9001:2015 certified facilities
  • Reliability Testing: Comprehensive qualification and stress testing

The XCKU15P-2FFVE1760I represents the pinnacle of FPGA technology, combining exceptional performance with robust reliability for mission-critical applications across diverse industries.