Product Specification
The XCKU15P-3FFVE1760E is a cutting-edge Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family, engineered for demanding applications requiring exceptional processing power and flexibility. This advanced FPGA delivers outstanding performance for high-bandwidth signal processing, machine learning acceleration, and complex digital signal processing applications.
Key Technical Specifications
Core Architecture:
- Part Number: XCKU15P-3FFVE1760E
- Device Family: Kintex UltraScale+
- Logic Cells: Approximately 1.5 million system logic cells
- Speed Grade: -3 (highest performance grade)
- Package Type: FFVE1760 (Fine-Pitch Ball Grid Array)
- Total I/O Pins: 832 user I/O pins
Memory and Processing Resources:
- Block RAM: 34.6 Mb total block RAM
- UltraRAM: 360 Mb of UltraRAM memory
- DSP Slices: 1,968 DSP48E2 slices for high-speed arithmetic operations
- Clock Management Tiles: 24 CMTs with advanced clocking capabilities
- PCIe Gen3/Gen4 support with up to x16 lanes
Advanced Features:
- 16nm FinFET+ process technology for optimal power efficiency
- Hardened memory controllers supporting DDR4-2666
- Integrated 100G Ethernet MAC for high-speed networking
- Security features including AES-256 encryption and authentication
Price
The XCKU15P-3FFVE1760E pricing varies based on quantity, distribution channel, and current market conditions. Contact authorized AMD Xilinx distributors for current pricing information and volume discounts. Educational institutions and qualified development programs may be eligible for special pricing considerations.
Note: Prices are subject to change based on market conditions and availability. Please consult with authorized distributors for the most current XCKU15P-3FFVE1760E pricing.
Documents & Media
Official Documentation
- Product Brief: Comprehensive overview of XCKU15P-3FFVE1760E capabilities and applications
- Datasheet: Detailed electrical specifications, timing parameters, and package information
- User Guide: Complete implementation guidelines and best practices
- PCB Design Guidelines: Board layout recommendations and signal integrity considerations
Development Resources
- Vivado Design Suite: Complete development environment for XCKU15P-3FFVE1760E projects
- IP Core Library: Extensive collection of pre-verified IP blocks
- Reference Designs: Proven implementations for common applications
- Application Notes: Specific guidance for optimal XCKU15P-3FFVE1760E utilization
Multimedia Resources
- Product demonstration videos
- Webinar recordings covering advanced features
- Case studies showcasing real-world implementations
- Technical presentation slides
Related Resources
Development Boards and Kits
- KCU116 Evaluation Board: Full-featured development platform for XCKU15P-3FFVE1760E evaluation
- ZCU216 Evaluation Kit: Advanced development platform with integrated processing system
- Custom carrier boards: Third-party solutions optimized for specific applications
Software Tools
- Vivado ML Edition: Machine learning-optimized development suite
- Vitis Unified Software Platform: Comprehensive development environment for software and hardware
- System Generator for DSP: MATLAB/Simulink integration for DSP applications
- SDAccel Development Environment: OpenCL-based acceleration platform
Technical Support
- AMD Xilinx Community Forums: Peer-to-peer technical discussions
- Technical Support Center: Official support channels and knowledge base
- Training and Certification: Educational programs for XCKU15P-3FFVE1760E development
- Professional Services: Expert consulting and design services
Environmental & Export Classifications
Environmental Compliance
The XCKU15P-3FFVE1760E meets stringent environmental standards and regulations:
RoHS Compliance: Fully compliant with EU RoHS (Restriction of Hazardous Substances) directive, ensuring environmentally responsible manufacturing without restricted materials.
Operating Conditions:
- Operating Temperature Range: 0ยฐC to +85ยฐC (commercial grade)
- Storage Temperature Range: -65ยฐC to +150ยฐC
- Humidity: 5% to 95% non-condensing
- Altitude: Up to 2000 meters above sea level
Export Classifications
ECCN (Export Control Classification Number): The XCKU15P-3FFVE1760E is subject to U.S. export control regulations. Specific ECCN classification should be verified with AMD Xilinx for current export compliance requirements.
International Trade Compliance: This product may be subject to various international trade regulations and export licensing requirements depending on the destination country and end-use application.
End-Use Restrictions: Certain applications may require additional export licenses or may be restricted under applicable export control laws and regulations.
Quality and Reliability
- Automotive Grade Options: AEC-Q100 qualified versions available for automotive applications
- Industrial Temperature Range: Extended temperature variants for harsh environment deployments
- Long-Term Availability: Guaranteed long-term supply commitment for production applications
The XCKU15P-3FFVE1760E represents the pinnacle of FPGA technology, combining exceptional performance, advanced features, and comprehensive development support to accelerate your most demanding applications from concept to production.
