1. Product Specifications
Core Architecture
- Family: Virtex-6 LXT (Low-Power, High-Performance)
- Technology Node: 40nm CMOS copper process technology
- Logic Cells: 364,032 system logic cells
- Voltage: 0.9V low-power operation
- Package: 1156-pin FCBGA (Flip-Chip Ball Grid Array)
- Package Code: FF1156
- Speed Grade: -L1 (Low-power variant)
- Temperature Grade: I (Industrial, -40ยฐC to +100ยฐC)
I/O and Connectivity
- Total I/O Pins: 600 user I/O pins
- High-Speed Serial Transceivers: 20 GTX transceivers
- Memory Interface: Support for DDR3, DDR2, QDR-II+ SRAM
- PCI Express: Integrated endpoint and root port support
Memory Resources
- Block RAM: Multiple 36Kb dual-port block RAMs
- Distributed RAM: Available through configurable logic blocks
- Configuration Memory: SRAM-based volatile configuration
Processing Capabilities
- DSP Slices: Integrated DSP48E1 slices for high-performance signal processing
- Clock Management: Multiple MMCM (Mixed-Mode Clock Manager) blocks
- Logic Fabric: Advanced Silicon Modular Block (ASMBL) architecture
2. Price Information
The XC6VLX365T-L1FF1156I is available through authorized distributors and electronic component suppliers. Pricing varies based on:
- Quantity: Volume discounts available for large orders
- Lead Time: Standard and expedited delivery options
- Market Conditions: Subject to semiconductor market fluctuations
- Distributor: Competitive pricing across multiple suppliers
Availability Status: Currently in stock at major distributors including IC-Components, Micro-Semiconductor, Censtry, and M2S1 with quantities ranging from 14 to 4,968 pieces available.
For current pricing and availability, please contact authorized distributors or request a quote through official channels.
3. Documents & Media
Official Documentation
- Datasheet: XC6VLX365T-L1FF1156I.pdf (Complete electrical and mechanical specifications)
- Virtex-6 Family Overview: DS150 datasheet covering family architecture
- Package Information: 1156-pin FCBGA package specifications and pinout
- User Guides: Application notes and design guidelines
- Selection Guide: Device comparison and selection criteria
Development Resources
- ISE Design Suite: Compatible with Xilinx ISE development environment
- Vivado Design Suite: Support for advanced design flows
- IP Cores: Extensive library of pre-verified IP blocks
- Reference Designs: Application-specific reference implementations
Technical Support
- Product Change Notifications (PCN): Device lifecycle updates
- Errata Documents: Known issues and workarounds
- Application Notes: Design best practices and optimization techniques
4. Related Resources
Development Tools
- Development Boards: Virtex-6 FPGA development platforms
- Evaluation Kits: Starter kits for rapid prototyping
- Design Software: ISE/Vivado design suites with integrated simulation
- Programming Tools: JTAG programmers and configuration utilities
Application Areas
- Digital Signal Processing: High-performance DSP implementations
- Communications Infrastructure: Base stations, routers, switches
- Aerospace & Defense: Radar, sonar, and secure communications
- High-Performance Computing: Acceleration engines and co-processors
- Medical Equipment: Imaging systems and diagnostic equipment
Compatible Devices
- XC6VLX365T-L1FF1759I: Alternative 1759-pin package option
- XC6VLX365T-L1FF1156C: Commercial temperature grade variant
- XC6VLX550T Series: Higher capacity options within Virtex-6 family
- Zynq-7000: Next-generation SoC FPGA alternatives
Technical Support Resources
- Xilinx Community Forums: Peer-to-peer technical discussions
- Application Engineers: Direct technical support from AMD Xilinx
- Training Courses: FPGA design methodology and tool training
- Webinars: Regular technical updates and design techniques
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliance: Restriction of Hazardous Substances directive compliant
- Lead-Free: Pb-free package and assembly process
- REACH Compliance: European chemical regulation compliance
- Conflict Minerals: Compliance with conflict minerals reporting requirements
Operating Conditions
- Operating Temperature: -40ยฐC to +100ยฐC (Industrial grade)
- Storage Temperature: -65ยฐC to +150ยฐC
- Humidity: Up to 85% relative humidity (non-condensing)
- Altitude: Operating up to 2000 meters above sea level
Export Control Classifications
- ECCN: Export Control Classification Number per US Department of Commerce
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Manufacturing location identification
- Export Restrictions: Compliance with international trade regulations
Package and Handling
- MSL Rating: Moisture Sensitivity Level classification
- ESD Protection: Electrostatic discharge protection requirements
- Storage: Anti-static bag packaging with proper ESD protection
- Shipping: Global express delivery via DHL, FedEx, UPS, TNT
Quality Certifications
- ISO 9001: Quality management system certification
- Automotive: AEC-Q100 qualification for automotive applications (where applicable)
- Reliability: JEDEC standard reliability testing and qualification
- Traceability: Full supply chain traceability and documentation
The XC6VLX365T-L1FF1156I represents the pinnacle of FPGA technology, combining high performance, low power consumption, and extensive connectivity options for the most demanding applications in communications, aerospace, defense, and high-performance computing markets.
