Product Overview
The XCKU3P-1FFVA676E is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s Kintex UltraScale+ family. This advanced programmable logic device delivers exceptional performance and power efficiency for demanding applications including telecommunications, automotive, aerospace, and industrial automation.
Product Specifications
Core Features
- Part Number: XCKU3P-1FFVA676E
- Manufacturer: AMD (formerly Xilinx)
- Product Family: Kintex UltraScale+ FPGA
- Process Technology: 20nm
- Speed Grade: -1 (Standard performance)
- Temperature Range: Extended (0ยฐC to 100ยฐC TJ)
Technical Specifications
- Logic Cells: 355,950
- CLB Count: 20,340 Logic Array Blocks
- Total RAM Bits: 31,641,600
- I/O Count: 256 user I/O pins
- Supply Voltage: 0.825V to 0.876V (VCCINT)
- Operating Voltage: 0.85V nominal
Package Details
- Package Type: 676-pin FCBGA (Flip Chip Ball Grid Array)
- Package Size: 27mm ร 27mm
- Mounting Type: Surface Mount Technology (SMT)
- Pin Count: 676 balls
- Package Code: FFVA676
Performance Characteristics
- Maximum Operating Frequency: Up to 464 MHz
- Speed Grade: -1 (balanced performance and power)
- Memory: Enhanced UltraRAM blocks for reduced BOM cost
- Power Options: Multiple power configurations for optimal performance-to-power ratio
Price Information
The XCKU3P-1FFVA676E pricing varies by distributor and quantity:
- Small Quantity: Approximately $181 – $1,429 USD
- Volume Pricing: Contact authorized distributors for bulk pricing
- Lead Time: Typically 13 weeks standard delivery
Note: Prices are subject to market fluctuations and availability. Contact authorized distributors for current pricing and stock levels.
Documents & Media
Technical Documentation
- Official Datasheet: Available from AMD Xilinx website
- Product Brief: Kintex UltraScale+ FPGA overview
- User Guide: UG570 – UltraScale Architecture and Product Data Sheet
- Application Notes: Various application-specific design guides
Design Resources
- Reference Designs: Available through AMD Xilinx support portal
- Development Tools: Vivado Design Suite (recommended)
- IP Cores: Compatible with Xilinx IP catalog
- Pin Assignment Files: Package-specific constraint files
Media Files
- Product Images: High-resolution package photos
- Block Diagrams: Architecture overview diagrams
- Package Drawings: Mechanical specifications and dimensions
Related Resources
Development Tools
- Vivado Design Suite: Primary development environment for XCKU3P-1FFVA676E
- System Generator: Model-based design tool for DSP applications
- SDSoC: System-level design environment
- Petalinux: Embedded Linux development tools
Compatible Products
- Development Boards: KCU105, VCU108 evaluation platforms
- Programming Cables: Platform Cable USB II, Vivado Programming Cable
- Related FPGAs: XCKU5P-1FFVA676E, XCZU7EV-1FFVC1156E
Support Resources
- AMD Xilinx Forum: Community support and discussions
- Documentation Portal: Complete technical library
- Application Support: Field Application Engineers (FAE) support
- Training Resources: Online courses and certification programs
Alternative Parts
- Speed Variants: XCKU3P-2FFVA676E, XCKU3P-3FFVA676E
- Temperature Grades: XCKU3P-1FFVA676I (Industrial), XCKU3P-1FFVA676C (Commercial)
- Package Options: XCKU3P-1FFVB676E, XCKU3P-1SFVB784E
Environmental & Export Classifications
Environmental Compliance
- RoHS Compliant: Yes, lead-free package
- REACH Compliant: Meets EU chemical regulations
- Conflict Minerals: Compliant with conflict minerals regulations
- Green Package: Halogen-free and environmentally friendly
Operating Conditions
- Operating Temperature: 0ยฐC to +100ยฐC (Junction Temperature)
- Storage Temperature: -65ยฐC to +150ยฐC
- Relative Humidity: 5% to 95% non-condensing
- MSL Rating: Moisture Sensitivity Level classification available
Export Classifications
- ECCN: Export Control Classification Number – check current regulations
- HTS Code: Harmonized Tariff Schedule classification
- Country of Origin: Varies by manufacturing location
- Export Restrictions: Subject to current trade regulations
Quality Standards
- ISO 9001: Manufacturing quality management
- ISO 14001: Environmental management system
- JEDEC Standards: Compliant with industry standards
- AEC-Q100: Automotive qualification (where applicable)
Applications
The XCKU3P-1FFVA676E is ideal for:
- 5G Wireless Infrastructure: Baseband processing and radio units
- Automotive ADAS: Advanced driver assistance systems
- Industrial Automation: High-speed control and monitoring
- Aerospace & Defense: Signal processing and communications
- Data Center Acceleration: Machine learning and AI workloads
- Video & Imaging: 4K/8K video processing and computer vision
Key Benefits
- High Performance: Optimized for compute-intensive applications
- Power Efficient: Advanced power management features
- Flexible I/O: Diverse high-speed interface support
- UltraRAM: Integrated memory blocks reduce external memory requirements
- Proven Platform: Built on mature UltraScale+ architecture
- Long-term Support: Extended product lifecycle and support
For the most current specifications, pricing, and availability of the XCKU3P-1FFVA676E, please contact authorized AMD Xilinx distributors or visit the official AMD website.
