1. Product Specifications
Core Architecture
- Family: Virtex-6 LXT (Low-power, Extended feature set)
- Logic Cells: 364,032 cells for complex digital designs
- Process Technology: Advanced 40nm CMOS technology
- Operating Voltage: 0.9V low-power operation
- Package Type: 1156-pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 35 x 35mm compact form factor
- Temperature Range: 0ยฐC to +85ยฐC (Commercial grade)
Memory and DSP Resources
- Configurable Logic Blocks (CLBs): 56,880 CLBs
- Block RAM: 832 blocks (18Kb each), total 14,976 Kb
- Distributed RAM: 4,130 Kb maximum capacity
- DSP48E1 Slices: 576 dedicated DSP blocks
- Maximum User I/O: 600 pins for extensive connectivity
Advanced Features
- GTX Transceivers: 24 high-speed serial transceivers
- Clock Management: 12 Mixed-Mode Clock Managers (MMCMs)
- PCI Express: 2 integrated blocks for high-speed connectivity
- Ethernet MACs: 4 dedicated Ethernet media access controllers
- Speed Grade: -L1 (Low-power, standard performance)
Key Performance Characteristics
- Built on third-generation ASMBL (Advanced Silicon Modular Block) architecture
- Zero-delay buffering and frequency synthesis capabilities
- Input jitter filtering and phase-matched clock division
- Support for data rates up to 6.6 Gbps on GTX transceivers
- 15% lower power consumption compared to competing 40nm FPGAs
2. Pricing Information
The XC6VLX365T-L1FFG1156C is positioned as a premium FPGA solution with pricing reflecting its advanced capabilities and high-performance features. Pricing varies based on several factors:
- Quantity Breaks: Volume discounts available for orders of 100+ units
- Lead Time: Standard lead times range from 12-16 weeks
- Market Availability: Currently in production with global distribution
- Request for Quote: Contact authorized distributors for current pricing
- Warranty: Standard 365-day warranty on new, original components
Note: Pricing is subject to market conditions and availability. Contact authorized distributors for current quotes and volume pricing.
3. Documents & Media
Technical Documentation
- Product Datasheet: Comprehensive specifications and electrical characteristics
- User Guide: Detailed implementation and design guidelines
- Application Notes: Best practices for optimal performance
- Reference Designs: Pre-validated design examples and IP cores
- Errata Documents: Known issues and recommended workarounds
Design Tools and Software
- Vivado Design Suite: Primary development environment (recommended)
- ISE Design Tools: Legacy support for existing designs
- IP Core Libraries: Extensive collection of verified IP blocks
- Simulation Models: VHDL and Verilog behavioral models
- Package Files: Footprint and pinout information for PCB design
Additional Resources
- White Papers: Architecture overviews and performance analysis
- Selection Guides: Device comparison and recommendation tools
- Training Materials: Online courses and documentation
- Community Forums: Technical support and design discussions
4. Related Resources
Development Platforms
- Evaluation Boards: ML605, ML506 development platforms
- Starter Kits: Entry-level development solutions
- Reference Designs: Tested applications and IP demonstrations
- Third-Party Boards: Partner ecosystem development tools
Compatible IP Cores
- MicroBlaze: Soft processor running 200+ DMIPs
- Memory Controllers: DDR3 support up to 800 Mb/s
- Communication Interfaces: Ethernet, PCI Express, USB
- DSP Functions: FFT, FIR filters, and signal processing blocks
- Video Processing: Codec support and image processing
Technical Support
- Online Documentation: Comprehensive technical library
- Application Engineers: Direct technical assistance
- Training Programs: Certification courses and workshops
- Design Services: Professional consulting and support
- Community Resources: User forums and knowledge base
Software Compatibility
- Operating Systems: Windows, Linux support
- CAD Integration: Industry-standard EDA tool compatibility
- Programming Languages: VHDL, Verilog, SystemVerilog
- High-Level Synthesis: C/C++ to hardware compilation
5. Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Meets EU Restriction of Hazardous Substances directive
- WEEE Compliant: Waste Electrical and Electronic Equipment directive
- REACH Compliant: Registration, Evaluation, Authorization of Chemicals
- Halogen-Free: Environmentally responsible manufacturing
- Pb-Free Packaging: Lead-free solder compatibility
Quality Standards
- ISO 9001: Quality management system certification
- ISO 14001: Environmental management compliance
- IATF 16949: Automotive quality standard (where applicable)
- Military Standards: MIL-STD testing and qualification options
Export Classifications
- ECCN: Export Control Classification Number compliance
- Country of Origin: Manufacturing location documentation
- Export Licensing: International trade regulation compliance
- ITAR Status: International Traffic in Arms Regulations classification
- Dual-Use Technology: Export control considerations
Storage and Handling
- ESD Protection: Electrostatic discharge sensitive device
- Moisture Sensitivity: MSL (Moisture Sensitivity Level) classification
- Storage Temperature: -55ยฐC to +150ยฐC
- Shelf Life: Standard component aging specifications
- Packaging: Anti-static bags and moisture barrier protection
Lifecycle Information
- Product Status: Active production device
- Recommended for New Designs: Suitable for current development
- Long-Term Availability: Commitment to sustained production
- Migration Path: Upgrade options to newer device families
- End-of-Life Planning: Advanced notification for discontinuation
Contact Information: For pricing, availability, technical support, or additional documentation regarding the XC6VLX365T-L1FFG1156C, please contact your local AMD/Xilinx authorized distributor or visit the official AMD website for comprehensive product information and support resources.
